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Sps Mesago News
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Rohm Semiconductors News
ROHM Recognized as a Preferred Supplier of SiC Power Solutions by UAES
ROHM has recently been certified as a preferred supplier of SiC power solutions by United Automotive Electronic Systems Co., Ltd., (UAES), a Chinese Tier 1 comprehensive automotive manufacturer.
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Toshiba News
Toshiba Releases Its First 200V Transistor Output Automotive Photocoupler
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched a high voltage transistor output automotive photocoupler, “TLX9188,” for isolated signal communication in automotive equipment, including electric mobility vehicles. Volume shipments start today.
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Infineon News
Infineon joins the Connectivity Standards Alliance Board of Directors
The Connectivity Standards Alliance (CSA), an organization with over 400 companies working together to simplify and harmonize the Internet of Things (IoT) through technology standards, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a world leader in semiconductor solutions, today announced Infineon will be joining the Alliance’s Board of Directors as a Promoter Member.
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ANSYS News
Ansys Multiphysics Solutions Achieve Certification for Samsung’s 3nm and 4nm Process Technologies
Ansys’ collaboration with Samsung Foundry delivers industry-leading power integrity and electromigration signoff solutions for low-power mobile and high-performance computing applications.
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Diamond News
Low-maintenance Lensed Interconnects designed to withstand adverse conditions
The Challenge: Harsh environment applications require rugged and reliable components able to withstand adverse conditions that standard commercial connectors and cable assemblies typically cannot endure. Connector contaminants are the leading cause of power loss and signal degradation, often requiring the continuous need for cleaning.
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IAR Systems News
IAR Systems and Secure Thingz extend embedded security assurance solution with support for STM32 MCUs
Compliance Suite for STM32 includes security development tools and practical guidance, delivering a shrink-wrapped solution for organizations to ensure security assurance in their IoT applications.
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ST News
STMicroelectronics Upgrades Automotive Positioning Accuracy with Single-Chip Triple-Band Satellite-Navigation Receiver
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced a world-first automotive satellite-navigation chip that delivers high-quality position data needed by advanced driving systems.
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NEC Corporation News
NEC to release TIP-compliant fully disaggregated 400G Transponder solution in 2022
NEC Corporation (NEC; TSE: 6701) announced today that it has joined the Telecom Infra Project’s (TIP) Phoenix initiative. Phoenix is managed by TIP's Open Optical and Packet Transport (OOPT) Project Group and seeks to develop a 400G transponder for open and disaggregated high-capacity DWDM networks.
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Anritsu News
