11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

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Kontron News

COMH-CARP AND COMH-CCAS: KONTRON ADVANCES INDUSTRIAL HIGH-PERFORMANCE COMPUTING

Kontron introduces two COM-HPC^® Clients, COMh-caRP and COMh-ccAS, based on 13th Gen Intel^® Core processors mobile and desktop version. They offer a significant increase in performance compared to the previous generation and are equipped with 14 cores up to 24 cores with Intel^® performance hybrid architecture.

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11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

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Keysight technologies News

Keysight Coordinates Pan-European 6G Testbed

The company joins forces with sixteen organizations to create 6G-SANDBOX, a pan-European testbed for 6G experimentation and validation of 5G-Advanced and 6G capabilities. As a part of 6G-SANDBOX, Keysight will act as the project coordinator.

Read more…

11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

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TDK News

TDK announces SmartBug 2.0 - A smarter digital transformation module with Machine Learning-Enabled ICM-45686-S IMU

TDK Corporation announces the InvenSense SmartBug 2.0 with various new and exciting features for consumer and IoT applications as a smart remote data-collection module for IoT after the success of the original SmartBug.

Read more…

11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

Infineon Technologies increases focus and investment into core semiconductor development for high-reliability markets; sells HiRel DC-DC converter business to Micross

Infineon Technologies AG today announced that Micross Components, Inc. (“Micross”) has entered a definitive agreement to purchase Infineon’s HiRel DC-DC converter business including its hybrid and custom board-based power products.

Read more…

11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

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Rohm Semiconductors News

ROHM’s 4th Generation SiC MOSFETs to be Used in Hitachi Astemo’s Inverters for Electric Vehicles

ROHM has recently announced the adoption of its new 4th Generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo, Ltd, a leading Japanese automotive parts manufacturer.

Read more…

11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

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CUI Devices News

CUI Devices Adds New Potentiometers Product Line

CUI Devices’ Motion and Control Group has announced the addition of a new line of potentiometers. Available in shaft or shaftless options, these rotary potentiometers feature resistance ratings from 1 to 2000 kΩ and panel mount or through hole mounting styles.

Read more…

11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

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Review Displays News

High performance single board computer designed for graphics intensive tasks

Embedded systems and display solutions provider, Review Display Systems Inc, has announced the introduction of an AMD-powered mini-STX single board computer from leading global provider of embedded technology, Kontron.

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10 {{ "2023-01-10T00:00:00+00:00" | date "MMM" }} '23

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ST News

STPOWER automotive-grade devices from STMicroelectronics run cooler in surface-mount ACEPACK SMIT package

STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST’s advanced ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.

Read more…

10 {{ "2023-01-10T00:00:00+00:00" | date "MMM" }} '23

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TDK News

TDK redefines true wireless stereo applications with VibeSense360 solution suite

TDK Corporation expands its solution-focused offerings by announcing the InvenSense VibeSense360 TWS solution suite. VibeSense360 is a comprehensive portfolio of TDK solutions comprised of hardware and software dedicated to the TWS market.

Read more…

10 {{ "2023-01-10T00:00:00+00:00" | date "MMM" }} '23

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Nexcom News

The In-Vehicle AI-Aided Telematics Computer, VTC 7260-xC4 Leads the Way

To cope with the boom of e-commerce and direct delivery trends, machine learning is currently greatly integrated into ADAS, public works, intelligent traffic system, and countless warehouse applications. Provided with advanced computing power, extension capability, and high connectivity, NEXCOM’s in-vehicle AI-aided telematics computer, VTC 7260-xC4 is used as the core of vehicles to help deploy applications like smart public transit, smart agriculture/construction, and automated intralogistics.

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Technical Articles

High-Speed Vision Solution for IC Chip Marking Inspection and Recognition

Case studies

Low-Power Congatec SMARC Modules for Powerful AI Inference

White Paper

Delta Electronics Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

COMH-CARP AND COMH-CCAS: KONTRON ADVANCES INDUSTRIAL HIGH-PERFORMANCE COMPUTING

Keysight Coordinates Pan-European 6G Testbed

The company joins forces with sixteen organizations to create 6G-SANDBOX, a pan-European testbed for 6G experimentation and validation of 5G-Advanced and 6G capabilities. As a part of 6G-SANDBOX, Keysight will act as the project coordinator.

TDK announces SmartBug 2.0 - A smarter digital transformation module with Machine Learning-Enabled ICM-45686-S IMU

TDK Corporation announces the InvenSense SmartBug 2.0 with various new and exciting features for consumer and IoT applications as a smart remote data-collection module for IoT after the success of the original SmartBug.

Infineon Technologies increases focus and investment into core semiconductor development for high-reliability markets; sells HiRel DC-DC converter business to Micross

Infineon Technologies AG today announced that Micross Components, Inc. (“Micross”) has entered a definitive agreement to purchase Infineon’s HiRel DC-DC converter business including its hybrid and custom board-based power products.

ROHM’s 4th Generation SiC MOSFETs to be Used in Hitachi Astemo’s Inverters for Electric Vehicles

ROHM has recently announced the adoption of its new 4th Generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo, Ltd, a leading Japanese automotive parts manufacturer.

CUI Devices Adds New Potentiometers Product Line

CUI Devices’ Motion and Control Group has announced the addition of a new line of potentiometers. Available in shaft or shaftless options, these rotary potentiometers feature resistance ratings from 1 to 2000 kΩ and panel mount or through hole mounting styles.

High performance single board computer designed for graphics intensive tasks

Embedded systems and display solutions provider, Review Display Systems Inc, has announced the introduction of an AMD-powered mini-STX single board computer from leading global provider of embedded technology, Kontron.

STPOWER automotive-grade devices from STMicroelectronics run cooler in surface-mount ACEPACK SMIT package

STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST’s advanced ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.

TDK redefines true wireless stereo applications with VibeSense360 solution suite

TDK Corporation expands its solution-focused offerings by announcing the InvenSense VibeSense360 TWS solution suite. VibeSense360 is a comprehensive portfolio of TDK solutions comprised of hardware and software dedicated to the TWS market.

The In-Vehicle AI-Aided Telematics Computer, VTC 7260-xC4 Leads the Way

International