06 {{ "2023-09-06T00:00:00+00:00" | date "MMM" }} '23

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Tasking News

TASKING introduces a new version of Safety Checker

Safety Checker v3.0 improves usability and simplifies the process of ensuring functional safety even further.

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06 {{ "2023-09-06T00:00:00+00:00" | date "MMM" }} '23

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Leuze

Leuze is turning 60 and continues its ambitious growth

In 1963, the electronics division of the Leuze Group came into being. In 2023, the international sensor expert is celebrating its 60th anniversary.

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06 {{ "2023-09-06T00:00:00+00:00" | date "MMM" }} '23

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Toshiba News

TOSHIBA SAMPLE SOFTWARE PACKAGE EXPANDS MICROCONTROLLER DEVELOPMENT TOOLS ECOSYSTEM

Sample software for M4K MCUs now works out of the box with SEGGER Embedded Studio as well as Arm^® Keil^® MDK and IAR Embedded Workbench^® for Arm.

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05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-05T00:00:00+00:00" | date "longDate" }}

HARTING USA

3D-Circuits - Enabling 3D-Placement Of Electronic Components

Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.

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05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

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IDS Imaging Development Systems GmbH

Using technological innovation for environmental benefits

The industrial camera manufacturer IDS Imaging Development Systems GmbH from Obersulm feels responsible for keeping its ecological footprint as small as possible.

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05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

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Samsung News

SAMSUNG ELECTRONICS UNVEILS INDUSTRY’S HIGHEST-CAPACITY 12NM-CLASS 32GB DDR5 DRAM

The new product provides double the capacity of 16Gb modules within the same package size, enabling 128GB DRAM module production without the TSV process, and decreasing power consumption by 10%.

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05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

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ST News

WIRELESS MICROCONTROLLERS MAKE SINDCON SMART METERS MORE EFFICIENT AND SUSTAINABLE

STMicroelectronics announced its collaboration with Sindcon (Singapore) IoT Technology Pte Ltd, a smart meter provider based in Singapore.

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04 {{ "2023-09-04T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-04T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

Vector Photonics collaborates with Sivers Photonics to evaluate new material for next-generation lasers

Sivers Semiconductors has received an initial order from Vector Photonics for the evaluation of epitaxial material for a new, next-generation surface coupling laser project.

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04 {{ "2023-09-04T00:00:00+00:00" | date "MMM" }} '23

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ASRockInd News

ASRock Industrial introduces 4X4 BOX 7040 Series mini PC with AMD Ryzen 7040U APU

ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen 7040U Series APUs, featuring up to 8 “Zen 4” cores and 16 threads.

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01 {{ "2023-09-01T00:00:00+00:00" | date "MMM" }} '23

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Mouser News

Mouser Electronics Stocking Wide Selection of Connectivity and Location Products from u-blox

Mouser Electronics partners with u-blox, a leading manufacturer of positioning and wireless communication technologies, to support design in automotive, industrial, and consumer applications.

Read more…

Safety Checker v3.0 improves usability and simplifies the process of ensuring functional safety even further.

In 1963, the electronics division of the Leuze Group came into being. In 2023, the international sensor expert is celebrating its 60th anniversary.

Sample software for M4K MCUs now works out of the box with SEGGER Embedded Studio as well as Arm® Keil® MDK and IAR Embedded Workbench® for Arm.

Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.

The industrial camera manufacturer IDS Imaging Development Systems GmbH from Obersulm feels responsible for keeping its ecological footprint as small as possible.

The new product provides double the capacity of 16Gb modules within the same package size, enabling 128GB DRAM module production without the TSV process, and decreasing power consumption by 10%.

STMicroelectronics announced its collaboration with Sindcon (Singapore) IoT Technology Pte Ltd, a smart meter provider based in Singapore.

Sivers Semiconductors has received an initial order from Vector Photonics for the evaluation of epitaxial material for a new, next-generation surface coupling laser project.

ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen 7040U Series APUs, featuring up to 8 “Zen 4” cores and 16 threads.

Mouser Electronics partners with u-blox, a leading manufacturer of positioning and wireless communication technologies, to support design in automotive, industrial, and consumer applications.

International

Sample software for M4K MCUs now works out of the box with SEGGER Embedded Studio as well as Arm^® Keil^® MDK and IAR Embedded Workbench^® for Arm.