15
'21
Written on
Röhm News
15
'21
Written on
Yokogawa News
Yokogawa to Undertake Proof of Concept Test of 5G, Cloud, and AI for Remote Control of Plant Systems with NTT DOCOMO
An initiative targeting the achievement of autonomous plant control.
15
'21
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ANSYS News
H3C Semiconductor and Ansys Innovate Next-Generation Network Processor Chip for High-end Routing, 5G Backhaul, AI and Cybersecurity Applications
Ansys’ multiphysics platform enabled H3C Semiconductor engineers to speed simulation analysis time by 10x and greatly improve product reliability.
15
'21
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ST News
Digital Isolator from STMicroelectronics Boosts Performance and Reliability Using New Thick-Oxide Galvanic Isolation Technology
STMicroelectronics has begun volume production of the STISO621 dual-channel digital isolator, launching a new series of high-performance ICs for industrial applications and general optocoupler replacement.
15
'21
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HARTING News
Faster wall-mounting for connectors
Fully EMC-shielded and highly robust outdoor housings can now be rear-mounted.
15
'21
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Keysight technologies News
Keysight Delivers Multi-gigabit Automotive Ethernet Test Solutions to Ensure Standard Compliance and Enable Faster Time-to-Market
Expands automotive Ethernet software portfolio to address multi-gigabit standards that govern automotive Ethernet for the designers and validation teams of in-vehicle networks.
15
'21
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Axis Communications News
AXIS W100 Body Worn Camera wins Red Dot for high design quality
Axis Communications has been successful in the Red Dot Award: Product Design 2021. The international jury has awarded AXIS W100 Body Worn Camera the distinction “Red Dot”, which stands for high design quality.
15
'21
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TDK News
TDK announces worldwide availability of the InvenSense ICP-10125 waterproof SmartPressure platform
TDK Corporation (TSE: 6762) announces worldwide availability of the InvenSense ICP-10125, part of the SmartPressure family of the MEMS barometric pressure sensor platform. The ICP-10125 achieves the industry’s lowest pressure noise of 0.4 Pa RMS, attains the industry’s lowest power consumption of 1.3 µA, and ensures excellent temperature stability with a temperature coefficient of ±0.5 Pa/°C.
15
'21
Written on
Rohm Semiconductors News
32bit D/A Converter IC for Hi-Fi Audio Equipment
ROHM's first, most advanced MUS-IC series DAC chip enables expressive playback of classical music.
15
'21
Written on
TDK News
