Compact Mini-STX platform with Intel Core Ultra SoCs and integrated NPU delivers up to 20× higher performance per watt for embedded AI, digital signage, medical, and industrial applications.
On show in Utrecht (23–25 September), the extended portfolio boosts flexibility, density, and functionality for RF & microwave test systems up to 110 GHz.
STMicroelectronics launched a new PLP pilot line in Tours, France to develop innovative chip packaging technology, boosting efficiency and flexibility as part of its strategic initiative on heterogeneous integration.
The RA0L1 delivers ultra-low power consumption with just 2.9mA active current, 0.25µA standby, fast wake-up via integrated HOCO, and robust capacitive touch for cost-sensitive applications.
Vishay’s SMDY1 Automotive Series capacitors provide 500 VAC Y1 safety rating, AEC-Q200 compliance, EMI suppression, and cost-efficient surface-mount assembly for EV power electronics.
The AIMS EUV 3.0 mask qualification tool is fully compatible with High-NA-EUV technology, supporting both Low-NA and High-NA-EUV imaging to give chip manufacturers strategic advantages and flexibility.
New GenioSOM-700 and GenioSOM-510 deliver high-performance AI, vision, and IoT capabilities, backed by privileged access to MediaTek’s products, roadmaps, and technical support.
IBASE's IBR500 SBC utilizes MediaTek Genio 700/510 processors to deliver 3.2 TOPS AI performance in a compact 3.5” form factor for edge AIoT deployments.
The SE869EK5-DR offers reliable, uninterrupted location data with Untethered Dead Reckoning, ideal for fleet management, automotive telematics, and asset tracking in mission-critical applications.