With vacuum encapsulated technology, MTM Power's focus is on encapsulated, robust, long-living, temperature-resistant and absolutely maintenance-free modules.
Anritsu Corporation is pleased to announce that it has successfully verified a number of key 3GPP Release 16 features using its Radio Communication Test Station MT8000A in combination with Samsung Electronics’ System LSI Business latest 5G Exynos Modem.
‘Behind the Builders:’ Intel Fellow Ravi Mahajan found packaging technologies were improving on a disturbingly straight line, inspiring an approach that was simple in concept but hard to pull off.
Lane Electronics, a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, are an added value “assembling distributor” for Eaton’s high performance Souriau8STA circular connectors .
Telit, a global enabler of the Internet of Things (IoT), today announced that its ME310G1 and ME910G1 modules are certified by the FCC for use on the Anterix U.S. 900 MHz network frequency, with other modules expected soon.
NEC Corporation announced the launch of carrier-grade, cloud-native Open RAN software supporting its industry-leading digital beamforming of Massive MIMO (mMIMO, Note 1). The solution will be available globally from the beginning of 2022.
STMicroelectronics’ WiSE Studio, a free-of-charge Integrated Development Environment (IDE) dedicated to the BlueNRG system-on-chip (SoC) product family, is accelerating the design of smart, connected devices that leverage the latest Bluetooth® technology.