18
'20
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Infineon News
18
'20
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Vector News
Bringing High-Performance into the Vehicle: Take Advantage of Everything That AUTOSAR Has to Offer with PREEvision 9.5
Modern electric/electronic systems combine the computing power needed for data-rich applications with the flexibility to improve and evolve during life time by updates and upgrades. PREEvision 9.5 helps you to develop such future-proof E/E systems based on high-performance computers and the AUTOSAR Adaptive platform. With PREEvision, you can easily integrate HPCs and AUTOSAR Adaptive into existing architectures.
18
'20
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Vision Components News
Raspi CM goes embedded vision with VC MIPI
Launching its new VC MIPI Embedded Vision Kit for the Raspberry Pi Compute Module 3 or 3+, Vision Components enables quick setup of full-fledged, industrial-grade embedded vision systems.
18
'20
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FLIR Systems Trading Belgium BVBA
FLIR Systems Releases New Blackfly S Machine Vision USB3 Camera with Sony’s Pregius S Sensor
Featuring the Newest Sony Pregius Sensor Generation, Pregius S, the Latest Blackfly S Model Provides Significantly Higher Resolution, Superior Imaging Quality, and Low-Light Performance
18
'20
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KEMET News
KEMET Advances Its Latest Environmental Sensor Solutions for Industrial Applications
Pyroelectric passive infrared (PIR) sensors allow for easy integration, configuration and more design-in possibilities.
18
'20
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Draeger News
New multi-gas detector X-act 7000
– Concentrations of hazardous substances in the ambientair at the workplace should not exceed specified limit values. Monitoring these sometimes very low values is a demanding task. The focus of the Dräger Xact 7000, in combination with the Dräger MicroTubes for different gases and vapors, is to measure carcinogenic and toxic substances in the lower ppb range.
17
'20
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TDK News
TDK announces world’s lowest-power PDM microphone, T3902
T3902 is a 64.5dB SNR/120dB AOP digital microphone in a 3.5 x 2.65 x 0.98 mm package, optimized for mobile devices, wearables, headsets, TV remotes and more.
17
'20
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Infineon News
Danfoss secures capacities for electro-mobility chips at Infineon
In view of the long-term growing market demand for power semiconductors for electric cars, Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement. Infineon will supply chipsets of IGBTs and diodes to the Danfoss Silicon Power business unit. The chips are mainly used in power modules for inverters that control the motors in electric vehicles.
17
'20
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CEA Leti News
CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process
Virtual Presentation During VLSI 2020 Details Transistors' Performance And Power-Use Advantages Versus FinFET Devices.
17
'20
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Mitsubishi Electric News
