23 {{ "2026-04-23T00:00:00+00:00" | date "MMM" }} '26

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Infineon News

Quantum chip manufacturing scales in Europe

Infineon Technologies contributes industrial expertise to European quantum pilot lines to enable scalable quantum chip production and strengthen the regional semiconductor ecosystem.

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22 {{ "2026-04-22T00:00:00+00:00" | date "MMM" }} '26

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Microchip News

Microchip integrates programmable logic into low-power microcontrollers

CLB-based PIC MCUs combine hardware logic and embedded control to reduce latency, improve determinism and simplify timing-critical system design.

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22 {{ "2026-04-22T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-22T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM introduces 5th generation SiC MOSFETs for efficiency

New devices reduce on-resistance by 30% at high temperatures, improving power conversion in EVs, AI servers, and industrial systems.

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21 {{ "2026-04-21T00:00:00+00:00" | date "MMM" }} '26

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SK Hynix News

SK hynix advances AI servers with 192GB SOCAMM2 memory

High-density LPDDR5X module improves bandwidth and power efficiency for NVIDIA Vera Rubin platforms, addressing AI memory bottlenecks.

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21 {{ "2026-04-21T00:00:00+00:00" | date "MMM" }} '26

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STMicroelectronics News

High-precision dual operational amplifiers support a wide operating voltage range

ST introduces dual operational amplifiers featuring high offset stability and wide supply voltage integration for industrial and automotive signal-conditioning applications.

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17 {{ "2026-04-17T00:00:00+00:00" | date "MMM" }} '26

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Intel News

Scalable Mobile Processors for Enhanced Edge and Commercial Computing

Intel Corporation has launched the Core Series 3 mobile processors to provide advanced power efficiency and artificial intelligence capabilities for value-tier laptops and edge devices.

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17 {{ "2026-04-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-17T00:00:00+00:00" | date "longDate" }}

Congatec News

Low-Power Computer-on-Modules Integrate Dedicated Neural Processing Units

Congatec utilizes Intel Core Series 3 processors to bring high-performance artificial intelligence acceleration to cost-sensitive industrial edge applications.

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16 {{ "2026-04-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-16T00:00:00+00:00" | date "longDate" }}

Thales Group News

Thales Develops Compact PNT Receiver for Defense

New receiver integrates GNSS resilience, anti-jamming, and timing functions to maintain navigation and communication in electronic warfare scenarios.

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16 {{ "2026-04-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-16T00:00:00+00:00" | date "longDate" }}

Tria Technologies News

Tria Technologies Introduces COM-HPC Module with Edge AI Acceleration

New module integrates Intel processors with onboard AI acceleration to support real-time edge computing in industrial automation and robotics environments.

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16 {{ "2026-04-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-16T00:00:00+00:00" | date "longDate" }}

TDK News

TDK enables 1250 V DC designs with compact EMI chokes

New high-voltage common-mode choke supports compact power converters and motor drives using SiC and GaN semiconductors with improved EMI suppression and insulation performance.

Read more…

Infineon Technologies contributes industrial expertise to European quantum pilot lines to enable scalable quantum chip production and strengthen the regional semiconductor ecosystem.

CLB-based PIC MCUs combine hardware logic and embedded control to reduce latency, improve determinism and simplify timing-critical system design.

New devices reduce on-resistance by 30% at high temperatures, improving power conversion in EVs, AI servers, and industrial systems.

High-density LPDDR5X module improves bandwidth and power efficiency for NVIDIA Vera Rubin platforms, addressing AI memory bottlenecks.

ST introduces dual operational amplifiers featuring high offset stability and wide supply voltage integration for industrial and automotive signal-conditioning applications.

Intel Corporation has launched the Core Series 3 mobile processors to provide advanced power efficiency and artificial intelligence capabilities for value-tier laptops and edge devices.

Congatec utilizes Intel Core Series 3 processors to bring high-performance artificial intelligence acceleration to cost-sensitive industrial edge applications.

New receiver integrates GNSS resilience, anti-jamming, and timing functions to maintain navigation and communication in electronic warfare scenarios.

New module integrates Intel processors with onboard AI acceleration to support real-time edge computing in industrial automation and robotics environments.

New high-voltage common-mode choke supports compact power converters and motor drives using SiC and GaN semiconductors with improved EMI suppression and insulation performance.

International