Siemens is collaborating with TSMC on certifications and innovative design solutions at the OIP Forum, accelerating 3D IC and AI-driven circuit and systems design for mutual customers using TSMC's advanced process technologies.
Trial using the Coherent OTDR MW90010B enables fault detection and crosstalk visualization in submarine multicore fiber, boosting reliability of global communications.
New AL58818Q and AL58812Q simplify dynamic lighting with digital color mixing, 12-bit PWM, and precise brightness control for rear lamps, displays, and ambient systems.
Supporting 8.2–44 V and up to 4 A output, the compact Click board integrates PWM current drive, torque adjustment, fault monitoring, and rapid prototyping for industrial robotics.
Weighing just 36 g, the smallest DC relay in the industry, Omron’s G9JH-1-E, available via Rutronik, withstands 100,000+ switches, 30 A inrush, -40 °C to +85 °C, and 4,500 V impulse.
Mutual adoption of top-side cooling and DOT-247 packages enhances thermal performance, doubles power density, and provides customers with interchangeable SiC solutions for EV, AI, and renewable applications.
Qualcomm has announced the Snapdragon 8 Elite Gen 5, which it calls the world’s fastest mobile System-on-a-Chip (SoC), designed to establish new consumer experiences and set new industry performance benchmarks.
Avalue's BMX-P820 barebone system supports Intel 14th Gen CPUs, DDR5 memory, and PCIe expansion for AI acceleration, operating below 40dB for industrial automation.