Vishay Intertechnology has introduced a new series of TANTAMOUNT surface-mount solid tantalum molded chip capacitors designed specifically for electronic detonation systems.
NeoCortec demonstrated the ease of creating a complete sensor to cloud solution using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet Abacus.
Telefónica and Nokia have signed a strategic agreement to accelerate the development and deployment of private 5G networks in the Spanish business environment.
Exxelia introduces groundbreaking innovations in smart magnetics technology, specifically tailored for resonant bidirectional power converters. These advancements are set to redefine efficiency and performance standards across a spectrum of applications.
Sivers Semiconductors will design and develop advanced 5G long range antenna modules that operate within the 57-71 GHz license exempt band, providing high-speed broadband communication links for track-to-train applications.