Since 2015, Mouser Electronics Inc. has provided engineers with extensive insight into the latest trends and technologies through its award-winning Empowering Innovation Together program. Over the course of seven instalments, Mouser’s 2021 Empowering Innovation Together series highlighted key topics such as 5G, power management, artificial intelligence, sensor fusion, intelligent transportation systems, RF wireless technologies and industrial automation.
Built on the leading TSMC N4 process, Dimensity 9000 brings full flagship performance and power-efficiency to smartphones. First MediaTek powered devices will be available in Q1 of 2022.
Arkema announces the project to double its UV curable resins production capacity at its Nansha plant in China. This expansion will support the fast-growing demand in Asia for cutting-edge solutions in electronics, driven by 5G technology, and in renewable energies.
Innovative architecture with on-chip offset and propagation delay compensation provides accurate stray field immune position sensing at speeds up to 240,000 e-rpm.
The steadily increasing trend towards packaging forms suitable for automatic machines is unbroken. As a result the inquiries and orders for machine-compatible packaging for connectors in "tape & reel" packaging have increased significantly in recent months.