OV50M40 image sensor can be used in multiple smartphone cameras to enable excellent low-light performance, high-quality tele-crop-zoom, always-on ultra-low power applications and more.
HBM4 36GB Mechanical Test Vehicle (MTV), for use by OEM customers wanting to prepare for the advanced Samsung HBM4 36GB production devices coming in 2025.
TDK Corporation has extended its EPCOS ERU27M series of SMD high current flat wire inductors consisting of an isolated alloy powder core and flat wire helical winding.
Rutronik is expanding its MOSFET portfolio with the CoolMOS™ 8 series from Infineon. It follows on from the 600 V CoolMOS™ 7 MOSFET family, including the P7, S7, CFD7, C7, G7 and PFD7 types.
Anritsu Corporation will use the upcoming ECOC 2024 in Frankfurt, Germany, Sept. 23-25, to demonstrate solutions to the challenges arising from the rapid growth in global data traffic.
Abracon reveals their newest product introduction, MMIC Low Noise Amplifiers (LNAs). These innovative amplifiers are designed to deliver exceptional performance in critical communication and signal processing applications.
Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announces a new eBook in collaboration with onsemi, exploring the use of silicon carbide (SiC) semiconductors for power system design.