12 {{ "2021-11-12T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-11-12T00:00:00+00:00" | date "longDate" }}

Infineon News

Toposens introduces new ultrasonic 3D sensor featuring Infineon’s XENSIV MEMS microphone

Toposens has partnered up with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) to realize 3D obstacle detection and collision avoidance in autonomous systems using Toposens' proprietary 3D ultrasound technology.

Read more…

12 {{ "2021-11-12T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-11-12T00:00:00+00:00" | date "longDate" }}

NXP News

NXP and Ford Collaborate to Deliver Next-Generation Connected Car Experiences and Expanded Services

NXP’s vehicle networking, gateway and i.MX 8 Series processors work together to enable enhanced services, convenience and over-the-air updateable vehicles.

Read more…

12 {{ "2021-11-12T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-11-12T00:00:00+00:00" | date "longDate" }}

DECTRIS News

Hybrid-Pixel Technology in Electron Microscopy: Today and Tomorrow

Electron Microscopy (EM) is a fast-evolving field. Researchers and scientists are always developing new techniques and testing new approaches, while instrument manufacturers are releasing more automated and easier-to-use microscopes and integrating new technology to help yield better results.

Read more…

12 {{ "2021-11-12T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-11-12T00:00:00+00:00" | date "longDate" }}

HARTING News

har-Modular^® Takes Gold in IDEA! Awards in the Machines & Components Category

HARTING’s innovative har-modular^® series took gold in the category of “Machines & Components” in the annual IDEA! Awards presented by Machine Design and Hydraulics & Pneumatics.

Read more…

12 {{ "2021-11-12T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-11-12T00:00:00+00:00" | date "longDate" }}

Stimio News

STIMIO KEEPS IOT MONITORING ON TRACK

Stimio keeps IoT monitoring on track for high-value rail and utility assets with Quectel GNSS and cellular modules.

Read more…

12 {{ "2021-11-12T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-11-12T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics Launches Cost-Effective NFC Type 2 Tag IC with Privacy Features and Augmented NDEF

STMicroelectronics’ ST25TN512 and ST25TN01K NFC Forum Type 2 tag ICs deliver a new balance of cost and performance for high-volume use cases like consumer engagement, product information, and brand protection.

Read more…

11 {{ "2021-11-11T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-11-11T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Expands Lineup of 28nm Cross-Domain Automotive Control Microcontrollers

RH850/U2B MCUs Accelerate ECU Integration for Zone and Domain Control Applications with Improved Performance, Security, and Motor Control Accelerator IP.

Read more…

11 {{ "2021-11-11T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-11-11T00:00:00+00:00" | date "longDate" }}

Emerson Industrial Automation

Emerson Presents Ultrasonic Metal Welding Solutions at Productronica 2021 in Hall B4, Stand 324

Branson GMX-20DP Direct Press, GMX-20MA and GMX-W1 are Featured

Read more…

11 {{ "2021-11-11T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-11-11T00:00:00+00:00" | date "longDate" }}

PEPPERL+FUCHS FACTORY AUTOMATION

Rugged, Compact, Safe

USi^®-safety Ultrasonic System for Category 3 PL d

Read more…

11 {{ "2021-11-11T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-11-11T00:00:00+00:00" | date "longDate" }}

PEPPERL+FUCHS FACTORY AUTOMATION

One Platform for Numerous Tasks

SmartRunner Explorer 3-D Vision Sensor

Read more…

Technical Articles

High-Speed Vision Solution for IC Chip Marking Inspection and Recognition

Case studies

NEXCOM, Profet AI Empower Engineers with Accessible Industrial AI

White Paper

Delta Electronics Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

Toposens introduces new ultrasonic 3D sensor featuring Infineon’s XENSIV MEMS microphone

Toposens has partnered up with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) to realize 3D obstacle detection and collision avoidance in autonomous systems using Toposens' proprietary 3D ultrasound technology.

NXP and Ford Collaborate to Deliver Next-Generation Connected Car Experiences and Expanded Services

NXP’s vehicle networking, gateway and i.MX 8 Series processors work together to enable enhanced services, convenience and over-the-air updateable vehicles.

Hybrid-Pixel Technology in Electron Microscopy: Today and Tomorrow

Electron Microscopy (EM) is a fast-evolving field. Researchers and scientists are always developing new techniques and testing new approaches, while instrument manufacturers are releasing more automated and easier-to-use microscopes and integrating new technology to help yield better results.

har-Modular^® Takes Gold in IDEA! Awards in the Machines & Components Category

HARTING’s innovative har-modular^® series took gold in the category of “Machines & Components” in the annual IDEA! Awards presented by Machine Design and Hydraulics & Pneumatics.

STIMIO KEEPS IOT MONITORING ON TRACK

Stimio keeps IoT monitoring on track for high-value rail and utility assets with Quectel GNSS and cellular modules.

STMicroelectronics Launches Cost-Effective NFC Type 2 Tag IC with Privacy Features and Augmented NDEF

STMicroelectronics’ ST25TN512 and ST25TN01K NFC Forum Type 2 tag ICs deliver a new balance of cost and performance for high-volume use cases like consumer engagement, product information, and brand protection.

Renesas Expands Lineup of 28nm Cross-Domain Automotive Control Microcontrollers

RH850/U2B MCUs Accelerate ECU Integration for Zone and Domain Control Applications with Improved Performance, Security, and Motor Control Accelerator IP.

Emerson Presents Ultrasonic Metal Welding Solutions at Productronica 2021 in Hall B4, Stand 324

Branson GMX-20DP Direct Press, GMX-20MA and GMX-W1 are Featured

Rugged, Compact, Safe

USi^®-safety Ultrasonic System for Category 3 PL d

One Platform for Numerous Tasks

SmartRunner Explorer 3-D Vision Sensor

International

Technical Articles

Case studies

White Paper

Toposens has partnered up with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) to realize 3D obstacle detection and collision avoidance in autonomous systems using Toposens' proprietary 3D ultrasound technology.

NXP’s vehicle networking, gateway and i.MX 8 Series processors work together to enable enhanced services, convenience and over-the-air updateable vehicles.

Electron Microscopy (EM) is a fast-evolving field. Researchers and scientists are always developing new techniques and testing new approaches, while instrument manufacturers are releasing more automated and easier-to-use microscopes and integrating new technology to help yield better results.

HARTING’s innovative har-modular® series took gold in the category of “Machines & Components” in the annual IDEA! Awards presented by Machine Design and Hydraulics & Pneumatics.

Stimio keeps IoT monitoring on track for high-value rail and utility assets with Quectel GNSS and cellular modules.

STMicroelectronics’ ST25TN512 and ST25TN01K NFC Forum Type 2 tag ICs deliver a new balance of cost and performance for high-volume use cases like consumer engagement, product information, and brand protection.

RH850/U2B MCUs Accelerate ECU Integration for Zone and Domain Control Applications with Improved Performance, Security, and Motor Control Accelerator IP.

Branson GMX-20DP Direct Press, GMX-20MA and GMX-W1 are Featured

USi®-safety Ultrasonic System for Category 3 PL d

SmartRunner Explorer 3-D Vision Sensor

International

HARTING’s innovative har-modular^® series took gold in the category of “Machines & Components” in the annual IDEA! Awards presented by Machine Design and Hydraulics & Pneumatics.

USi^®-safety Ultrasonic System for Category 3 PL d