For all industry applications that need real-time, accurate, detailed temperature data, Fluke Process Instruments provides rugged, high-performance noncontact infrared sensors and solutions.
Toshiba Electronics Europe GmbH (“Toshiba”) has leveraged its technological expertise in wide bandgap (WBC) semiconductor processes to introduce a compact but effective MOSFET module.
Softing expands its dataFEED edgeConnector product family which is based on Docker technology. The new edgeConnector 840D container supports easy access to data from SINUMERIK 840D controllers and makes it available on edge devices or virtual environments via OPC UA and MQTT. This enables flexible integration of local OPC UA clients and MQTT brokers in a cloud environment and the Industrial IoT.
GEMÜ, the valve specialist, has had a further three of its intelligent automation components certified with UL approval: The GEMÜ 1235 and GEMÜ 1236 electrical position indicators and the GEMÜ 1436 eco cPos positioner.
Molex, a leading global connectivity and electronics solutions provider, released results of a global survey of decision makers from telecom carriers exploring the “state of 5G” and the significant transformational opportunities it presents, along with its impact on deployment progress, current delivery challenges and emerging business prospects.
The HFDA801A from STMicroelectronics is a high-resolution audio amplifier that is specifically designed for compact, cost-effective automotive applications.
TTI, Inc., a leading specialty distributor of electronic components, today announced the appointment of Mike Morton to the position of Chief Executive Officer, effective immediately.