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ST News
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Leica Geosystems News
Hexagon announces Leica ContentMapper – new airborne imaging sensor for efficient large-scale content collection
Hexagon’s Geosystems division announced today the introduction of the Leica ContentMapper, an innovative and highly efficient airborne imaging sensor for large-scale geospatial mapping projects. With a 40,000 pixels swath width, this latest generation camera provides the highest performance for content programs, capturing high resolution imagery at unprecedented rates.
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TDK News
EMC Components: TDK develops industry’s first high-reliability chip beads for automotive
TDK Corporation (TSE:6762) today announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.
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ST News
STMicroelectronics’ STM32 Ecosystem Extensions Kick-Start Development with STM32U5 Extreme Low-Power Microcontrollers
STMicroelectronics has announced new STM32Cube software packs and tools, as well as evaluation boards, to accelerate development with the latest STM32U5 microcontrollers (MCUs), which are now ready for mass-market applications with stock at authorized distributors.
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Sigmatek News
SAFE ANALOG INPUT MODULE: THE SAI 041
The safe analog input module SAI 041 expands the modular S-DIAS Safety System. Four analog current inputs with a measurement range from 4-20 mA and a resolution of 16 bits, as well as the 24 V sensor supply are integrated into the 25 mm wide DIN rail module.
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Sivers Semiconductors News
Sivers Photonics exhibiting and presenting at SPIE Photonex + Vacuum Technologies in Glasgow, UK
Sivers Semiconductors AB announces today the participation at SPIE Photonex + Vacuum Technologies in Glasgow, UK. The subsidiary, Sivers Photonics, will exhibit and speak at the event taking place from 28 – 30 September.
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Prysmian Group News
Bend-insensitive fibres significantly reduce bend losses and extend the expected network lifetime, according to Prysmian
Prysmian Group highlights the impact of leveraging bend-insensitive fibres across the entire wavelength spectrum used by current and future PON technology.
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TEKTRONIX News
Tektronix releases results of its Global Engineer Survey 2021
Survey finds engineers want longer product lifetimes, greater reliability and technical support from test and measurement vendors.
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Paragraf News
Paragraf appoints Charles Platts as CFO
Paragraf, the leader in the development and production of graphene electronic devices, has appointed Charles Platts as Chief Finance Officer. Charles will support Paragraf throughout its next phase of rapid growth, and beyond, bringing a strong commercial focus.
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Blaize News
