03
'24
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Enocean News
03
'24
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PickeringTest News
Pickering Interfaces Showcases Turnkey Microwave Switching Subsystems at EDS 2024
Pickering Interfaces will showcase its PXI/PXIe and LXI signal switching and simulation products, including an LXI microwave switching matrix demo, at the Engineering Design Show (EDS) 2024, stand J1, at Coventry Building Society Arena, October 9-10, 2024.
02
'24
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Würth Elektronik News
Würth Elektronik introduces its Ophelia-III radio module
The compact Ophelia-III radio module is offered as part of Würth Elektronik’s “Build Your Own Firmware” concept.
02
'24
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Eggtronic News
WaveEgg LP EVB simplifies design and reduces component for small form factor, cable-free charging of low-power devices up to 6 W
Eggtronic has unveiled a new evaluation board that allows engineers to quickly develop and prototype ultra-efficient, low-component count wireless power transfer designs for low-power applications.
02
'24
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Keysight technologies News
KEYSIGHT EXPANDS SIGNAL GENERATOR PORTFOLIO WITH NEW PORTABLE, GENERAL-PURPOSE SOLUTIONS
These new solutions provide radio frequency (RF) engineers with portable and compact tools for component and device characterization at frequencies up to 26 GHz.
01
'24
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Infineon News
Infineon introduces the industry's first 20 Gbps universal USB peripheral controller
Infineon Technologies AG announced the addition of the EZ-USB™ FX20 programmable USB peripheral controller to its EZ-USB product family.
01
'24
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TDK News
Introducing AC programmable power with the launch of the new GENESYS™ AC and GENESYS™ AC PRO
TDK Corporation announces the introduction of the TDK-Lambda brand GENESYS™ AC (GAC) and GENESYS™ AC PRO (GAC-PRO) series of 2kVA and 3kVA rated programmable AC power sources.
01
'24
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Samsung News
Samsung Launches 990 EVO Plus SSD with Enhanced Capacity and Performance via PCIe 4.0
With capacities of up to 4TB, 73% better power efficiency and random read and write speeds of 1,050K IOPS and 1,400K IOPS respectively, the 990 EVO Plus offers the best-in-class SSD experience to consumers, workers and gamers alike.
01
'24
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Alphawave Semi News
Alphawave Semi Launches First Silicon-Proven 3nm UCIe IP Subsystem with TSMC CoWoS Technology
Alphawave Semi has unveiled the availability of the industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem, built on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.
30
'24
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Baumer News
