Today, Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced an update of its state-of the-art R-Car V3H system-on-chip (SoC) to deliver significantly improved deep learning performance for smart camera applications, including driver and occupant monitoring systems (DMS / OMS), automotive front cameras, surround view, and auto parking for high-volume vehicles up to Level 2+. The updated SoC combines sensor fusion on the real-time domain with up to ASIL C metrics and an architecture optimized for smart computer vision. It offers OEMs and Tier 1s a high-performance, low-power solution that supports the latest NCAP 2020 requirements as well as the roadmap to NCAP 2025 3 Stars at competitive system costs.
CEA-Leti scientists have opened a pathway to large-scale integration of Si-spin qubits using existing flip-chip processes with die-to-wafer 3D-interconnect technologies developed in-house.
Zero-backlash jaw couplings from Ruland have high dampening capabilities, can accommodate all forms of misalignment, and are highly customizable. They are well-suited for servo motors that are often used in precise positioning applications found in semiconductor, solar, medical and robotics.
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, has created a new resource site dedicated to RISC-V, an open-source instruction set architecture (ISA).