Murata Manufacturing Co., Ltd. (Head Office: Nagaokakyo City, Kyoto Prefecture, Japan; hereinafter “Murata”) has completed compatibility verification of the MCU*1 embedded Bluetooth® Module (MBN52832) (hereinafter “the Murata Module”) with VitaNet Suite, the secure IoT platform that VitaNet, Inc. (Head Office: California, USA; hereinafter "VitaNet") will begin offering in July 2020.
For industry, medicine and public infrastructure: The use of UV LEDs offers new approaches in the fields of sterilization, deep cleaning of air and water, agriculture and industrial manufacturing.
binder, one of the industry and technology leaders in the field of industrial circular connectors, has expanded its Harsh Environment Connector (HEC) series 696 with some important models. The previous product range is supplemented by flange and cable variants with built-in protective conduit adaptation.
BittWare, a Molex company, the leading supplier of enterprise-class NVMe computational storage products featuring FPGA technology, today announces the launch of the 250-M2D Accelerator Module.