15
'22
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Analog Devices News
15
'22
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Rohde & Schwarz
CES 2023: Rohde & Schwarz and Broadcom collaborate on Wi-Fi 7 test solution for next generation wireless devices
Rohde & Schwarz and Broadcom have successfully validated the R&S CMP180 radio communication tester for Broadcom Wi-Fi 7 chipsets. OEMs and ODMs of wireless devices can now get their first Wi-Fi 7 products ready for market.
15
'22
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Mouser News
Mouser Announces Launch of Sensor Design Resource Site
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, today announced the launch of a new resource site dedicated to sensor design guides.
15
'22
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Toshiba News
Toshiba Develops Transparent Photoluminescent Phosphor for LED, Sensing and Security Printing Applications
Toshiba Corporation has unveiled a technology breakthrough in photoluminescence, a novel phosphor that delivers excellent solubility in polymers or organic solvents, where it is transparent and colorless under visible light, and that emits persistent red-light emissions under UV light, with excellent color purity and a luminescence six times that of current phosphors.
15
'22
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Mitsubishi Electric News
Mitsubishi Electric to Launch "SLIMDIP-Z" Power Semiconductor Module
Mitsubishi Electric Corporation announced that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023.
15
'22
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Infineon News
MathWorks Simulink products now support Infineon’s latest AURIX TC4x family of automotive microcontrollers
Aiming at Infineon’s latest AURIX TC4x the hardware support package for MathWorks Simulink® supports automotive engineers in designing advanced electric vehicles, sensor fusion, and radar signal processing functions, even before silicon is available. With the package, the designers can validate use cases, rapidly and automatically generate the embedded software, and test algorithms.
14
'22
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Congatec News
CONGATEC: PICMG COM-HPC COMMITTEE APPROVES COM-HPC MINI PINOUT
Congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini.
14
'22
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TDK News
Exhibitions: TDK spotlights innovations for automotive, robotics, IoT, and information and communication technology at CES 2023
TDK Corporation will showcase more than 30 technology demonstrations and experiences across its component and system solution portfolio for the entire spectrum of electronics applications at the 2023 Consumer Electronics Show (CES) in Las Vegas, Nevada, from January 5th through January 8th. Additionally, TDK plans to release multiple product and partner announcements for its InvenSense brand MEMS sensors throughout the week of the conference.
12
'22
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Leuze
Leuze is the world market leader in the field of optical sensors
Confirmed by the annual study of the latest index of best companies conducted by the University of St. Gallen.
12
'22
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Moxa
