The new MLPF-WL-01D3/02D3/04D3 ICs combine impedance matching and harmonic filtering on a single glass substrate to optimize the main radio’s RF performance.
Basler's patented vision solution delivers fast, clear, full inspection of Through Glass Vias, addressing challenges in semiconductor panel-level packaging.
TME now offers Amphenol GEC’s PowerLok power connectors, ideal for EV, hybrid automotive, and renewable energy applications, including energy storage systems.
The R2 platform will use silicon carbide (SiC) and silicon (Si) modules from Infineon’s HybridPACK Drive G2 family. Supply is expected to start in 2026.
Optimized for on-device AI, this 15% thinner, low-power solution features the world's highest 321-layer product, boosting SK hynix's leadership in AI memory for flagship smartphones.