09
'22
Written on
Rutronik Info
09
'22
Written on
MURATA News
Compact, High Current Rated Chip Ferrite Beads Meet the Need for Greater Noise Suppression in Automotive Systems
Murata has broadened its portfolio of chip ferrite beads with the introduction of the BLM15PX_SH1 and BLM15PX_BH1 series. Supplied in a 1005 mm (0402 inch) size, these compact and rugged units are highly optimised for automobile deployment.
09
'22
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CEA Leti News
CEA-Leti Quantum Program Director, Maud Vinet, Shares the Path Towards Full Fault-Tolerant Quantum Computing with Si-Based VLSI Technologies In Plenary Talk at IEDM 2022
CEA-Leti presented three papers at IEDM 2022 detailing its recent advances and future challenges in quantum computing using Si-based qubit devices with FDSOI technologies. A plenary talk presented the path towards scalable quantum computers with silicon technology.
09
'22
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Keysight technologies News
Keysight Joins Intel Foundry Services Accelerator EDA Alliance Program
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world , announced that it has joined the Intel Foundry Services (IFS) Accelerator Electronic Design Automation (EDA) Alliance program.
09
'22
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U Blox News
u-blox announces the smallest Bluetooth Angle-of-Arrival (AoA) antenna board for commercial tracking solutions
The ANT-B11 compact antenna board offers accurate direction finding and indoor positioning supported by u-blox latest technology.
08
'22
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VSITECH News
VSI launches the first automotive industry-standard high-speed SerDes silicon
VSI, a developer of high-speed communication semiconductors for vehicles, have introduced the industry's first commercial serializer/deserializer (SerDes) solution that complies with the Automotive SerDes Alliance (ASA) standard.
08
'22
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Provertha News
New PROVERTHA M12 angle adapters for X/D conversion save space in tight installation spaces
Provertha has expanded its robust adapter solutions in protection class IP 67 with compact, angled versions, which can be used to implement angled M12 plug-in connections from X to D coding and vice versa without additional cabling.
08
'22
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ST News
STMicroelectronics boosts EV performance and driving range with new silicon-carbide power modules
Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform.
08
'22
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ST News
STMicroelectronics simplifies sustainable product design with USB Type-C® Power Delivery software for STM32 microcontrollers
STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.
08
'22
Written on
KLA News
