06
'22
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CEVA News
06
'22
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Infineon News
Infineon and Deeyook jointly enable precise location solution with low-power Wi-Fi chipset
The location-as-a-service (LaaS) company has invented and patented an award-winning tracking solution to determine indoor and outdoor locations of items, assets, and employees. Both companies fuse Deeyook’s ultra-precise, innovative algorithms into Infineon’s best-in-class, low power AIROC Wi-Fi® portfolio to enable an accurate, passive, ubiquitous, and efficient location solution.
06
'22
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e-con Systems News
e-con Systems launches an 18 MP MIPI camera solution for the NVIDIA Jetson Xavier NX platform
This camera module provides image output at a resolution of 18MP with great details. The e-CAM180_CUMI1820_MOD comes with 4 levels of zoom that allow users to swivel the camera from left to right, tilt it up and down, and zoom in and out of a scene.
06
'22
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Adlinktech News
ADLINK launches COM-HPC Client Type and COM Express Type 6 Modules with 12th Gen Intel® Core processors
Breakthrough Intel® Core technology with ADLINK Computer-on-Modules allow for hybrid architecture performance and a wide variety of deployment scenarios with superior performance.
06
'22
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Aceinna News
ACEINNA INS401 Inertial Navigation System (INS) and GNSS/RTK Turnkey Solution for ADAS and Autonomous Vehicle (AV) Precise Positioning
INS401 provides turnkey, high accuracy and integrity lane level positioning for current and future ADAS and AV applications that require ASIL-B.
05
'22
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Congatec News
CONGATEC LAUNCHES 10 NEW COM-HPC AND COM EXPRESS COMPUTER-ON-MODULES WITH 12TH GEN INTEL CORE PROCESSORS
Congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems.
05
'22
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Intel News
CES 2022: INTEL ACHIEVES MAJOR MILESTONES ACROSS AUTOMOTIVE, PCS AND GRAPHICS
Mobileye announces the new EyeQ® Ultra system-on-chip for autonomous vehicles and expanded relationships with major automakers, including Ford, Volkswagen Group and Geely’s ZEEKR brand. Intel launches the 12th Gen Intel® Core i9-12900HK – the world’s best gaming laptop platform1 – and delivers the new P-series product line for ultra-portable, enthusiast-class performance. Intel ships high-performance discrete graphics to customers and announces more than 50 Alchemist design wins.
05
'22
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Infineon News
Perfect combination of low power and high performance: Infineon introduces the new AIROC CYW20829 Bluetooth® LE system on chip
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the AIROC CYW20829 Bluetooth® LE system on chip (SoC).
05
'22
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NXP News
NXP Ramps Flagship 4D Imaging Radar Chip to Production, Adds New Product Tailored for Fast-Growing L2+ Market
NXP® Semiconductors (NASDAQ: NXPI) has announced two updates to its industry leading automotive radar portfolio, now designed-in at 20 top global OEMs. The industry’s first dedicated 16nm imaging radar processor, the NXP S32R45, has been released into mass production, with initial customer ramp-up starting in the first half 2022.
05
'22
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Nexcom News
