04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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Toshiba News

Toshiba Launches Thin and Compact LDO Regulators that Help to Reduce Device Size and Stabilize Power Line Output

TOKYO—Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the “TCR5RG series” of 45 LDO regulators, all housed in a thin, compact WCSP4F package. The industry-leading[1] high ripple rejection ratio[2] of the new LDO regulators bring enhanced power stabilization to DC power lines for mobile devices, such as wearables. Volume shipments start today.

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04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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Binder News

M16 connectors - The “go to” connector for high pin count applications

binder, one of the industry’s leading manufacturers of industrial circular connectors, has recently made key additions to its M16 connector series.

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04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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Maxim integrated News

Maxim Integrated’s AI Accelerator IC honored with “embedded award” at embedded world 2021 DIGITAL

The MAX78000 neural-network microcontroller was awarded for moving artificial intelligence to the edge without compromising performance in battery-powered IoT devices.

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04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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AMS News

ams innovation in medical sensing technology recognized with three Elektra Award nominations

ams (SIX: AMS), a leading worldwide supplier of high per- formance sensor solutions, announces that it is shortlisted for three Elektra awards in recognition of recent breakthroughs made by the company in medical sensing technology.

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04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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ST News

STMicroelectronics Boosts Automotive Innovation with Longevity Extension for Popular Body, Chassis, and Safety Microcontrollers

Availability of SPC56 automotive microcontrollers assured until at least 2034 by extension of longevity program to 20 years.

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04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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Hitachi News

Hitachi Developed the Hitachi Electronic Signature Service that Promotes to Eliminate Personal Seals with High Authenticity of Information by Blockchain Technology, and Starts Internal Operations

Go on sale after July as the service that contributes to new workstyle in the New Normal with supporting remote working, operational efficiency and cost reduction.

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04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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CEA Leti News

CEA-Leti Announces 17 Papers to Be Presented At Photonics West 2021 and a Virtual Workshop on March 25

CEA-Leti, a technology research institute of CEA Tech, will present 14 papers during Photonics West 2021, March 6-11, including an invited paper, "Advanced roughness characterization for 300mm Si photonics patterning & optimization".

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04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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NXP News

NXP Semiconductors and Morgan Stanley to Present Industrial & IoT Edge Processing Teach-In

NXP Semiconductors N.V. (NASDAQ: NXPI) and Morgan Stanley & Co. LLC will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative edge processing solutions for the Industrial & IoT end-market.

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04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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Comau News

Comau North America teams up with wearable robotics association to present MATE-XT webinar

On March 24, 2021, Comau's Wearable Robotics Specialist Cayla Zielinski will present the latest product in Comau's wearable exoskeleton line, MATE-XT in a webinar hosted by the Wearable Robotics Association (WearRA).

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04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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Adlinktech News

ADLINK Adopts Upverter for Full Automation of SMARC Carrier Board Design

ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter -- a web-based drag-and-drop designer tool.

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Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

Toshiba Launches Thin and Compact LDO Regulators that Help to Reduce Device Size and Stabilize Power Line Output

M16 connectors - The “go to” connector for high pin count applications

binder, one of the industry’s leading manufacturers of industrial circular connectors, has recently made key additions to its M16 connector series.

Maxim Integrated’s AI Accelerator IC honored with “embedded award” at embedded world 2021 DIGITAL

The MAX78000 neural-network microcontroller was awarded for moving artificial intelligence to the edge without compromising performance in battery-powered IoT devices.

ams innovation in medical sensing technology recognized with three Elektra Award nominations

ams (SIX: AMS), a leading worldwide supplier of high per- formance sensor solutions, announces that it is shortlisted for three Elektra awards in recognition of recent breakthroughs made by the company in medical sensing technology.

STMicroelectronics Boosts Automotive Innovation with Longevity Extension for Popular Body, Chassis, and Safety Microcontrollers

Availability of SPC56 automotive microcontrollers assured until at least 2034 by extension of longevity program to 20 years.

Hitachi Developed the Hitachi Electronic Signature Service that Promotes to Eliminate Personal Seals with High Authenticity of Information by Blockchain Technology, and Starts Internal Operations

Go on sale after July as the service that contributes to new workstyle in the New Normal with supporting remote working, operational efficiency and cost reduction.

CEA-Leti Announces 17 Papers to Be Presented At Photonics West 2021 and a Virtual Workshop on March 25

CEA-Leti, a technology research institute of CEA Tech, will present 14 papers during Photonics West 2021, March 6-11, including an invited paper, "Advanced roughness characterization for 300mm Si photonics patterning & optimization".

NXP Semiconductors and Morgan Stanley to Present Industrial & IoT Edge Processing Teach-In

NXP Semiconductors N.V. (NASDAQ: NXPI) and Morgan Stanley & Co. LLC will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative edge processing solutions for the Industrial & IoT end-market.

Comau North America teams up with wearable robotics association to present MATE-XT webinar

On March 24, 2021, Comau's Wearable Robotics Specialist Cayla Zielinski will present the latest product in Comau's wearable exoskeleton line, MATE-XT in a webinar hosted by the Wearable Robotics Association (WearRA).

ADLINK Adopts Upverter for Full Automation of SMARC Carrier Board Design

ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter -- a web-based drag-and-drop designer tool.

International