19 {{ "2025-06-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-19T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Enables AMD PCIe 64 GT/s Compliance

With speeds of up to 256 GB/s using 16 lanes, PCIe 6.0 is designed to enable faster data transfer, lower latency, and better energy efficiency.

Read more…

19 {{ "2025-06-19T00:00:00+00:00" | date "MMM" }} '25

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TDK News

TDK unveils automotive power-over-coax inductor with top-tier simplicity and efficiency

Compact, efficient PoC inductor simplifies ADAS design with single-component filtering, reduces wiring complexity, and ensures high performance, reliability, and durability in automotive applications.

Read more…

18 {{ "2025-06-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-18T00:00:00+00:00" | date "longDate" }}

Syensqo News

Syensqo expands market-first non-fluorosurfactant perfluoroelastomers portfolio

Syensqo expands its NFS FFKM portfolio with new peroxide-curable grades, offering high-performance, surfactant-free sealing solutions for extreme semiconductor and industrial environments.

Read more…

18 {{ "2025-06-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-18T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon Launches SECORA ID V2, eID-OS for Faster ID Solutions

Infineon’s new ID solutions offer flexibility, faster deployment, and innovative packaging to meet local eID project needs amid growing global digitalization demands.

Read more…

18 {{ "2025-06-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-18T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics Unveils Human Presence Detection to Enhance PC User Experience

New AI-driven ToF solution reduces daily power use by over 20% while enhancing user security, privacy, and overall PC experience.

Read more…

18 {{ "2025-06-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-18T00:00:00+00:00" | date "longDate" }}

CEA Leti News

Applied Materials and CEA-Leti Expand Joint Lab to Pioneer Energy-Efficient AI Chips

Applied Materials and CEA-Leti’s expanded Grenoble lab will drive ICAPS semiconductor innovation for AI data centers and IoT/automotive markets.

Read more…

17 {{ "2025-06-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-17T00:00:00+00:00" | date "longDate" }}

Siemens digital Industry Software News

Siemens, Samsung Foundry collaborate on advanced EDA, product certifications

These certifications cover Samsung's FinFET and MBCFET processes (14nm-2nm), enabling customers to confidently use Siemens' Calibre, Solido, and Aprisa software for next-gen semiconductor design.

Read more…

17 {{ "2025-06-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-17T00:00:00+00:00" | date "longDate" }}

LAPP UK

LAPP Buys Industrial Connectors Company in China

By joining forces with the Chinese circular connectors specialist based in southern China, LAPP aims to expand its global market presence and manufacturing footprint for industrial connectors.

Read more…

17 {{ "2025-06-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-17T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu Launches Compact MG36021A Synthesiser

The EcoSyn Lite MG36021A offers 10 MHz–20 GHz range, low phase noise, fast switching, compact size, and easy automation.

Read more…

17 {{ "2025-06-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-17T00:00:00+00:00" | date "longDate" }}

Kyocera News

KYOCERA AVX Chip Antennas Support the Surging SiP Market

KYOCERA AVX offers compact, high-performance 2.4GHz antennas ideal for SiP modules in IoT, wearables, and automotive, enabling faster design and miniaturization.

Read more…

Technical Articles

What You Should Know About RFID Tags

Case studies

IDS: See. Align. Place

White Paper

Maximize Your Power System Efficiency — Download Our Whitepaper!

Keysight Enables AMD PCIe 64 GT/s Compliance

With speeds of up to 256 GB/s using 16 lanes, PCIe 6.0 is designed to enable faster data transfer, lower latency, and better energy efficiency.

TDK unveils automotive power-over-coax inductor with top-tier simplicity and efficiency

Compact, efficient PoC inductor simplifies ADAS design with single-component filtering, reduces wiring complexity, and ensures high performance, reliability, and durability in automotive applications.

Syensqo expands market-first non-fluorosurfactant perfluoroelastomers portfolio

Syensqo expands its NFS FFKM portfolio with new peroxide-curable grades, offering high-performance, surfactant-free sealing solutions for extreme semiconductor and industrial environments.

Infineon Launches SECORA ID V2, eID-OS for Faster ID Solutions

Infineon’s new ID solutions offer flexibility, faster deployment, and innovative packaging to meet local eID project needs amid growing global digitalization demands.

STMicroelectronics Unveils Human Presence Detection to Enhance PC User Experience

New AI-driven ToF solution reduces daily power use by over 20% while enhancing user security, privacy, and overall PC experience.

Applied Materials and CEA-Leti Expand Joint Lab to Pioneer Energy-Efficient AI Chips

Applied Materials and CEA-Leti’s expanded Grenoble lab will drive ICAPS semiconductor innovation for AI data centers and IoT/automotive markets.

Siemens, Samsung Foundry collaborate on advanced EDA, product certifications

These certifications cover Samsung's FinFET and MBCFET processes (14nm-2nm), enabling customers to confidently use Siemens' Calibre, Solido, and Aprisa software for next-gen semiconductor design.

LAPP Buys Industrial Connectors Company in China

By joining forces with the Chinese circular connectors specialist based in southern China, LAPP aims to expand its global market presence and manufacturing footprint for industrial connectors.

Anritsu Launches Compact MG36021A Synthesiser

The EcoSyn Lite MG36021A offers 10 MHz–20 GHz range, low phase noise, fast switching, compact size, and easy automation.

KYOCERA AVX Chip Antennas Support the Surging SiP Market

KYOCERA AVX offers compact, high-performance 2.4GHz antennas ideal for SiP modules in IoT, wearables, and automotive, enabling faster design and miniaturization.

International

Technical Articles

Case studies

White Paper

With speeds of up to 256 GB/s using 16 lanes, PCIe 6.0 is designed to enable faster data transfer, lower latency, and better energy efficiency.

Compact, efficient PoC inductor simplifies ADAS design with single-component filtering, reduces wiring complexity, and ensures high performance, reliability, and durability in automotive applications.

Syensqo expands its NFS FFKM portfolio with new peroxide-curable grades, offering high-performance, surfactant-free sealing solutions for extreme semiconductor and industrial environments.

Infineon’s new ID solutions offer flexibility, faster deployment, and innovative packaging to meet local eID project needs amid growing global digitalization demands.

New AI-driven ToF solution reduces daily power use by over 20% while enhancing user security, privacy, and overall PC experience.

Applied Materials and CEA-Leti’s expanded Grenoble lab will drive ICAPS semiconductor innovation for AI data centers and IoT/automotive markets.

These certifications cover Samsung's FinFET and MBCFET processes (14nm-2nm), enabling customers to confidently use Siemens' Calibre, Solido, and Aprisa software for next-gen semiconductor design.

By joining forces with the Chinese circular connectors specialist based in southern China, LAPP aims to expand its global market presence and manufacturing footprint for industrial connectors.

The EcoSyn Lite MG36021A offers 10 MHz–20 GHz range, low phase noise, fast switching, compact size, and easy automation.

KYOCERA AVX offers compact, high-performance 2.4GHz antennas ideal for SiP modules in IoT, wearables, and automotive, enabling faster design and miniaturization.

International

The EcoSyn Lite MG36021A offers 10 MHz–20 GHz range, low phase noise, fast switching, compact size, and easy automation.