22
'24
Written on
ASUS News
22
'24
Written on
Toshiba News
Toshiba releases high-speed photorelay for semiconductor testers
Particularly suitable for the pin electronics of semiconductor testers, the TLP3450S makes measuring devices-under-test (DUTs) at fast speeds more precise.
22
'24
Written on
ANSYS News
Ansys to Drive Major Advances in AI-Powered Semiconductor Design Using NVIDIA AI
Integration of NVIDIA Modulus AI framework with the Ansys SeaScape platform will enable engineers to easily build customized AI solutions that can improve designer productivity and quickly identify optimal design configurations.
22
'24
Written on
SK Hynix News
SK hynix Starts Mass Production of World’s First 321-High NAND
“Three Plugs” process technology leads to technological breakthrough for stacking, improves speed, power efficiency.
21
'24
Written on
ADLINK News
ADLINK Unveils AmITX Mini-ITX Motherboards for Edge AI and IoT Applications
Two new series of Mini-ITX motherboards provide power-efficient and high-performance options for edge AI applications.
21
'24
Written on
Infineon News
Infineon launches PROFET Wire Guard with integrated I²t wire protection
Modern, decentralized, and zonal power distribution architectures require dependable solutions. With PROFET Wire Guard, Infineon Technologies AG provides developers with advanced wire protection for modern power distribution.
21
'24
Written on
PowerWalker
PowerWalker to Showcase Innovative Power Management Solutions at Data Centre World Paris 2024
PowerWalker will be exhibiting at stand C25, where it will showcase its power management solutions like the all-in-one MDC (Micro Data Center), compact-footprint TAP series, and the CPM series.
21
'24
Written on
AMD News
AMD Accelerates Exascale Computing to New Heights Powering the Fastest Supercomputer Ever, El Capitan
AMD showcased its ongoing high performance computing (HPC) leadership at Supercomputing 2024 by powering the world’s fastest supercomputer for the sixth straight Top500 list.
21
'24
Written on
Renesas News
Renesas Unveils Industry’s First Complete DDR5 MRDIMM Memory Interface Chipset Solutions
New Multiplexed Registered Clock Driver, Multiplexed Data Buffer and PMIC Enable Next-Generation MRDIMM Speeds up to 12,800 Mega Transfers per Second for AI and High-Performance Compute Applications.
20
'24
Written on
Würth Elektronik News
