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Fraunhofer News

Certainty in just 15 minutes – researchers develop a graphene oxide-based rapid test to detect infections

Researchers at the Fraunhofer Institute for Reliability and Microintegration IZM have joined forces with partners in industry and healthcare to develop a handy graphene oxide-based sensor platform to detect acute infections such as sepsis or the antibodies against the coronavirus within minutes.

Vision Components News

MIPI camera and driver for NVIDIA developer kit

Vision Components has added a new starter pack to its MIPI product range for embedded vision projects: users simply connect the camera module and MIPI cable to their NVIDIA Jetson Nano Developer Kit, and they are ready set to start application development.

Ngk insulators News

Chip-type Ceramic Secondary Battery “EnerCera” Series of New Power Sources for IoT Devices Exhibiting a Power Source Module Jointly with TOREX SEMICONDUCTOR LTD. in CES 2020

NGK INSULATORS, LTD. (hereinafter "NGK") based in Nagoya, Japan, announced that it will exhibit a maintenance-free small power source module for IoT devices at CES 2020 jointly with TOREX SEMICONDUCTOR LTD. (President: Koji Shibamiya, Headquarters: Chuo-ku, Tokyo; hereinafter “TOREX”).

ST News

STMicroelectronics Eases Design of Advanced Energy-Saving Power Supplies with Eco-Certified 400W Evaluation Board

STMicroelectronics’ EVL400W-EUPL7 evaluation board delivers a ready-to-use 400-Watt power-supply solution that meets today’s toughest eco-design norms. The board leverages innovative features of ST’s L4984D current-mode PFC controller and L6699 resonant half-bridge controller to maximize energy efficiency in multiple operating modes.

Siemens News

Siemens’ lightning atlas: Speyer is Germany’s “lightning capital” in 2019 – a year low in lightning activity

The city of Speyer in the state of Rheinland-Palatinate was Germany’s “lightning capital” in 2019. Siemens’ lightning information service BLIDS (which stands for Blitz-Informationsdienst von Siemens) detected just under 3.1 lightning strikes per square kilometer in Speyer in 2019.

Toshiba News

Toshiba’s New Device Structure Improves SiC MOSFET Reliability

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced a new device structure that improves the reliability of SiC MOSFET [1]. Schottky barrier diodes [2] (SBDs) embedded into the MOSFET realize a structure that improves reliability more than 10 times [3] compared to Toshiba’s typical structure while suppressing any rise in on-resistance.

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