06 {{ "2022-09-06T00:00:00+00:00" | date "MMM" }} '22

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DFI

DFI’s Revenue in the First Half of the Year Sets a New Record for the Same Period

DFI, the world’s leading brand in embedded motherboards and industrial computers, held an online investor conference on August 15 to announce our consolidated financial statements for the second quarter and first half of 2022. The consolidated revenue in the first half of the year reached €255.21million.

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05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

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Impulse Embedded News

Aaeon BOXER-8640AI Embedded Box PCs powered by new NVIDIA Jetson AGX Orin now available from Impulse Embedded

Impulse Embedded, a leading provider of industrial computing systems and solutions, announces the availability of Aaeon Technology’s BOXER-8640AI, their latest rugged, embedded box PC and their first to be powered by the NVIDIA flagship Jetson AGX Orin System-on-Module (SoM), which boasts a sixfold increase in AI performance over the previous generation Jetson AGX Xavier.

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05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

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Nowi Energy News

Telink Introduces Energy Harvesting Multi-protocol Wireless Connectivity Module, Powered by Nowi, to Enable Batteryless Solutions

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

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05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

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Lane Electronics News

Meet Lane Electronics at DVD2022 – the Defence Industry Exhibition

Lane Electronics will be showcasing their extensive portfolio of robust and waterproof connectors at DVD2022, located at the Millbrook Proving Ground on September 21st - 22nd.

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05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

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Mitsubishi Electric News

Mitsubishi Electric to Ship Samples of Tunable Laser-diode Chip for Optical-fiber Communication

Will increase capacity of digital coherent communication and downsize optical transceivers.

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05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

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Samsung News

Samsung Electronics Unveils High-Performance 990 PRO SSD Optimized for Gaming and Creative Applications

Blazing speeds of the 990 PRO cut load times and increase game responsiveness while its thermal control solutions keep the drive at optimal temperature for uninterrupted play.

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03 {{ "2022-09-03T00:00:00+00:00" | date "MMM" }} '22

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Codasip News

Codasip joins Intel Pathfinder for RISC-V program

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.

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02 {{ "2022-09-02T00:00:00+00:00" | date "MMM" }} '22

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Bender News

NEW, DIVISIBLE MEASURING CURRENT TRANSFORMERS FOR EXISTING ELECTRICAL INSTALLATIONS

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

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01 {{ "2022-09-01T00:00:00+00:00" | date "MMM" }} '22

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Toshiba News

TOSHIBA LAUNCHES THIRD GENERATION 650V SILICON CARBIDE (SIC) MOSFETS

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

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01 {{ "2022-09-01T00:00:00+00:00" | date "MMM" }} '22

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TDK News

Inductors: New advanced multilayer inductors from TDK meet evolving automotive PoC demands

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

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Case studies

Mitutoyo's Measuring Machines and Equipment Ensuring Quality at Purso-Tools

DFI’s Revenue in the First Half of the Year Sets a New Record for the Same Period

Aaeon BOXER-8640AI Embedded Box PCs powered by new NVIDIA Jetson AGX Orin now available from Impulse Embedded

Telink Introduces Energy Harvesting Multi-protocol Wireless Connectivity Module, Powered by Nowi, to Enable Batteryless Solutions

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

Meet Lane Electronics at DVD2022 – the Defence Industry Exhibition

Lane Electronics will be showcasing their extensive portfolio of robust and waterproof connectors at DVD2022, located at the Millbrook Proving Ground on September 21st - 22nd.

Mitsubishi Electric to Ship Samples of Tunable Laser-diode Chip for Optical-fiber Communication

Will increase capacity of digital coherent communication and downsize optical transceivers.

Samsung Electronics Unveils High-Performance 990 PRO SSD Optimized for Gaming and Creative Applications

Blazing speeds of the 990 PRO cut load times and increase game responsiveness while its thermal control solutions keep the drive at optimal temperature for uninterrupted play.

Codasip joins Intel Pathfinder for RISC-V program

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.

NEW, DIVISIBLE MEASURING CURRENT TRANSFORMERS FOR EXISTING ELECTRICAL INSTALLATIONS

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

TOSHIBA LAUNCHES THIRD GENERATION 650V SILICON CARBIDE (SIC) MOSFETS

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

Inductors: New advanced multilayer inductors from TDK meet evolving automotive PoC demands

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

International

Case studies

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

Lane Electronics will be showcasing their extensive portfolio of robust and waterproof connectors at DVD2022, located at the Millbrook Proving Ground on September 21st - 22nd.

Will increase capacity of digital coherent communication and downsize optical transceivers.

Blazing speeds of the 990 PRO cut load times and increase game responsiveness while its thermal control solutions keep the drive at optimal temperature for uninterrupted play.

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel® Pathfinder for RISC-V* program.

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

International

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.