21 {{ "2021-12-21T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-21T00:00:00+00:00" | date "longDate" }}

Mouser News

MOUSER ELECTRONICS’ EMPOWERING INNOVATION TOGETHER OFFERS EXTENSIVE LOOK AT EMERGING TECHNOLOGIES

Since 2015, Mouser Electronics Inc. has provided engineers with extensive insight into the latest trends and technologies through its award-winning Empowering Innovation Together program. Over the course of seven instalments, Mouser’s 2021 Empowering Innovation Together series highlighted key topics such as 5G, power management, artificial intelligence, sensor fusion, intelligent transportation systems, RF wireless technologies and industrial automation.

Read more…

21 {{ "2021-12-21T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-21T00:00:00+00:00" | date "longDate" }}

Mediatek News

MediaTek Officially Launches Dimensity 9000 Flagship Chip And Announces Adoption by Global Device Makers

Built on the leading TSMC N4 process, Dimensity 9000 brings full flagship performance and power-efficiency to smartphones. First MediaTek powered devices will be available in Q1 of 2022.

Read more…

21 {{ "2021-12-21T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-21T00:00:00+00:00" | date "longDate" }}

Intel News

Mobileye Autonomous Cars Piloting in Paris

Employees from world-famous Galeries Lafayette in Paris can experience first autonomous rides by Mobileye and RATP Group.

Read more…

21 {{ "2021-12-21T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-21T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Introduces Radar Scene Emulator Solution to Accelerate Path to Full Vehicle Autonomy

Provides automotive OEMs with full-scene emulation to lab test complex, real-world scenarios.

Read more…

21 {{ "2021-12-21T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-21T00:00:00+00:00" | date "longDate" }}

Arkema News

Arkema to double its Sartomer^® photocure resins capacity in Asia

Arkema announces the project to double its UV curable resins production capacity at its Nansha plant in China. This expansion will support the fast-growing demand in Asia for cutting-edge solutions in electronics, driven by 5G technology, and in renewable energies.

Read more…

21 {{ "2021-12-21T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-21T00:00:00+00:00" | date "longDate" }}

Lattice Semiconductor News

Lattice Expands Automate Solution Stack and Propel Design Tool Capabilities to Accelerate Industrial Application Development

Improved user experience and more performance for applications in robotics, smart factory, and motion control.

Read more…

20 {{ "2021-12-20T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-20T00:00:00+00:00" | date "longDate" }}

MIkroe News

MIKROE adds high-performance signal generation for $109

Waveform 4 peripheral development board based on ADI's AD9106, quad-channel, 12-bit, 180MSPS waveform generator.

Read more…

20 {{ "2021-12-20T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-20T00:00:00+00:00" | date "longDate" }}

Elma News

Elma’s First-to-Market Cooling Platform Embraces Air Flow-Through (AFT) Per VITA 48.8 Standard

Unit uses baffling method to enable air flow control for up to five 1-slot VITA 48.8 backplanes.

Read more…

20 {{ "2021-12-20T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-20T00:00:00+00:00" | date "longDate" }}

Melexis News

Melexis simplifies automotive electrification with high-speed inductive resolver for e-motors

Innovative architecture with on-chip offset and propagation delay compensation provides accurate stray field immune position sensing at speeds up to 240,000 e-rpm.

Read more…

18 {{ "2021-12-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-18T00:00:00+00:00" | date "longDate" }}

Fischer Elektronik News

EXTENSION OF THE PACKAGING OPTIONS FOR MALE HEADERS WITH A GRID PATTERN OF 1.27 MM (SLV W 3 / 4 / 5 SMD …)

The steadily increasing trend towards packaging forms suitable for automatic machines is unbroken. As a result the inquiries and orders for machine-compatible packaging for connectors in "tape & reel" packaging have increased significantly in recent months.

Read more…

Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Leuze Technology Report Supercaps: Energy meets efficiency

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

MOUSER ELECTRONICS’ EMPOWERING INNOVATION TOGETHER OFFERS EXTENSIVE LOOK AT EMERGING TECHNOLOGIES

MediaTek Officially Launches Dimensity 9000 Flagship Chip And Announces Adoption by Global Device Makers

Built on the leading TSMC N4 process, Dimensity 9000 brings full flagship performance and power-efficiency to smartphones. First MediaTek powered devices will be available in Q1 of 2022.

Mobileye Autonomous Cars Piloting in Paris

Employees from world-famous Galeries Lafayette in Paris can experience first autonomous rides by Mobileye and RATP Group.

Keysight Introduces Radar Scene Emulator Solution to Accelerate Path to Full Vehicle Autonomy

Provides automotive OEMs with full-scene emulation to lab test complex, real-world scenarios.

Arkema to double its Sartomer^® photocure resins capacity in Asia

Arkema announces the project to double its UV curable resins production capacity at its Nansha plant in China. This expansion will support the fast-growing demand in Asia for cutting-edge solutions in electronics, driven by 5G technology, and in renewable energies.

Lattice Expands Automate Solution Stack and Propel Design Tool Capabilities to Accelerate Industrial Application Development

Improved user experience and more performance for applications in robotics, smart factory, and motion control.

MIKROE adds high-performance signal generation for $109

Waveform 4 peripheral development board based on ADI's AD9106, quad-channel, 12-bit, 180MSPS waveform generator.

Elma’s First-to-Market Cooling Platform Embraces Air Flow-Through (AFT) Per VITA 48.8 Standard

Unit uses baffling method to enable air flow control for up to five 1-slot VITA 48.8 backplanes.

Melexis simplifies automotive electrification with high-speed inductive resolver for e-motors

Innovative architecture with on-chip offset and propagation delay compensation provides accurate stray field immune position sensing at speeds up to 240,000 e-rpm.

EXTENSION OF THE PACKAGING OPTIONS FOR MALE HEADERS WITH A GRID PATTERN OF 1.27 MM (SLV W 3 / 4 / 5 SMD …)

The steadily increasing trend towards packaging forms suitable for automatic machines is unbroken. As a result the inquiries and orders for machine-compatible packaging for connectors in "tape & reel" packaging have increased significantly in recent months.

International