10 {{ "2025-07-10T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-10T00:00:00+00:00" | date "longDate" }}

Rutronik News

ROHM Launches 4th Gen SiC MOSFETs at Rutronik

ROHM’s Gen 4 SiC MOSFETs at Rutronik deliver low on-resistance, reduced switching loss, and 175 °C reliability with integrated drivers and evaluation boards.

Read more…

10 {{ "2025-07-10T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-10T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Würth Elektronik expands its range of coaxial connectors

Würth Elektronik expands its coaxial connector range for 50-Ω cables, offering gold-plated, corrosion-tested WR-SMA, WR-SMB, WR-MCX, and WR-MMCX connectors with no MOQ.

Read more…

10 {{ "2025-07-10T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-10T00:00:00+00:00" | date "longDate" }}

Renesas News

RA2T1 MCU Targets Efficient Single-Motor Control in Home Appliances

Renesas launches RA2T1 MCUs with advanced motor control features for efficient, safe operation in power tools, fans, and appliances.

Read more…

10 {{ "2025-07-10T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-10T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

IDS: Camera-Based System Ensures Accurate Passenger Counts on Ferries

AI-driven camera solution meets international ferry regulations while streamlining boarding and enhancing transport data accuracy.

Read more…

10 {{ "2025-07-10T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-10T00:00:00+00:00" | date "longDate" }}

Huber+Suhner News

HUBER+SUHNER Unveils VITA 67.3 RF Interconnect

HUBER+SUHNER introduces its new high-performance interconnect portfolio for aerospace/defense, enabling miniaturized, reliable, high-frequency signal transmission via MINIBEND technology.

Read more…

09 {{ "2025-07-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-09T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu and Bluetest Launch 5G RedCap OTA Test Solution for IoT

Anritsu’s MT8000A and Bluetest’s RTS chambers enable fast OTA testing of 5G RedCap IoT devices per 3GPP Release 17 requirements.

Read more…

09 {{ "2025-07-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-09T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Ships Quectel FCMA62N Wi-Fi 6/Bluetooth 5.3 Modules for Next-Gen IoT

Compact, low-power FCMA62N modules with Arm Cortex-M33 now available for smart home, industrial, automotive, and medical applications.

Read more…

09 {{ "2025-07-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-09T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM Launches Ultra-Compact MOSFET with Industry-Leading 2.0mΩ ON-Resistance for Fast Charging

New 2.0mm × 2.0mm AW2K21 MOSFET enables high-current, bidirectional protection with up to 81% footprint reduction—ideal for smartphones and portable devices.

Read more…

08 {{ "2025-07-08T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-08T00:00:00+00:00" | date "longDate" }}

MURATA News

Murata Unveils First High-Frequency XBAR Filter for Next-Gen Networks

Murata begins mass production of XBAR high-frequency filters, enabling low-loss, high-attenuation performance for 5G, Wi-Fi 7, and future 6G applications.

Read more…

08 {{ "2025-07-08T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-08T00:00:00+00:00" | date "longDate" }}

Mitutoyo Europe

Made to Measure: New Mitutoyo Europe President Sets Out Plans for Growth

Ray Penny becomes the first non-Japanese President of Mitutoyo Europe, marking a strategic shift toward new growth and continued metrology market leadership.

Read more…

Technical Articles

What You Should Know About RFID Tags

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

White Paper

Maximize Your Power System Efficiency

ROHM Launches 4th Gen SiC MOSFETs at Rutronik

ROHM’s Gen 4 SiC MOSFETs at Rutronik deliver low on-resistance, reduced switching loss, and 175 °C reliability with integrated drivers and evaluation boards.

Würth Elektronik expands its range of coaxial connectors

Würth Elektronik expands its coaxial connector range for 50-Ω cables, offering gold-plated, corrosion-tested WR-SMA, WR-SMB, WR-MCX, and WR-MMCX connectors with no MOQ.

RA2T1 MCU Targets Efficient Single-Motor Control in Home Appliances

Renesas launches RA2T1 MCUs with advanced motor control features for efficient, safe operation in power tools, fans, and appliances.

IDS: Camera-Based System Ensures Accurate Passenger Counts on Ferries

AI-driven camera solution meets international ferry regulations while streamlining boarding and enhancing transport data accuracy.

HUBER+SUHNER Unveils VITA 67.3 RF Interconnect

HUBER+SUHNER introduces its new high-performance interconnect portfolio for aerospace/defense, enabling miniaturized, reliable, high-frequency signal transmission via MINIBEND technology.

Anritsu and Bluetest Launch 5G RedCap OTA Test Solution for IoT

Anritsu’s MT8000A and Bluetest’s RTS chambers enable fast OTA testing of 5G RedCap IoT devices per 3GPP Release 17 requirements.

Mouser Ships Quectel FCMA62N Wi-Fi 6/Bluetooth 5.3 Modules for Next-Gen IoT

Compact, low-power FCMA62N modules with Arm Cortex-M33 now available for smart home, industrial, automotive, and medical applications.

ROHM Launches Ultra-Compact MOSFET with Industry-Leading 2.0mΩ ON-Resistance for Fast Charging

New 2.0mm × 2.0mm AW2K21 MOSFET enables high-current, bidirectional protection with up to 81% footprint reduction—ideal for smartphones and portable devices.

Murata Unveils First High-Frequency XBAR Filter for Next-Gen Networks

Murata begins mass production of XBAR high-frequency filters, enabling low-loss, high-attenuation performance for 5G, Wi-Fi 7, and future 6G applications.

Made to Measure: New Mitutoyo Europe President Sets Out Plans for Growth

Ray Penny becomes the first non-Japanese President of Mitutoyo Europe, marking a strategic shift toward new growth and continued metrology market leadership.

International

Technical Articles

Case studies

White Paper

ROHM’s Gen 4 SiC MOSFETs at Rutronik deliver low on-resistance, reduced switching loss, and 175 °C reliability with integrated drivers and evaluation boards.

Würth Elektronik expands its coaxial connector range for 50-Ω cables, offering gold-plated, corrosion-tested WR-SMA, WR-SMB, WR-MCX, and WR-MMCX connectors with no MOQ.

Renesas launches RA2T1 MCUs with advanced motor control features for efficient, safe operation in power tools, fans, and appliances.

AI-driven camera solution meets international ferry regulations while streamlining boarding and enhancing transport data accuracy.

HUBER+SUHNER introduces its new high-performance interconnect portfolio for aerospace/defense, enabling miniaturized, reliable, high-frequency signal transmission via MINIBEND technology.

Anritsu’s MT8000A and Bluetest’s RTS chambers enable fast OTA testing of 5G RedCap IoT devices per 3GPP Release 17 requirements.

Compact, low-power FCMA62N modules with Arm Cortex-M33 now available for smart home, industrial, automotive, and medical applications.

New 2.0mm × 2.0mm AW2K21 MOSFET enables high-current, bidirectional protection with up to 81% footprint reduction—ideal for smartphones and portable devices.

Murata begins mass production of XBAR high-frequency filters, enabling low-loss, high-attenuation performance for 5G, Wi-Fi 7, and future 6G applications.

Ray Penny becomes the first non-Japanese President of Mitutoyo Europe, marking a strategic shift toward new growth and continued metrology market leadership.

International

ROHM’s Gen 4 SiC MOSFETs at Rutronik deliver low on-resistance, reduced switching loss, and 175 °C reliability with integrated drivers and evaluation boards.