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CEVA News

CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture

3rd generation NeuPro AI/ML architecture offers scalable performance of 20 to 1,200 TOPS at SoC and Chiplet levels, lowers memory bandwidth by 6X.Targets broad use of AI/ML in automotive, industrial, 5G networks and handsets, surveillance cameras, and Edge Compute.

TDK News

HDD Heads: TDK reports successfully shipped prototype HDD-Heads with next generation recording technology, MAS-MAMR

TDK Corporation (TSE:6762) announces that it has successfully shipped prototype heads with next generation recording technology, MAS-MAMR, which is co-developed with Toshiba Corporate R&D Center and Toshiba Electric Devices & Storage Corporation.

Anritsu News

Anritsu, in Collaboration with Qualcomm, Verifies Industry First Enhanced Network Slicing and Power Saving Tests for 5G New Radio Standalone

Anritsu Corporation is pleased to announce that the first enhanced Network Slicing and User Equipment (UE) power saving Protocol Conformance Tests for 5G New Radio (NR) Standalone (SA) have been verified on the 5G NR Mobile Device Test Platform ME7834NR powered by the Snapdragon® X65 5G Modem-RF System, the world’s first Release 16 modem-RF system.

E-Peas News

E-PEAS Industry’s First Energy Harvesting Optimized Antenna

e-peas has now added an antenna solution to its expanding product portfolio with the goal of providing a complete set of all the essential components required for RF energy harvesting. This antenna will complement the company’s established series of energy harvesting dedicated power management ICs.

Kontron News

KONTRON ANNOUNCES PRODUCTS FEATURING THE LATEST 12TH GEN INTEL® CORE PROCESSORS

Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), announces new boards and modules featuring the 12th Gen Intel® Core processors (Codename Alderlake-S series) for the Internet of Things. Kontron will update the current mini-ITX, µATX and ATX motherboards with this new processor series, and has also selected it as the 1st platform to adopt the new PICMG® COM-HPC®/Client form factor, as it serves best new technology trends set by COM-HPC® client specification.

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