CUI Devices’ Thermal Management Group today announced the recent expansion of its dc fans and blowers product line with the addition of over 30 new series and over 500 new SKUs.
The compact and highly flexible circular connectors of binder's 670 series withstand demanding protection requirements. Rated as particularly innovative among more than 100 products, they have now received a prestigious award.
New ClockMatrix 2 Delivers Industry’s First Single Chip Network Synchronizer and Jitter Attenuator with Ultra-Low Jitter Clock Outputs While Supporting all IEEE1588 operating modes.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new AIROC Bluetooth® LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market.
Announced at IEDM 2021: Confirmed Reduced Power Consumption and Increased Speed in Write Operations on 16 nm FinFET Logic Process Embedded STT-MRAM Test Chip.
Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility