TDK Corporation (TSE:6762) presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering and AI-heavy wire bonding. Its characteristics correspond to the common MELF-R/T curve with R100 of 493 Ω. The lead-free chip with ordering code B57860L0522J500 is designed for a wide temperature range of -55 °C to +175 °C, has dimensions of 1.6 x 1.6 x 0.5 mm.
Sivers Semiconductors AB today announced that its subsidiary Sivers Wireless has partnered with Rohde & Schwarz, a market-leading supplier of test and measurement solutions for Radio Frequency (RF) components and the wireless industry, to test the performance of Sivers Semiconductors state-of-art Radio Frequency Integrated Circuit (RFIC) TRXBF01.
Inelta is expanding its range of miniaturized displacement sensors for medical, laboratory and testing technology with the world’s smallest LVDT with a probe function: the LVDT of the IFAT series has an outer diameter of only 6 mm and is designed for the highly accurate detection of measurement ranges between 2.5 mm and 10 mm.
Electric vehicle, commercial transportation, renewable energy and storage system designers can benefit from silicon carbide stack solution that drives performance and cost efficiencies and accelerates time to market by up to six months.
New MCUs Achieve Higher-Performance, Cost-Efficient Motor Control with a High Frequency Arm Cortex®-M33 Core, a Hardware Accelerator and a Targeted Feature Set; New, Easy-to-Use Motor Control Tools and Kits Speed Design Process.
Secure-IC, the rising leader and only global provider of end-to-end cybersecurity solutions for embedded systems and connected objects today announced its participation in Consumer Electronics Show 2022 in Las Vegas, within the French Automotive Pavilion of Business France, in the part of the show dedicated to automotive technologies.
Simply stated, cloud refers to any service offered over the internet. The concept behind cloud computing is to create a ubiquitous infrastructure to enable quick, scalable access to data and information.
System developers can capitalize on the non-proprietary, open-architecture embedded computing capabilities to deliver ruggedness in harsh operating environments and speed time-to-market while achieving cost-effectiveness.