TDK introduces new configurations for its ZWS-C industrial AC-DC power supplies, adding L-brackets, PCB pins, and board coatings to improve flexibility and durability in automation, robotics, and test equipment.
Qualcomm advances 5G with X85 Modem-RF, Open RAN adoption, 5G Advanced FWA, industrial IoT modems, AI collaboration with IBM, and Snapdragon-powered AI experiences.
Infineon’s REAL3 Time-of-Flight enables the next level of navigation and object recognition of robot cleaners with best-in-class performance and space efficiency.
Aetina and Axelera AI have partnered to deliver high-performance, power-efficient AI inference solutions for industries such as smart transportation, surveillance, and retail.
Designed for high-speed and precise operations, the D-Bot achieves movement speeds of up to 200 degrees per second, with an accuracy of ±0.02mm, ensuring optimal performance in various industrial applications.