Toposens has partnered up with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) to realize 3D obstacle detection and collision avoidance in autonomous systems using Toposens' proprietary 3D ultrasound technology.
NXP’s vehicle networking, gateway and i.MX 8 Series processors work together to enable enhanced services, convenience and over-the-air updateable vehicles.
Electron Microscopy (EM) is a fast-evolving field. Researchers and scientists are always developing new techniques and testing new approaches, while instrument manufacturers are releasing more automated and easier-to-use microscopes and integrating new technology to help yield better results.
HARTING’s innovative har-modular® series took gold in the category of “Machines & Components” in the annual IDEA! Awards presented by Machine Design and Hydraulics & Pneumatics.
STMicroelectronics’ ST25TN512 and ST25TN01K NFC Forum Type 2 tag ICs deliver a new balance of cost and performance for high-volume use cases like consumer engagement, product information, and brand protection.
RH850/U2B MCUs Accelerate ECU Integration for Zone and Domain Control Applications with Improved Performance, Security, and Motor Control Accelerator IP.