Melexis revealed new LIN BLDC-motor pre-drivers that combine small size with high performance and power capability for automotive mechatronic applications. The MLX81340 (32KB Flash) and MLX81344 (64KB Flash) integrate three channels of high-side and low-side drivers. They control external NFETs with up to 60nC capacitance to handle applications up to 500W.
Direct integration of OPC UA Pub/Sub communication into the TwinCAT 3 runtime paves the way for straightforward realisation of machine-to-machine (M2M) and device-to-cloud (D2C) scenarios based on the OPC UA Pub/Sub specification.
The new "RDK2" development kit from Rutronik is a complete solution for firmware and hardware developers. Based on the "RDK2", proof of concepts can be created quickly and the time-to-market of products is accelerated. The modular toolkit uses the PSoC62 microcontroller from Infineon Cypress and provides an excellent solution for applications in the Internet of Things, Industrial IoT (IoT, IIoT), Smart Wearables, and Smart Home.
Confined spaces and customized cable lengths are becoming increasingly common when it comes to the cabling of machines and systems. Whether for signal, data, or power transmission, the Phoenix Contact M12 Push- Lock connectors designed for assembly enable easy and reliable conductor connection.
Kontron, a leading global provider of embedded computing Inflight Entertainment and Connectivity (IFE&C) solutions, today announces the first flight and qualification of the ACE Flight 4783 Dual Modem MODMAN.
Phoenix Contact provides a comprehensive portfolio of PCB terminal blocks and PCB connectors for Single Pair Ethernet, with which intelligent field devices can be integrated into switch-based Ethernet environments.
As the Linux open-source operating system marks its 30th anniversary, Analog Devices, Inc. (ADI) announces the expansion of its Linux distribution by recognizing over 1000 ADI peripherals supported by in kernel Linux device drivers.
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has introduced two photocouplers, “TLP5705H” and “TLP5702H,” housed in a thin SO6L package, for use as insulated gate drivers for small to medium capacity IGBTs/MOSFETs. Volume shipments start today.
Samsung adds 5G connectivity with the Exynos Auto T5123, performance with the Exynos Auto V7 and reliability with the ASIL-B certified power management IC for automobiles.