18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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TDK News

Open frame buffer modules offer 380ms additional hold-up for 12V, 15V or 24V output power supplies

TDK Corporation (TSE 6762) announces the introduction of the open frame ZBM20 buffer modules with the capability to provide 380ms additional hold-up for 12V, 15V and 24V AC-DC power supplies.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Rutronik News

Immerse yourself in the world of embedded systems: Rutronik TechTalk meets embedded world 2021

Stay digital but connected: Rutronik will be presenting products and solutions for the innovation driven markets of embedded, (I) IoT, Industry 4.0, robotics, measurement, logistics, energy, medicine and biotechnology, automation and artificial intelligence at embedded world DIGITAL and as part of the successfully established TechTalk from 2 to 4 March 2021.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Gradconn News

I-PEX^® MHF^® 4L LK and MHF^® 5L options now available for GradConn Cable assemblies

GradConn expands its range of assemblies featuring MHF^® options to include the secure MHF^® 4L LK and MHF^® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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ONSEMI News

ON Semiconductor Announce New 650V Silicon Carbide MOSFETs

Superior switching and improved reliability deliver power density improvements in a variety of challenging applications.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Adlinktech News

ADLINK Technology at Embedded World 2021: Edge AI Strategy and Next-Gen Modules

Market-leading edge AI platforms and GPU computing.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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IAR Systems News

IAR Systems strengthens functional safety offering with extended standards coverage

In addition to previous certification according to IEC 61508, ISO 26262, IEC 62304, EN 50128 and EN 50657, the certified edition of IAR Embedded Workbench for Arm now covers IEC 60730, ISO 13849, IEC 62061, IEC 61511 and ISO 25119.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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TDK News

TDK offers new snap-in aluminum electrolytic capacitors with outstanding ripple current capability

Aluminum electrolytic capacitors.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Congatec News

Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC

congatec to solve ruggedization challenges of edge server and client designs.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Swindonsilicon News

Swindon Silicon Systems at Embedded World 2021

Main Theme - Smart Sensors made smarter using custom ICs and SiPs.

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17 {{ "2021-02-17T00:00:00+00:00" | date "MMM" }} '21

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Vaisala News

The Red Planet is in sight – FMI and Vaisala’s scientific measurement instruments onboard Mars rover are ready for action

NASA’s Perseverance rover, launched in July 2020, is landing on Mars on February 18. The Perseverance is carrying several scientific instruments on board, including Finnish-made humidity and pressure instrumentation.

Read more…

TDK Corporation (TSE 6762) announces the introduction of the open frame ZBM20 buffer modules with the capability to provide 380ms additional hold-up for 12V, 15V and 24V AC-DC power supplies.

GradConn expands its range of assemblies featuring MHF® options to include the secure MHF® 4L LK and MHF® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.

Superior switching and improved reliability deliver power density improvements in a variety of challenging applications.

Market-leading edge AI platforms and GPU computing.

In addition to previous certification according to IEC 61508, ISO 26262, IEC 62304, EN 50128 and EN 50657, the certified edition of IAR Embedded Workbench for Arm now covers IEC 60730, ISO 13849, IEC 62061, IEC 61511 and ISO 25119.

Aluminum electrolytic capacitors.

congatec to solve ruggedization challenges of edge server and client designs.

Main Theme - Smart Sensors made smarter using custom ICs and SiPs.

NASA’s Perseverance rover, launched in July 2020, is landing on Mars on February 18. The Perseverance is carrying several scientific instruments on board, including Finnish-made humidity and pressure instrumentation.

International

GradConn expands its range of assemblies featuring MHF^® options to include the secure MHF^® 4L LK and MHF^® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.