21
'25
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Yokogawa News
21
'25
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Rutronik News
Next Gen-module for innovative Bluetooth 6 applications– at Rutronik
Rutronik is expanding its wireless portfolio to include the next generation PAN B511-1x Bluetooth 6module from Panasonic.
21
'25
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Microchip News
Artificial Intelligence Meets Embedded Development with Microchip’s MPLAB AI Coding Assistant
Microchip’s MPLAB AI Coding Assistant, a VS Code extension, will help software developers & embedded engineers write & debug code using AI-powered real-time support & chatbot integration.
21
'25
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Aetina
Aetina Introduces AI-Powered Edge Computing Innovations at Embedded World 2025
Aetina delivers a robust portfolio of edge AI hardware and software solutions, empowering businesses worldwide to unlock new opportunities at the intelligent edge.
21
'25
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Vision Components News
Phytec and Vision Components announce partnership
The partnership enables users to easily operate all of VC's 50+ MIPI cameras with Phytec embedded imaging processor boards.
20
'25
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Rohm Semiconductors News
ROHM’s New TVS Diodes: Supporting High-Speed CAN FD In-Vehicle Communication Systems for Autonomous Driving
The low-capacitance design prevents signal degradation, while high surge current rating provides enhanced protection for automotive electronic devices.
20
'25
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STMicroelectronics News
Unlock the future of digital power with STMicroelectronics' STM32 MCUs
STM32 MCUs revolutionize digital power with advanced software, & reference designs, enabling efficiency, precise control, flexibility, & real-time monitoring for power management solutions.
20
'25
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Anritsu News
Joint EMITE and Anritsu solution supporting MIMO for OTA measurements on IEEE 802.11be (Wi-Fi 7)
EMITE and Anritsu Corporation announce the enhanced functionality to the Over-the-Air (OTA) measurement solution, allowing measuring to compliance with the latest Wireless LAN standard IEEE 802.11be for 2x2 MIMO.
20
'25
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Hema Electronic News
Hema Electronic Presents Embedded Vision Solutions for challenging applications
Hema electronic will be presenting its solutions for the development of individual electronics for signal data processing, sensor fusion and video data management at embedded world 2025 (March 11-13, Messe Nuremberg).
20
'25
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Renesas News
