24 {{ "2025-09-24T00:00:00+00:00" | date "MMM" }} '25

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STMicroelectronics News

STARLight Project named European consortium leader in next-gen Silicon Photonics on 300mm wafers

24 leading technology companies and universities from 11 EU countries are joining efforts, driven by STMicroelectronics, to establish Europe as a technology leader in 300mm silicon photonics (SiPho) technology.

Read more…

23 {{ "2025-09-23T00:00:00+00:00" | date "MMM" }} '25

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ams OSRAM News

Reliable capacitive sensing for demanding automotive environments

The AS8580 from ams OSRAM uses robust capacitive sensing with IQ demodulation, improving resilience to environmental factors while maintaining high sensitivity for interior and exterior automotive applications.

Read more…

23 {{ "2025-09-23T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-23T00:00:00+00:00" | date "longDate" }}

Infineon News

Hardware-Based Security Shields Edge AI Models and Data

Infineon's OPTIGA Trust M security controller provides a hardware root-of-trust for Thistle's platform, enabling AES-256 model encryption and secure OTA updates for edge AI on Linux and MCU-based devices.

Read more…

23 {{ "2025-09-23T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-23T00:00:00+00:00" | date "longDate" }}

Rutronik News

SCHURTER DG11 Modules Enhanced with Magnetic Short-Circuit Protection

Rutronik introduces SCHURTER DG11 modules with magnetic release in TA35 breaker, delivering fuse-free short-circuit protection and high IP67-rated reliability for industrial and medical applications.

Read more…

23 {{ "2025-09-23T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-23T00:00:00+00:00" | date "longDate" }}

Siemens News

Siemens Unveils Tessent IJTAG Pro to Accelerate Semiconductor Test

Siemens’ Tessent IJTAG Pro enables parallel operations, reducing test time and costs for 2D, 2.5D, and 3D IC architectures.

Read more…

23 {{ "2025-09-23T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-23T00:00:00+00:00" | date "longDate" }}

Mediatek News

MediaTek Dimensity 9500 Sets Benchmark in AI, Gaming, Power Efficiency

MediaTek Dimensity 9500 boosts 32% CPU, 33% GPU, 200MP imaging, 4K AI, and 30% efficiency, powering flagship 5G smartphones.

Read more…

23 {{ "2025-09-23T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-23T00:00:00+00:00" | date "longDate" }}

Leankon News

Leankon Unveils Next-Gen NFC Antenna Solutions for Seamless Connectivity

The new LK1860xxx series offers versatile sizes, metal-interference mitigation, and customizable options to empower future-ready designs across industries.

Read more…

22 {{ "2025-09-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-22T00:00:00+00:00" | date "longDate" }}

Econ Systems News

e-con Systems extends Renesas RZ/G3E support for edge AI

Featuring Sony STARVIS and onsemi sensors with built-in ISP, e-con Systems delivers distortion-free Full HD imaging at 120 fps, enabling reliable industrial, automotive, and smart city applications.

Read more…

22 {{ "2025-09-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-22T00:00:00+00:00" | date "longDate" }}

Morse Micro News

Wi-Fi HaLow Enables Flexible Backhaul for LoRaWAN Gateways

Morse Micro and The Things Industries demonstrate Wi-Fi HaLow backhaul for LoRaWAN gateways, integrating with The Things Stack at The Things Conference 2025.

Read more…

22 {{ "2025-09-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-22T00:00:00+00:00" | date "longDate" }}

Avalue News

Avalue Introduces Rugged Open Standard Modules for Next-Gen IoT

Avalue unveils three OSM COMs with NXP and Rockchip processors, delivering energy efficiency, AI acceleration, and rugged reliability for industrial IoT, robotics, and multimedia applications.

Read more…

Technical Articles

Basler Enhances Probe Card Inspection with Advanced Vision & Autofocus Solutions

Case studies

Mitutoyo's Measuring Machines and Equipment Ensuring Quality at Purso-Tools

STARLight Project named European consortium leader in next-gen Silicon Photonics on 300mm wafers

24 leading technology companies and universities from 11 EU countries are joining efforts, driven by STMicroelectronics, to establish Europe as a technology leader in 300mm silicon photonics (SiPho) technology.

Reliable capacitive sensing for demanding automotive environments

The AS8580 from ams OSRAM uses robust capacitive sensing with IQ demodulation, improving resilience to environmental factors while maintaining high sensitivity for interior and exterior automotive applications.

Hardware-Based Security Shields Edge AI Models and Data

Infineon's OPTIGA Trust M security controller provides a hardware root-of-trust for Thistle's platform, enabling AES-256 model encryption and secure OTA updates for edge AI on Linux and MCU-based devices.

SCHURTER DG11 Modules Enhanced with Magnetic Short-Circuit Protection

Rutronik introduces SCHURTER DG11 modules with magnetic release in TA35 breaker, delivering fuse-free short-circuit protection and high IP67-rated reliability for industrial and medical applications.

Siemens Unveils Tessent IJTAG Pro to Accelerate Semiconductor Test

Siemens’ Tessent IJTAG Pro enables parallel operations, reducing test time and costs for 2D, 2.5D, and 3D IC architectures.

MediaTek Dimensity 9500 Sets Benchmark in AI, Gaming, Power Efficiency

MediaTek Dimensity 9500 boosts 32% CPU, 33% GPU, 200MP imaging, 4K AI, and 30% efficiency, powering flagship 5G smartphones.

Leankon Unveils Next-Gen NFC Antenna Solutions for Seamless Connectivity

The new LK1860xxx series offers versatile sizes, metal-interference mitigation, and customizable options to empower future-ready designs across industries.

e-con Systems extends Renesas RZ/G3E support for edge AI

Featuring Sony STARVIS and onsemi sensors with built-in ISP, e-con Systems delivers distortion-free Full HD imaging at 120 fps, enabling reliable industrial, automotive, and smart city applications.

Wi-Fi HaLow Enables Flexible Backhaul for LoRaWAN Gateways

Morse Micro and The Things Industries demonstrate Wi-Fi HaLow backhaul for LoRaWAN gateways, integrating with The Things Stack at The Things Conference 2025.

Avalue Introduces Rugged Open Standard Modules for Next-Gen IoT

Avalue unveils three OSM COMs with NXP and Rockchip processors, delivering energy efficiency, AI acceleration, and rugged reliability for industrial IoT, robotics, and multimedia applications.

International