14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

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Digi-key News

Digi-Key Electronics Offers Winning Product Combinations from Renesas and Dialog Following Completion of Merger

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, confirms its continued and extensive support of the Renesas Electronics and Dialog Semiconductor product portfolio, following the announcement of the completion of the two companies' merger on Aug. 31, 2021.

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14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

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3M News

Boron Nitride Cooling Fillers from 3M Used for Thermal Management in Advanced Polymers

Enhanced performance, reliability and energy savings in your automotive, electrical and electronic components.

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14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

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ST News

Time-of-Flight 8×8 Multi-Zone Ranging Sensor from STMicroelectronics Enables Innovative Applications

STMicroelectronics has announced the first multi-zone FlightSense time-of-flight sensor to be offered for general-purpose applications, bringing sophisticated distance sensing to the full spectrum of consumer and industrial products.

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14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

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TDK News

TDK offers new stray-field compensated 3D HAL^® sensors with redundancy function and digital output interfaces

TDK Corporation (TSE:6762) expands its Micronas 3D HAL^® sensor portfolio with the Hall-sensors HAR 3900 and HAR 3930*.

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14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

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TEKTRONIX News

Tektronix Introduces New Features in CalWeb^® Asset Management Software

Next-Gen Version Streamlines Management of Fleets of Test & Measurement Equipment for Calibration and Repair Services.

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14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

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Cliffuk News

Make fast and secure connections with Single-pole Spring Terminals from Cliff Electronics

Rugged and reliable connectors for high-end audio equipment, test equipment and pyrotechnics.

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14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

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Green HIlls News

Green Hills Software to Provide INTEGRITY-178 tuMP RTOS for Military GPS User Equipment

Green Hills Software has announced the selection of the INTEGRITY^®-178 tuMP real-time operating system (RTOS) by Raytheon Intelligence & Space (RI&S) for their offering of the Military Global Positioning System User Equipment (MGUE) Increment (Inc) 2 Miniature Serial Interface (MSI) with Next-Generation Application Specific Integrated Circuit (ASIC).

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14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

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ARROW News

Arrow Electronics offers RBZ Robot Design's System-on-Modules

SIMPLIA SoMs feature NXP^® Semiconductors processors and extensive IoT connectivity options. The SoMs are compatible with each other which means that the designs are scalable in both performance and connectivity.

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13 {{ "2021-09-13T00:00:00+00:00" | date "MMM" }} '21

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PANASONIC ELECTRIC WORKS News

20 pins, two rows - and no smarter way for high power connections

Panasonic Industry launches the new double-row CF2 board-to-FPC connector.

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13 {{ "2021-09-13T00:00:00+00:00" | date "MMM" }} '21

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Fluke Process Instruments

Fluke Process Instruments Debuts New Datapaq^® Furnace Tracking Systems for Demanding Heat Treat Applications

The new thermal profiling solutions feature new sealed quench thermal barriers and IP67 rated data logger.

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Enhanced performance, reliability and energy savings in your automotive, electrical and electronic components.

STMicroelectronics has announced the first multi-zone FlightSense time-of-flight sensor to be offered for general-purpose applications, bringing sophisticated distance sensing to the full spectrum of consumer and industrial products.

TDK Corporation (TSE:6762) expands its Micronas 3D HAL® sensor portfolio with the Hall-sensors HAR 3900 and HAR 3930*.

Next-Gen Version Streamlines Management of Fleets of Test & Measurement Equipment for Calibration and Repair Services.

Rugged and reliable connectors for high-end audio equipment, test equipment and pyrotechnics.

SIMPLIA SoMs feature NXP® Semiconductors processors and extensive IoT connectivity options. The SoMs are compatible with each other which means that the designs are scalable in both performance and connectivity.

Panasonic Industry launches the new double-row CF2 board-to-FPC connector.

The new thermal profiling solutions feature new sealed quench thermal barriers and IP67 rated data logger.

International

TDK Corporation (TSE:6762) expands its Micronas 3D HAL^® sensor portfolio with the Hall-sensors HAR 3900 and HAR 3930*.

SIMPLIA SoMs feature NXP^® Semiconductors processors and extensive IoT connectivity options. The SoMs are compatible with each other which means that the designs are scalable in both performance and connectivity.