3rd generation NeuPro AI/ML architecture offers scalable performance of 20 to 1,200 TOPS at SoC and Chiplet levels, lowers memory bandwidth by 6X.Targets broad use of AI/ML in automotive, industrial, 5G networks and handsets, surveillance cameras, and Edge Compute.
TDK Corporation (TSE:6762) announces that it has successfully shipped prototype heads with next generation recording technology, MAS-MAMR, which is co-developed with Toshiba Corporate R&D Center and Toshiba Electric Devices & Storage Corporation.
Sigfox is working on its first commercial development to create an energy harvesting device by collaborating with HT Micron and Nowi to launch a board integrating HT Micron (SiP) and Nowi (PMIC) solutions.
Anritsu Corporation is pleased to announce that the first enhanced Network Slicing and User Equipment (UE) power saving Protocol Conformance Tests for 5G New Radio (NR) Standalone (SA) have been verified on the 5G NR Mobile Device Test Platform ME7834NR powered by the Snapdragon® X65 5G Modem-RF System, the world’s first Release 16 modem-RF system.
e-peas has now added an antenna solution to its expanding product portfolio with the goal of providing a complete set of all the essential components required for RF energy harvesting. This antenna will complement the company’s established series of energy harvesting dedicated power management ICs.
As the global market leader in automotive semiconductors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) continues its innovation path to shape future mobility.
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), announces new boards and modules featuring the 12th Gen Intel® Core processors (Codename Alderlake-S series) for the Internet of Things. Kontron will update the current mini-ITX, µATX and ATX motherboards with this new processor series, and has also selected it as the 1st platform to adopt the new PICMG® COM-HPC®/Client form factor, as it serves best new technology trends set by COM-HPC® client specification.