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16  '22
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CUI Devices News

CUI Devices Introduces Ultra-Compact 3 x 2 mm Tactile Switch

CUI Devices’ Switches Group has announced the introduction of one of the industry’s smallest tactile switches. Housed in an ultra-compact 3 x 2 x 0.6 mm package, the TS19 series carries an IP67 rating for dealing with moisture and environmental contaminants as well as a rugged lifecycle rating up to 300,000 cycles.

15  '22
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Vector News

VECTOR: NEW MULTI-GIG ETHERNET ADAPTER FOR PORTABLE USE

Vector presents its compact multi-gig USB-to-Ethernet adapter VN5601. The adapter is not only high performing, its compact dimensions make it ideally suited for portable use. It also offers easy connection to Vector Hardware.

15  '22
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Mouser News

Mouser Announces Launch of Sensor Design Resource Site

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, today announced the launch of a new resource site dedicated to sensor design guides.

15  '22
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Toshiba News

Toshiba Develops Transparent Photoluminescent Phosphor for LED, Sensing and Security Printing Applications

Toshiba Corporation has unveiled a technology breakthrough in photoluminescence, a novel phosphor that delivers excellent solubility in polymers or organic solvents, where it is transparent and colorless under visible light, and that emits persistent red-light emissions under UV light, with excellent color purity and a luminescence six times that of current phosphors.

15  '22
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Mitsubishi Electric News

Mitsubishi Electric to Launch "SLIMDIP-Z" Power Semiconductor Module

Mitsubishi Electric Corporation announced that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023.

15  '22
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Infineon News

MathWorks Simulink products now support Infineon’s latest AURIX TC4x family of automotive microcontrollers

Aiming at Infineon’s latest AURIX TC4x the hardware support package for MathWorks Simulink® supports automotive engineers in designing advanced electric vehicles, sensor fusion, and radar signal processing functions, even before silicon is available. With the package, the designers can validate use cases, rapidly and automatically generate the embedded software, and test algorithms.

14  '22
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Congatec News

CONGATEC: PICMG COM-HPC COMMITTEE APPROVES COM-HPC MINI PINOUT

Congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini.

14  '22
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TDK News

Exhibitions: TDK spotlights innovations for automotive, robotics, IoT, and information and communication technology at CES 2023

TDK Corporation will showcase more than 30 technology demonstrations and experiences across its component and system solution portfolio for the entire spectrum of electronics applications at the 2023 Consumer Electronics Show (CES) in Las Vegas, Nevada, from January 5th through January 8th. Additionally, TDK plans to release multiple product and partner announcements for its InvenSense brand MEMS sensors throughout the week of the conference.

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