30 {{ "2022-06-30T00:00:00+00:00" | date "MMM" }} '22

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Intel News

Intel Foundry Services Forms Alliance to Enable Design in the Cloud

IFS Cloud Alliance harnesses the power of massive compute scalability to improve chip design efficiency and accelerate time-to-market for foundry customers.

Read more…

30 {{ "2022-06-30T00:00:00+00:00" | date "MMM" }} '22

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ST News

STMicroelectronics releases next-generation Bluetooth^® system-on-chip, enhanced with latest positioning capabilities

STMicroelectronics has introduced its third-generation Bluetooth^® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.

Read more…

29 {{ "2022-06-29T00:00:00+00:00" | date "MMM" }} '22

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ANSYS News

Ansys and TSMC Collaborate to Deliver Multiphysics Design Methodology for Wireless Chips

Ansys platform supports TSMC’s N6RF Design Reference Flow to help enable faster and higher performance radio frequency chips for 5G, Wi-Fi, and IoT with TSMC’s N6RF process technology.

Read more…

29 {{ "2022-06-29T00:00:00+00:00" | date "MMM" }} '22

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Mouser News

Mouser Electronics and Diotec Semiconductor Announce Global Distribution Agreement

Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a global distribution agreement with Diotec Semiconductor, designers and manufacturers of discrete semiconductor components.

Read more…

29 {{ "2022-06-29T00:00:00+00:00" | date "MMM" }} '22

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Anritsu News

Anritsu Introduces Software to Expand IQ Measurement and Analysis Capabilities of Field Spectrum Analysis Solutions

Comprehensive Suite of Tools Aids Government Regulators, Security Agencies, Spectrum Owners, and Defense Electronics Companies to Better Analyze RF Signals.

Read more…

29 {{ "2022-06-29T00:00:00+00:00" | date "MMM" }} '22

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Conrad News

Weidmüller Boost Network Security

Reliable internet connection: Weidmüller’s latest industrial security router is now available on the Conrad Sourcing Platform.

Read more…

28 {{ "2022-06-28T00:00:00+00:00" | date "MMM" }} '22

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Toshiba News

TOSHIBA ANNOUNCES AVAILABILITY OF HIGHLY ACCURATE SPICE MODELS

Toshiba Electronics Europe GmbH (“Toshiba”) today announces the availability of highly accurate G2 SPICE models allowing designers to more faithfully simulate the performance of their designs before committing to hardware.

Read more…

28 {{ "2022-06-28T00:00:00+00:00" | date "MMM" }} '22

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CEVA News

CEVA Extends its RivieraWaves UWB IP to Support CCC's Digital Key 3.0 Standard for Keyless Access to Vehicles

CEVA, Inc, the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that its RivieraWaves ultra-wideband (UWB) IP has been extended with the RW-UWB-CCC MAC software package to support the Car Connectivity Consortium^® (CCC) Digital Key 3.0 specification.

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28 {{ "2022-06-28T00:00:00+00:00" | date "MMM" }} '22

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Accelleran News

VLAIO Funded Projects Enable Accelleran to Showcase Use of Open RAN Technology in uRLLC & Neutral Host Applications

Accelleran, a leading provider of Open RAN software solutions for 4G/5G networks, has confirmed that it is part of the winning consortia that are about to undertake two major projects.

Read more…

28 {{ "2022-06-28T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-06-28T00:00:00+00:00" | date "longDate" }}

Congatec News

CONGATEC EXTENDS ITS 12TH GEN INTEL CORE PROCESSOR BASED COM-HPC

Congatec – a leading vendor of embedded and edge computing technology – introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each.

Read more…

Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Leuze Technology Report Supercaps: Energy meets efficiency

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

Intel Foundry Services Forms Alliance to Enable Design in the Cloud

IFS Cloud Alliance harnesses the power of massive compute scalability to improve chip design efficiency and accelerate time-to-market for foundry customers.

STMicroelectronics releases next-generation Bluetooth^® system-on-chip, enhanced with latest positioning capabilities

STMicroelectronics has introduced its third-generation Bluetooth^® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.

Ansys and TSMC Collaborate to Deliver Multiphysics Design Methodology for Wireless Chips

Ansys platform supports TSMC’s N6RF Design Reference Flow to help enable faster and higher performance radio frequency chips for 5G, Wi-Fi, and IoT with TSMC’s N6RF process technology.

Mouser Electronics and Diotec Semiconductor Announce Global Distribution Agreement

Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a global distribution agreement with Diotec Semiconductor, designers and manufacturers of discrete semiconductor components.

Anritsu Introduces Software to Expand IQ Measurement and Analysis Capabilities of Field Spectrum Analysis Solutions

Comprehensive Suite of Tools Aids Government Regulators, Security Agencies, Spectrum Owners, and Defense Electronics Companies to Better Analyze RF Signals.

Weidmüller Boost Network Security

Reliable internet connection: Weidmüller’s latest industrial security router is now available on the Conrad Sourcing Platform.

TOSHIBA ANNOUNCES AVAILABILITY OF HIGHLY ACCURATE SPICE MODELS

Toshiba Electronics Europe GmbH (“Toshiba”) today announces the availability of highly accurate G2 SPICE models allowing designers to more faithfully simulate the performance of their designs before committing to hardware.

CEVA Extends its RivieraWaves UWB IP to Support CCC's Digital Key 3.0 Standard for Keyless Access to Vehicles

VLAIO Funded Projects Enable Accelleran to Showcase Use of Open RAN Technology in uRLLC & Neutral Host Applications

Accelleran, a leading provider of Open RAN software solutions for 4G/5G networks, has confirmed that it is part of the winning consortia that are about to undertake two major projects.

CONGATEC EXTENDS ITS 12TH GEN INTEL CORE PROCESSOR BASED COM-HPC

Congatec – a leading vendor of embedded and edge computing technology – introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each.

International

Market Overview

Technical Articles

Case studies

IFS Cloud Alliance harnesses the power of massive compute scalability to improve chip design efficiency and accelerate time-to-market for foundry customers.

STMicroelectronics has introduced its third-generation Bluetooth® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.

Ansys platform supports TSMC’s N6RF Design Reference Flow to help enable faster and higher performance radio frequency chips for 5G, Wi-Fi, and IoT with TSMC’s N6RF process technology.

Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a global distribution agreement with Diotec Semiconductor, designers and manufacturers of discrete semiconductor components.

Comprehensive Suite of Tools Aids Government Regulators, Security Agencies, Spectrum Owners, and Defense Electronics Companies to Better Analyze RF Signals.

Reliable internet connection: Weidmüller’s latest industrial security router is now available on the Conrad Sourcing Platform.

Toshiba Electronics Europe GmbH (“Toshiba”) today announces the availability of highly accurate G2 SPICE models allowing designers to more faithfully simulate the performance of their designs before committing to hardware.

Accelleran, a leading provider of Open RAN software solutions for 4G/5G networks, has confirmed that it is part of the winning consortia that are about to undertake two major projects.

Congatec – a leading vendor of embedded and edge computing technology – introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each.

International

STMicroelectronics has introduced its third-generation Bluetooth^® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.