16 {{ "2024-10-16T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

HybridPACK™ Drive G2 Fusion: Infineon combines silicon and silicon carbide in a cutting-edge power module for e-mobility

Affordability combined with high performance and efficiency is the key to making electric mobility accessible to a broader market.

Read more…

15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

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TDK News

TDK introduces xEVCap, a standardized and modular DC link capacitor design for xEV traction inverters

The xEVCap, design for powertrain inverters in passenger cars, commercial and off-highway vehicles, and machinery tools.

Read more…

15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

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Navitas News

Navitas GaNSlim Power ICs Drive Ease-of-use, System Cost, and Energy Savings in Mobile, Consumer, and Home Appliance

Highly integrated GaN power ICs with autonomous EMI control and loss-less sensing are the industry’s fastest, smallest, and most efficient solution in an optimized DPAK-4L package.

Read more…

15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

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ASUS News

ASUS Unveils ROG Maximus, ROG Strix, TUF Gaming, Prime, and ProArt Z890 Motherboards

These motherboards are ready for Intel Core Ultra Processors (Series 2) and advanced AI, with ultrafast connectivity, intelligent features, and high performance.

Read more…

15 {{ "2024-10-15T00:00:00+00:00" | date "MMM" }} '24

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MIkroe News

MIKROE Expands NXP's FRDM-MCXN947 Capabilities with New Shield for Enhanced Click Integration

MIKROE's new Click Shield expands NXP FRDM-MCXN947's potential, enabling integration with over 1700 Click boards™ for rapid development across IoT, industrial, and automotive applications.

Read more…

14 {{ "2024-10-14T00:00:00+00:00" | date "MMM" }} '24

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Nvidia News

TSMC and NVIDIA Transform Semiconductor Manufacturing With Accelerated Computing

The application of generative AI enables creation of a near-perfect inverse mask, speeding up the overall optical proximity correction process by 2x.

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14 {{ "2024-10-14T00:00:00+00:00" | date "MMM" }} '24

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AMD News

AMD Delivers Leadership AI Performance with AMD Instinct MI325X Accelerators

These accelerators offer market leading HBM3E memory capacity and are supported by partners and customers including Dell Technologies, HPE, Lenovo, Supermicro and others.

Read more…

14 {{ "2024-10-14T00:00:00+00:00" | date "MMM" }} '24

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Alps Alpine News

Alps Alpine Develops the World’s Smallest Class TACT Switch

Combining Miniaturization and High Performance to Drive Further Evolution in Electronic Devices.

Read more…

14 {{ "2024-10-14T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon launches ultra-high current density power modules to enable high-performance AI computing

Data centers are currently responsible for more than two percent of global energy consumption. Fueled by AI, this number is expected to grow to up to around seven percent in 2030, matching the current energy consumption of India.

Read more…

11 {{ "2024-10-11T00:00:00+00:00" | date "MMM" }} '24

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Rutronik Info

Amphenol IPG Anytek terminal blocks for high-temperature applications

The IPG Anytek series terminal blocks from Amphenol are now available from Rutronik as a stock package.

Read more…

Affordability combined with high performance and efficiency is the key to making electric mobility accessible to a broader market.

The xEVCap, design for powertrain inverters in passenger cars, commercial and off-highway vehicles, and machinery tools.

Highly integrated GaN power ICs with autonomous EMI control and loss-less sensing are the industry’s fastest, smallest, and most efficient solution in an optimized DPAK-4L package.

These motherboards are ready for Intel Core Ultra Processors (Series 2) and advanced AI, with ultrafast connectivity, intelligent features, and high performance.

MIKROE's new Click Shield expands NXP FRDM-MCXN947's potential, enabling integration with over 1700 Click boards™ for rapid development across IoT, industrial, and automotive applications.

The application of generative AI enables creation of a near-perfect inverse mask, speeding up the overall optical proximity correction process by 2x.

These accelerators offer market leading HBM3E memory capacity and are supported by partners and customers including Dell Technologies, HPE, Lenovo, Supermicro and others.

Combining Miniaturization and High Performance to Drive Further Evolution in Electronic Devices.

Data centers are currently responsible for more than two percent of global energy consumption. Fueled by AI, this number is expected to grow to up to around seven percent in 2030, matching the current energy consumption of India.

The IPG Anytek series terminal blocks from Amphenol are now available from Rutronik as a stock package.

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