ITS World Congress -- NXP® Semiconductors has announced that it will showcase new safety scenarios enabled by vehicle-to-vehicle communication (Vehicle-to-X or V2X) as part of this year’s ITS World Congress in Hamburg.
Enables technology providers to verify consumer premises equipment (CPE). Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, is collaborating with NXP® Semiconductors to advance the development of 5G Fixed Wireless Access (FWA) solutions. The multi-generation collaboration includes 5G market deployment of non-standalone (NSA) mode for the initial phase, as well as stand-alone (SA) for the future.
World’s broadest family of NVMe data center SSDs features next-generation form factors and enhanced data security. Micron Technology, Inc., (Nasdaq: MU) today announced availability of the Micron® 7400 SSD with NVMe, delivering industry-leading form factor flexibility, PCIe Gen4 performance, and leading-edge security to meet the storage needs of demanding data center workloads.
High voltage accessory connectors and charging inlets designed specifically for ultra-rugged applications while addressing safety and reliability requirements.
TDK Corporation (TSE 6762) announces the addition of three-phase AC input models to the TDK-Lambda DRB series of economically priced DIN rail mount power supplies.
Enables manufacturers and operators to ensure network equipment supports massive data volumes and cybersecurity requirements in hyperscale data centers.