Panasonic Industry has created a power inductor with a monolithic structure which is highly reliable in high temperature and high vibration applications in the automotive industry.
STMicroelectronics has extended the certification of its ST8500 G3-PLC (Power-Line Communication) Hybrid communication chipset, now covering the US FCC (Federal Communications Commission) band plan from 10kHz to 490kHz, in addition to the CENELEC-A 9kHz-95kHz European band.
With the development of its SenSWIR sensors, Sony has laid a milestone for the future expansion of SWIR imaging: Thanks to the cutting-edge InGaAs sensor architecture, images in both the visible and invisible short-wave infrared light spectrum can be captured simultaneously for the first time. At the same time, the sensors set new standards in terms of pixel size and image homogeneity.
High power density convection rated AC-DC power. SL Power Electronics (SLPE), a global leader in designing and manufacturing of AC/DC power conversion solutions used by Original Equipment Manufacturers (OEMs) in their most mission-critical applications, announces the launch of the NGB SERIES of high power density convection rated AC-DC power supplies.
Technological progress and developments in industry are being significantly shaped by the ongoing miniaturisation and modularisation trends – meaning that new solutions and products will always be demanded here. Even more compact and flexible.
In this, the third blog in our series covering the importance of analog engineering skills, we look at the lab equipment electronics engineers need to perform their role.
Kontron, a leading global provider of IoT/embedded computer technology (ECT), is expanding its industrial switch product line with high-performance and cost-effective TSN switches. The different versions of the KSwitch D10 MMT will be available in early Q1/2022 and offer both RJ45 and SFP fiber interfaces up to 2.5 Gb/s with full TSN feature-set and management.
The Meganova ring light is They are provided with eight high-power LEDs, placed directly behind the enclosure front window, eliminates the need for further external lighting. The ring light design is matched to the enclosure series cited above for efficient heat dissipation.
At the Photonics West exhibition, Vision Components will present new products for even more intelligence on the edge, additional applications and longer transmission paths. The FPGA-based hardware accelerator VC Power SoM was developed for complex image preprocessing. Results are directly transferred to a processor board.