31 {{ "2024-10-31T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-31T00:00:00+00:00" | date "longDate" }}

binder Connector News

Angled M5 panel mount connectors from binder

binder, a specialist in circular connectors, is expanding its product portfolio with angled M5 panel mount connectors. These are specifically designed for applications requiring highly compact and robust solutions.

Read more…

31 {{ "2024-10-31T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-31T00:00:00+00:00" | date "longDate" }}

ams OSRAM News

ams OSRAM to present innovative strength of its lighting and sensor solutions at Electronica 2024

Highlights include new generation projection-capable headlamps for automobiles, upgraded UV-C LEDs for disinfection and various sensor solutions and intelligent image recognition systems for enhanced efficiency and safety.

Read more…

30 {{ "2024-10-30T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-30T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron is presenting boards and DIN rail controllers based on i.MX8M Plus at SPS 2024

Artificial intelligence is making its way into devices and control cabinets.

Read more…

30 {{ "2024-10-30T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-30T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon at Electronica 2024: Solutions for decarbonization and digitalization

Infineon will showcase innovative solutions for clean, safe and smart mobility as well as for green and intelligent living spaces.

Read more…

30 {{ "2024-10-30T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-30T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba and MIKROE introduce motor driving board streamlining prototyping of automotive applications

Toshiba Electronics Europe GmbH has partnered with MIKROE to integrate its Smart Motor Control Driver IC into the SmartMCD TB9M003FG board, streamlining prototyping phase for automotive applications.

Read more…

30 {{ "2024-10-30T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-30T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu Achieves GCF Validation for Next Generation eCall Test Cases on LTE and 5G

Anritsu Corporation is proud to announce full support for 5G and LTE Next Generation eCall (NGeCall) validated test cases on its 5G NR Mobile Device Test Platform ME7834NR enabling GCF certification.

Read more…

29 {{ "2024-10-29T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-29T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight and ADI Partner to Develop GMSL Test Methodology

This partnership aims to enhance technology, improve interoperability, ensure compliance, and standardize test methods for automotive applications.

Read more…

29 {{ "2024-10-29T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-29T00:00:00+00:00" | date "longDate" }}

BAE SYSTEMS News

BAE Systems demonstrates M-Code signal tracking with Increment 2 GNSS receiver powered by Next-Generation ASIC

This technological breakthrough is part of the Military GPS User Equipment Increment 2 Miniature Serial Interface (MSI) program, the result of a $247 million contract received in 2020 from U.S. Space Force Space Systems Command.

Read more…

29 {{ "2024-10-29T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-29T00:00:00+00:00" | date "longDate" }}

EEPD News

E.E.P.D. presents high performance class embedded NUC SBC based on the AMD Ryzen Embedded 8000 series for AI and ML applications

E.E.P.D., solution partner for customized and standard embedded computer boards and systems based on x86 and ARM, offers the highest AI performance in the smallest space with the PROFIVE^® NUCU series.

Read more…

29 {{ "2024-10-29T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-29T00:00:00+00:00" | date "longDate" }}

ZEISS News

ZEISS Launches New Crossbeam 550 Samplefab FIB-SEM

ZEISS has announces the new ZEISS Crossbeam 550 Samplefab, a focused ion beam scanning electron microscope (FIB-SEM) optimized for fully automated preparation of transmission electron microscopy (TEM) samples (lamellae).

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

Angled M5 panel mount connectors from binder

binder, a specialist in circular connectors, is expanding its product portfolio with angled M5 panel mount connectors. These are specifically designed for applications requiring highly compact and robust solutions.

ams OSRAM to present innovative strength of its lighting and sensor solutions at Electronica 2024

Highlights include new generation projection-capable headlamps for automobiles, upgraded UV-C LEDs for disinfection and various sensor solutions and intelligent image recognition systems for enhanced efficiency and safety.

Kontron is presenting boards and DIN rail controllers based on i.MX8M Plus at SPS 2024

Artificial intelligence is making its way into devices and control cabinets.

Infineon at Electronica 2024: Solutions for decarbonization and digitalization

Infineon will showcase innovative solutions for clean, safe and smart mobility as well as for green and intelligent living spaces.

Toshiba and MIKROE introduce motor driving board streamlining prototyping of automotive applications

Toshiba Electronics Europe GmbH has partnered with MIKROE to integrate its Smart Motor Control Driver IC into the SmartMCD TB9M003FG board, streamlining prototyping phase for automotive applications.

Anritsu Achieves GCF Validation for Next Generation eCall Test Cases on LTE and 5G

Anritsu Corporation is proud to announce full support for 5G and LTE Next Generation eCall (NGeCall) validated test cases on its 5G NR Mobile Device Test Platform ME7834NR enabling GCF certification.

Keysight and ADI Partner to Develop GMSL Test Methodology

This partnership aims to enhance technology, improve interoperability, ensure compliance, and standardize test methods for automotive applications.

BAE Systems demonstrates M-Code signal tracking with Increment 2 GNSS receiver powered by Next-Generation ASIC

This technological breakthrough is part of the Military GPS User Equipment Increment 2 Miniature Serial Interface (MSI) program, the result of a $247 million contract received in 2020 from U.S. Space Force Space Systems Command.

E.E.P.D. presents high performance class embedded NUC SBC based on the AMD Ryzen Embedded 8000 series for AI and ML applications

E.E.P.D., solution partner for customized and standard embedded computer boards and systems based on x86 and ARM, offers the highest AI performance in the smallest space with the PROFIVE^® NUCU series.

ZEISS Launches New Crossbeam 550 Samplefab FIB-SEM

ZEISS has announces the new ZEISS Crossbeam 550 Samplefab, a focused ion beam scanning electron microscope (FIB-SEM) optimized for fully automated preparation of transmission electron microscopy (TEM) samples (lamellae).

International

Technical Articles

Case studies

White Paper

binder, a specialist in circular connectors, is expanding its product portfolio with angled M5 panel mount connectors. These are specifically designed for applications requiring highly compact and robust solutions.

Highlights include new generation projection-capable headlamps for automobiles, upgraded UV-C LEDs for disinfection and various sensor solutions and intelligent image recognition systems for enhanced efficiency and safety.

Artificial intelligence is making its way into devices and control cabinets.

Infineon will showcase innovative solutions for clean, safe and smart mobility as well as for green and intelligent living spaces.

Toshiba Electronics Europe GmbH has partnered with MIKROE to integrate its Smart Motor Control Driver IC into the SmartMCD TB9M003FG board, streamlining prototyping phase for automotive applications.

Anritsu Corporation is proud to announce full support for 5G and LTE Next Generation eCall (NGeCall) validated test cases on its 5G NR Mobile Device Test Platform ME7834NR enabling GCF certification.

This partnership aims to enhance technology, improve interoperability, ensure compliance, and standardize test methods for automotive applications.

This technological breakthrough is part of the Military GPS User Equipment Increment 2 Miniature Serial Interface (MSI) program, the result of a $247 million contract received in 2020 from U.S. Space Force Space Systems Command.

E.E.P.D., solution partner for customized and standard embedded computer boards and systems based on x86 and ARM, offers the highest AI performance in the smallest space with the PROFIVE® NUCU series.

ZEISS has announces the new ZEISS Crossbeam 550 Samplefab, a focused ion beam scanning electron microscope (FIB-SEM) optimized for fully automated preparation of transmission electron microscopy (TEM) samples (lamellae).

International

E.E.P.D., solution partner for customized and standard embedded computer boards and systems based on x86 and ARM, offers the highest AI performance in the smallest space with the PROFIVE^® NUCU series.