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07  '21
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ST News

STMicroelectronics Announces Mass-Market Availability of ST4SIM GSMA-compliant eSIMs for M2M Applications

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced mass-market availability of its ST4SIM, eSIM (embedded SIM) ICs for Machine-to-Machine (M2M) applications through e-distribution.

07  '21
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TDK News

Development of an Image Diagnosis Technology Utilizing a High-Sensitivity Magnetic Sensor

Yokohama National University, a national university corporation (Yokohama-city, Kanagawa pref. President: Izuru Umehara, hereinafter “YNU”) and TDK Corporation (Tokyo, President: Shigenao Ishiguro, hereinafter “TDK”) have developed a prototype image diagnosis technology utilizing a high-sensitivity magnetic sensor*.

07  '21
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Datalogic News

DATALOGIC BRINGS SOLUTIONS FOR EVERY TRACEABILITY APPLICATION TO PACK EXPO 2021

Datalogic, a global leader in the automatic data capture and factory automation markets, is pleased to announce its participation at PACK EXPO 2021 in Las Vegas, with an extensive booth displaying traceability solutions for every application.

06  '21
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NEC Corporation News

NEC launches simulated annealing service utilizing vector supercomputers

Educational services also provided for learning the basics and applications of quantum computers. NEC Corporation (NEC; TSE: 6701) announced the launch of the "NEC Vector Annealing Service," a quantum-inspired simulated annealing service that uses a vector supercomputer, as well as the launch of educational services that enable participants to learn about quantum computers and how to use simulated annealing machines. NEC will start offering both services in November 2021.

06  '21
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Infineon News

Flexibility meets increased power density and performance: Infineon enhances 1200 V EconoDUAL 3 portfolio with IGBT7 featuring new current ratings

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new current ratings for its EconoDUAL 3 portfolio with TRENCHSTOP IGBT7 chips. With the broad range of current classes from 300 A up to 900 A, the portfolio offers inverter designers a high degree of flexibility while also providing increased power density and performance. In addition to solar and drive applications, the portfolio is also tailored for commercial, construction and agricultural vehicles (CAV) as well as for uninterruptible power supply (UPS) inverters.

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