18
'21
Written on
ST News
17
'21
Written on
Rohm Semiconductors News
ROHM’s New Compact Surface Mount 45W Output AC/DC Converter ICs: Equipped with Integrated High Voltage SJ MOSFET
Fly-back converter ICs maximize performance, reduce system costs and increase reliability for industrial and consumer power supply solutions.
17
'21
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Mouser News
Mouser Signs Global Distribution Agreement with Siretta to Deliver Leading-Edge IoT Mobile Broadband Technologies
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announced it has entered into a global distribution agreement with Siretta, a leading global manufacturer and developer of Internet of Things (IoT) products, software, and complete end-to-end solutions.
17
'21
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CEA Leti News
Invited CEA-Leti Paper at IEDM 2021 Identifies Main Challenges Facing Large-Scale Si Quantum Computing
Second Paper Details Innovative Silicon Quantum Device Integration For Effective Qubit Control.
17
'21
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Accelleran News
Accelleran technology validated through O-RAN Alliance Global Plugfest demonstrations
Success on two key test tracks emphasizes high degrees of interoperability.
17
'21
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ARROW News
Arrow Electronics introduces flexible data acquisition platform based on Analog Devices signal chain technologies and Intel® FPGA
DataStorm DAQ platform eases timing and data integrity design challenges. Arrow Electronics has announced the DataStorm DAQ, a reference, evaluation and development platform that connects Analog Devices’ (ADI) sensor and analogue-to-digital signal chain technologies to an FPGA with integrated CPU.
17
'21
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Rutronik News
Maximum reliability even under heavy workloads: ATP DDR4 and DDR3 DRAM modules at Rutronik
Long-term stability and high performance in industrial environments: in the current generation of ATP DRAM modules, the DDR4, the data transfer rate of up to 3200 MT/s ensures an increase in the possible maximum clock speed. The supply voltage here is just 1.2 V.
17
'21
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Infineon News
Improved power density: alpitronic selects Infineon's EasyPACK CoolSiC modules and EiceDRIVER X3 drivers for its 50 kW hypercharger
Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic recently introduced the state-of-the-art and industry-leading 50 kW DC electric vehicle charger HYC50.
17
'21
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CEA Leti News
HfO2-Based FeRAM Arrays Designed & Fabricated at CEA-Leti Bring the Technology Closer to Manufacturability
Unlike PZT-Based Ferroelectric Memories, These Devices Are Fully Compatible With CMOS Processes, Scalable to Advanced Nodes and Lead-Free.
17
'21
Written on
Recabuk News
