ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter -- a web-based drag-and-drop designer tool.
On March 24, 2021, Comau's Wearable Robotics Specialist Cayla Zielinski will present the latest product in Comau's wearable exoskeleton line, MATE-XT in a webinar hosted by the Wearable Robotics Association (WearRA).
NXP Semiconductors N.V. (NASDAQ: NXPI) and Morgan Stanley & Co. LLC will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative edge processing solutions for the Industrial & IoT end-market.
CEA-Leti, a technology research institute of CEA Tech, will present 14 papers during Photonics West 2021, March 6-11, including an invited paper, "Advanced roughness characterization for 300mm Si photonics patterning & optimization".
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ams (SIX: AMS), a leading worldwide supplier of high per- formance sensor solutions, announces that it is shortlisted for three Elektra awards in recognition of recent breakthroughs made by the company in medical sensing technology.
The MAX78000 neural-network microcontroller was awarded for moving artificial intelligence to the edge without compromising performance in battery-powered IoT devices.
TOKYO—Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the “TCR5RG series” of 45 LDO regulators, all housed in a thin, compact WCSP4F package. The industry-leading[1] high ripple rejection ratio[2] of the new LDO regulators bring enhanced power stabilization to DC power lines for mobile devices, such as wearables. Volume shipments start today.