18 {{ "2026-02-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-18T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Introduces 6500V Press Pack IEGT

New 2000A trench-type IEGT supports high-voltage DC transmission, industrial drives and STATCOM systems with improved turn-off capability and compact converter design.

Read more…

18 {{ "2026-02-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-18T00:00:00+00:00" | date "longDate" }}

TDK News

High-temperature NTC thermistors expand automotive sensing capabilities

TDK Corporation introduces new NTCSP thermistors designed for conductive-glue mounting and operation up to +175 °C, supporting high-temperature automotive power electronics and advanced sensing applications.

Read more…

18 {{ "2026-02-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-18T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Introduces 3nm TCAM for Automotive SoCs

Configurable 3nm FinFET TCAM achieves 5.27 Mb/mm² density, 0.167 fJ/bit search energy and enhanced functional safety for automotive and high-speed networking applications.

Read more…

17 {{ "2026-02-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-17T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon supports zonal E/E architecture in Neue Klasse

Collaboration with BMW Group introduces centralized computing and software-defined vehicle functions for electrified platforms, integrating networking, control and power distribution layers.

Read more…

17 {{ "2026-02-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-17T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

Fraunhofer IPMS Introduces 10G TSN Endpoint IP Core

New IP Core enables deterministic Ethernet communication at up to 10 Gbit/s for automotive, industrial and safety-critical networks.

Read more…

17 {{ "2026-02-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-17T00:00:00+00:00" | date "longDate" }}

Vision Components News

Vision Components Launches VC EvoCam with MediaTek Genio 510

Compact 65 × 40 mm board-level camera integrates Edge AI processing for embedded vision and will debut at embedded world 2026 in Nuremberg.

Read more…

16 {{ "2026-02-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-16T00:00:00+00:00" | date "longDate" }}

Samsung News

Mass-Produced HBM4 Boosts AI Datacenter Memory Bandwidth

Samsung Electronics begins industry-first commercial shipments of sixth-generation high-bandwidth memory for AI and HPC workloads.

Read more…

16 {{ "2026-02-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-16T00:00:00+00:00" | date "longDate" }}

Conrad News

High-Voltage Bench Power Supplies for R&D Testing

Conrad Sourcing Platform distributes Voltcraft laboratory units designed for controlled high-energy experiments in e-mobility, biomedical instrumentation and renewable-energy validation.

Read more…

16 {{ "2026-02-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-16T00:00:00+00:00" | date "longDate" }}

Avalue News

Thin Mini-ITX Board Targets Embedded AI Workloads

Avalue integrates Intel Core Ultra processors into compact industrial platform supporting high-bandwidth expansion and factory connectivity.

Read more…

16 {{ "2026-02-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-16T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Enterprise Data Management for AI-Enabled Chip Design

Keysight Technologies introduces SOS Enterprise to standardize development data and enable the scalable integration of AI into semiconductor design and verification processes.

Read more…

Technical Articles

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Case studies

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White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

Toshiba Introduces 6500V Press Pack IEGT

New 2000A trench-type IEGT supports high-voltage DC transmission, industrial drives and STATCOM systems with improved turn-off capability and compact converter design.

High-temperature NTC thermistors expand automotive sensing capabilities

TDK Corporation introduces new NTCSP thermistors designed for conductive-glue mounting and operation up to +175 °C, supporting high-temperature automotive power electronics and advanced sensing applications.

Renesas Introduces 3nm TCAM for Automotive SoCs

Configurable 3nm FinFET TCAM achieves 5.27 Mb/mm² density, 0.167 fJ/bit search energy and enhanced functional safety for automotive and high-speed networking applications.

Infineon supports zonal E/E architecture in Neue Klasse

Collaboration with BMW Group introduces centralized computing and software-defined vehicle functions for electrified platforms, integrating networking, control and power distribution layers.

Fraunhofer IPMS Introduces 10G TSN Endpoint IP Core

New IP Core enables deterministic Ethernet communication at up to 10 Gbit/s for automotive, industrial and safety-critical networks.

Vision Components Launches VC EvoCam with MediaTek Genio 510

Compact 65 × 40 mm board-level camera integrates Edge AI processing for embedded vision and will debut at embedded world 2026 in Nuremberg.

Mass-Produced HBM4 Boosts AI Datacenter Memory Bandwidth

Samsung Electronics begins industry-first commercial shipments of sixth-generation high-bandwidth memory for AI and HPC workloads.

High-Voltage Bench Power Supplies for R&D Testing

Conrad Sourcing Platform distributes Voltcraft laboratory units designed for controlled high-energy experiments in e-mobility, biomedical instrumentation and renewable-energy validation.

Thin Mini-ITX Board Targets Embedded AI Workloads

Avalue integrates Intel Core Ultra processors into compact industrial platform supporting high-bandwidth expansion and factory connectivity.

Enterprise Data Management for AI-Enabled Chip Design

Keysight Technologies introduces SOS Enterprise to standardize development data and enable the scalable integration of AI into semiconductor design and verification processes.

International