26
'24
Written on
ASUS News
26
'24
Written on
Trumpf News
TRUMPF to present next-generation VCSEL devices for LPO and CPO at ECOC 2024
Key innovations for the next generation of high-performance optical transceivers.
25
'24
Written on
Alphawave Semi News
Alphawave Semi and InnoLight Showcase 128Gbps PCIe Gen 7.0 over LPO at ECOC 2024
Alphawave Semi has announced an extension of its collaboration with InnoLight Technology, the leader in data center and AI networking optics, with a demonstration of next generation low power, low latency linear pluggable optics (LPO).
25
'24
Written on
CML Microcircuits News
CML launches sub-GHz band GaAs 2W linear power amplifier to ease UHF system development
CML Micro introduces the CMX90A006, a 2 W power amplifier designed for linear performance and reliability in wireless transmitter applications, extending its SµRF range of sub-GHz MMICs.
25
'24
Written on
Renesas News
Renesas Leads ADAS Innovation with Power-Efficient 4th-Generation R-Car Automotive SoCs
New R-Car V4M & V4H SoC Devices Target High-Volume L2 and L2+ ADAS Market While Maintaining Scalability and Software Reusability with Existing R-Car Devices.
25
'24
Written on
Toshiba News
TOSHIBA INTRODUCES 32GBPS 2:1 MULTIPLEXER/1:2 DEMULTIPLEXER SWITCHES FOR HIGH-SPEED SIGNALS
1-lane 2-differential channel switches support PCIe 5.0, USB4 and Thunderbolt 4 interfaces for connecting and expanding peripheral devices in PCs, server equipment, and mobile devices.
24
'24
Written on
Broadcom News
BROADCOM DELIVERS INDUSTRY-LEADING 200G/LANE DSP FOR GEN AI INFRASTRUCTURE
Sian and Sian2 DSPs enable pluggable modules with 200G/lane interfaces that are foundational to connect next-generation AI clusters.
24
'24
Written on
Nvidia News
NVIDIA AI AERIAL LAUNCHES TO OPTIMIZE WIRELESS NETWORKS, DELIVER NEW GENERATIVE AI EXPERIENCES ON ONE PLATFORM
Supporting a growing ecosystem for AI-RAN, the new platform will transform radio access network (RAN) technology into AI-driven computing infrastructure.
23
'24
Written on
Molex News
Molex Unveils VaporConnect Optical Feedthrough Modules for Enhanced Thermal Management in AI Data Centers
Molex has introduced a thermal management solution that reduces the time and cost of deploying and upgrading high-performance data centers to meet unrelenting demand for generative AI and machine learning workflows.
23
'24
Written on
Infineon News
