30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-30T00:00:00+00:00" | date "longDate" }}

Anritsu News

Latest EMITE and Anritsu solution ensures compatibility of LTE, WLAN and Bluetooth^®

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.

Read more…

30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-30T00:00:00+00:00" | date "longDate" }}

Harwin News

HARWIN ADDS MORE SHIELDING OPTIONS FOR GECKO HI-REL CONNECTORS

Harwin has introduced horizontal backshells for its Gecko-Screw-Lok (Gecko-SL) series of lightweight, high-reliability (Hi-Rel) connectors. These backshells ensure a fully EMI/RFI shielded connection for horizontal 1.25mm pitch board-to-cable connections. Previously Gecko EMI/RFI shielding was only available on vertical board-to-cable orientations.

Read more…

30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-30T00:00:00+00:00" | date "longDate" }}

Congatec News

CONGATEC INTRODUCES VEHICLE COMPUTING TECHNOLOGY FOR SMART MOBILITY AT INTERTRAFFIC AMSTERDAM

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

Read more…

29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-29T00:00:00+00:00" | date "longDate" }}

WM5G News

Deciphering Open RAN – Exploring the opportunities of open access connectivity in the 5G era

As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.

Read more…

29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-29T00:00:00+00:00" | date "longDate" }}

Digi-Key News

Digi-Key Electronics and Analog Devices to Host Webinar on New Edge Artificial Intelligence Use Cases

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.

Read more…

29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-29T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics reveals 2.5V rad-hard digital-to-analog converter for next-generation satellite applications

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

Read more…

28 {{ "2022-03-28T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-28T00:00:00+00:00" | date "longDate" }}

Nexperia News

Nexperia officially launches new Dallas design center

Nexperia today announced the official launch of its new design center in Dallas, Texas. Having recently celebrated its 5th anniversary as an independent company, this development marks another major step towards Nexperia’s stated goal of becoming a world leader in essential semiconductors by 2030. First R&D Facility in North America enables entry to power management IC market.

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28 {{ "2022-03-28T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-28T00:00:00+00:00" | date "longDate" }}

Intel News

Intel Introduces New ATX PSU Specifications

Intel has published the most significant update to industry power supply specifications since the initial ATX 2.0 specs were introduced in 2003. Updated ATX 3.0 specifications unlock the full power and potential of next-generation hardware and upcoming components built for technologies like PCIe Gen 5.0.ATX 3.0 and ATX12VO 2.0 support next-generation hardware power demands.

Read more…

26 {{ "2022-03-26T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-26T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM ESTABLISHES QUICUR: MAXIMIZING THE RESPONSE PERFORMANCE OF POWER SUPPLY ICS

Contributing to reducing power supply circuit design resources by providing stable operation with fewer external components.

Read more…

25 {{ "2022-03-25T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-25T00:00:00+00:00" | date "longDate" }}

CEA Leti News

CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale

CEA, a French key player in research, development and innovation, and C12 Quantum Electronics, a startup focused on developing the next-generation of quantum computers using carbon nanotubes, today announced a partnership to produce the first multi-qubit chips at wafer scale.

Read more…

Technical Articles

What You Should Know About RFID Tags

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

White Paper

Maximize Your Power System Efficiency

Latest EMITE and Anritsu solution ensures compatibility of LTE, WLAN and Bluetooth^®

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.

HARWIN ADDS MORE SHIELDING OPTIONS FOR GECKO HI-REL CONNECTORS

CONGATEC INTRODUCES VEHICLE COMPUTING TECHNOLOGY FOR SMART MOBILITY AT INTERTRAFFIC AMSTERDAM

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

Deciphering Open RAN – Exploring the opportunities of open access connectivity in the 5G era

As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.

Digi-Key Electronics and Analog Devices to Host Webinar on New Edge Artificial Intelligence Use Cases

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.

STMicroelectronics reveals 2.5V rad-hard digital-to-analog converter for next-generation satellite applications

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

Nexperia officially launches new Dallas design center

Intel Introduces New ATX PSU Specifications

ROHM ESTABLISHES QUICUR: MAXIMIZING THE RESPONSE PERFORMANCE OF POWER SUPPLY ICS

Contributing to reducing power supply circuit design resources by providing stable operation with fewer external components.

CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale

CEA, a French key player in research, development and innovation, and C12 Quantum Electronics, a startup focused on developing the next-generation of quantum computers using carbon nanotubes, today announced a partnership to produce the first multi-qubit chips at wafer scale.

International

Technical Articles

Case studies

White Paper

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth® wireless technology.

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

Contributing to reducing power supply circuit design resources by providing stable operation with fewer external components.

CEA, a French key player in research, development and innovation, and C12 Quantum Electronics, a startup focused on developing the next-generation of quantum computers using carbon nanotubes, today announced a partnership to produce the first multi-qubit chips at wafer scale.

International

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.