Ansys’ collaboration with Samsung Foundry delivers industry-leading power integrity and electromigration signoff solutions for low-power mobile and high-performance computing applications.
The Challenge: Harsh environment applications require rugged and reliable components able to withstand adverse conditions that standard commercial connectors and cable assemblies typically cannot endure. Connector contaminants are the leading cause of power loss and signal degradation, often requiring the continuous need for cleaning.
Compliance Suite for STM32 includes security development tools and practical guidance, delivering a shrink-wrapped solution for organizations to ensure security assurance in their IoT applications.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced a world-first automotive satellite-navigation chip that delivers high-quality position data needed by advanced driving systems.
NEC Corporation (NEC; TSE: 6701) announced today that it has joined the Telecom Infra Project’s (TIP) Phoenix initiative. Phoenix is managed by TIP's Open Optical and Packet Transport (OOPT) Project Group and seeks to develop a 400G transponder for open and disaggregated high-capacity DWDM networks.
This New Solution Provides Multiple Benefits for Emerging Designs in Commercial and Military/Aerospace Applications. Anritsu Corporation introduces the RubidiumTM signal generator family that delivers outstanding signal purity and frequency stability, even at high output power levels, across a broad frequency range of 9 kHz to 43.5 GHz.
The goal is to provide the critical systems markets – such as industrial automation, medical, smart energy, railway, commercial and autonomous vehicles or construction machinery – with Arm and x86 based turnkey solution platforms that are specifically tailored to address functional safety and cybersecurity requirements.
In the second of our four-part series on analog engineering skills, we explain the function of the analog signal chain and review key component specifications.
ASRock Industrial partners with the Coalition for Open Process Automation (COPA), that is formed by CPLANE.ai and Collaborative Systems Integration (CSI) on the development of the first open-industrial control systems based upon the Open Process Automation Standard (O-PAS). Increasing the competitiveness of manufacturing companies and accelerating implementation of Industry 4.0 through open platforms.
New ForgeFPGA Family Is Supported by Free, Easy-to-Use Software with No License Fees. Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it is entering the Field-Programmable Gate Array (FPGA) market with a new line of very low-cost, very low-power devices.