HighTec EDV-Systeme GmbH, the German headquartered global supplier of software development tools, embedded software and expert services, appointed Zellaco AB as its distributor in the Nordic countries. HighTec's products and services are targeting the global embedded market and are tailored for the development of safety-critical solutions in Automotive (ISO 26262 up to ASIL D) and more.
BorgWarner is strengthening its inverter capabilities and offerings through an exclusive licensing agreement with PolyCharge America, Inc., a startup company formed to deliver disruptive capacitor products.
Minimized R&D efforts and costs as well as robust and highly efficient operation of medium-voltage gallium-nitride (GaN) switches are key requirements for modern power electronics systems. In accordance with its strategically-designed GaN product portfolio to continuously strengthen full system solutions, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the EiceDRIVER 1EDN71x6G HS 200V single-channel gate driver ICs family.
Professional maintenance, repair and overhaul: the Conrad Sourcing Platform supplies industrial-grade test equipment suitable for a wide range of uses to service engineers.
With their special modular construction, the LVDT-based valve sensors in the IHDL-M16 series from Inelta Sensorsysteme allow the sensor module to be replaced while the process is running.
A switch must always be affordable and easy to install if high port density is required in extended industrial centres. Robust design for the highest possible permissible ambient temperatures during operation is a further factor in favour of enabling rail mounting and the installation of several switches in switch boxes.
Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility
Announced at IEDM 2021: Confirmed Reduced Power Consumption and Increased Speed in Write Operations on 16 nm FinFET Logic Process Embedded STT-MRAM Test Chip.