29
'21
Written on
Ni News
29
'21
Written on
Intel News
INTEL ACCELERATES PROCESS AND PACKAGING INNOVATIONS
Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.
29
'21
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TDK News
INDUCTORS: TDK EXPANDS ITS RANGE OF COUPLED INDUCTORS
TDK Corporation (TSE:6762) has extended its range of coupled inductors to include the new EPCOS series B82472D6*. The nine series types cover an inductance range of 2 x 2.2 µH to 2 x 47 µH and are designed for maximum rated currents of 1.1 A to 4.3 A.
29
'21
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AMS News
As small as a pinhead: ams OSRAM provides the world’s smallest digital camera module for single-use endoscopy
With an area of one square millimeter, the NanEyeM is the smallest camera module with a fully digital output for medical endoscopes available on the market.
29
'21
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Kontron News
Smart extensions: Powerful Kontron Box-PC KBox B-202-CFL now available in two new variants
The KBox variants 'Smart Performance' and 'Smart Storage' meet the demand for higher computing performance and additional internal storage options.
29
'21
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Moxa
Bundled Know-How for IIoT Applications: Cooperation Between Moxa Europe and Robotron
Objective: Fast provision of easy-to-use and scalable IIoT solutions – with focus on four application areas.
29
'21
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Vision Components News
Shortcut to series production: modular Maivin i.MX 8M Plus AI Vision Kit from AU-Zone, Toradex and Vision Components
For proof of concept, rapid prototyping and small series production, AU-Zone and Toradex, working in close cooperation with Vision Components, have developed the modular Maivin i.MX 8M Plus AI Vision Kit.
29
'21
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Intertronics News
Intertronics offers new conveniently packaged potting compound
New IRS 3078 Polyurethane Potting Compound available from Intertronics.
29
'21
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Renesas News
Renesas and Syntiant Develop Voice-Controlled Multimodal AI Solution Combining Advanced Vision and Voice Technologies
New Offering Enables Low-Power Voice-Controlled Operation of Embedded Vision AI Systems in IoT and Edge Applications.
29
'21
Written on
Nexperia News
