11
'23
Written on
TDK News
09
'23
Written on
Toshiba News
Toshiba introduces 600V-rated intelligent power devices for BLDC motor drive
New devices will significantly contribute to miniaturization in space-critical applications.
09
'23
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Rutronik Info
Rutronik introduces MLCCs from KEMET using KONNEKTTM technology, offering a unique composition with special conductivity
KEMET's KONNEKTTM technology enables the connection of multiple MLCCs to a single surface-mountable component, reducing equivalent series resistance, equivalent series inductance, and thermal resistance of capacitors without a metal frame.
09
'23
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Emergent Vision Technologies News
Emergent Vision Technologies eCapture Pro Software Now Supports GPUDirect H.265/H.264, and RTMP Streaming
Emergent Vision Technologies, announces that its eCapture Pro software now supports GPUDirect, H.265 and H.264 video codecs, and RTMP (real-time messaging protocol) streaming.
08
'23
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iBASE News
Low-Power IB838 Single Board Computer Powered by Intel Core i3 N-series Processor
IBASE Technology Inc, introduces the low-power IB838 3.5" single board computer, powered by the Intel® Core i3 N-series processor.
08
'23
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Congatec News
Congatec COM Express modules receive IEC-60068 railway certification
This certification qualifies these modules for operation in railway applications, confirming that they meet the requirements for extreme conditions such as extended temperatures, rapid temperature changes, shocks, and vibrations.
08
'23
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Rohm Semiconductors News
Focus on the Industrial Equipment Market: ROHM launches ‘Product Longevity Program’
Program Announces products and periods for long-term supply to ensure worry-free adoption in long life cycle equipment.
08
'23
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Emerson Automation Solutions
Emerson Acquisition of Afag Accelerates Factory Automation Capabilities
Acquisition expands Emerson’s factory automation offering and enhances exposure to key growth opportunities in discrete and hybrid markets.
08
'23
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Mediatek News
MEDIATEK SUCCESSFULLY DEVELOPS FIRST CHIP USING TSMC'S 3NM PROCESS
MediaTek and TSMC are taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.
08
'23
Written on
TDK News
