11 {{ "2024-12-11T00:00:00+00:00" | date "MMM" }} '24

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innodisk

Innodisk Wins 2025 Taiwan Excellence Award for Three Major Memory and Storage Solutions

The three award-winning products are the CXL Memory Module, DDR5 Air/Immersive Dual Cooling Memory, and E1.S 4TS2-P SSD.

Read more…

10 {{ "2024-12-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-10T00:00:00+00:00" | date "longDate" }}

AST Networks  News

AST Networks Expands Services to Revolutionize Marine Electronics for Modern Vessels

AST Networks has expanded its services to provide tailored marine electronics solutions for advanced maritime operations, including bridge equipment integration, maintenance, and optimization.

Read more…

10 {{ "2024-12-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-10T00:00:00+00:00" | date "longDate" }}

Mersen News

Mersen Introduces MDC15FH65 Series 1500VDC Fuse Holders for 20X65mm Fuses

The MDC15FH65 fuse holders are IP20- rated for finger-safe operation & feature a rotating fuse carrier thus ensuring safe and easy fuse replacement.

Read more…

10 {{ "2024-12-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-10T00:00:00+00:00" | date "longDate" }}

Panasonic Industry News

Panasonic Industry releases new Low CxR PhotoMOS HS series- AQY231R1WY (1Y)

The new PhotoMOS relay in a miniature WSSOP package is designed for measuring, testing and medical equipment. The first relay of this series operates at 40V, 350mA and available in 1FormA contact arrangement .

Read more…

09 {{ "2024-12-09T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-09T00:00:00+00:00" | date "longDate" }}

Intel News

Intel Foundry Unveils Technology Advancements

Intel Foundry’s Technology Research team demonstrated industry-first advancements in transistor and packaging technologies that help meet future demands for AI.

Read more…

09 {{ "2024-12-09T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-09T00:00:00+00:00" | date "longDate" }}

Vishay News

Vishay Intertechnology Unveils 40 V MOSFET With Industry-Leading RDS(ON) for Higher Efficiency

Vishay’s SiJK140E MOSFET with 0.34 mΩ RDS(ON) in PowerPAK 10x12 packaging enhances power density, efficiency, and thermal performance for industrial applications.

Read more…

09 {{ "2024-12-09T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-09T00:00:00+00:00" | date "longDate" }}

ViewSonic

ViewSonic Unleashes Premium Console Gaming with New X1-4K Pro and X2-4K Pro Projectors

The new X1-4K Pro and X2-4K Pro projectors by ViewSonic deliver an enhanced gaming experience with 120Hz QHD visuals, ultra-low input lag, and built-in Google TV, transforming home entertainment and gaming setups.

Read more…

06 {{ "2024-12-06T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-06T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba releases automotive photorelay with high breakdown voltage of 900V

Automotive-compliant TLX9150M is suitable for 400V battery-related control systems.

Read more…

06 {{ "2024-12-06T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-06T00:00:00+00:00" | date "longDate" }}

Conrad News

Teledyne LeCroy Release New Oscilloscopes

Affordable, highly accurate and now available from Conrad: two new T3DSO1000HD series oscilloscopes featuring bandwidths of 100 MHz and 200 MHz, respectively.

Read more…

06 {{ "2024-12-06T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-06T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Delivers Industry’s First 3.5D F2F Technology for AI XPUs

Combination of 3D silicon stacking and 2.5D packaging technology enables custom compute platforms with breakthrough performance, power and cost.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

Innodisk Wins 2025 Taiwan Excellence Award for Three Major Memory and Storage Solutions

The three award-winning products are the CXL Memory Module, DDR5 Air/Immersive Dual Cooling Memory, and E1.S 4TS2-P SSD.

AST Networks Expands Services to Revolutionize Marine Electronics for Modern Vessels

AST Networks has expanded its services to provide tailored marine electronics solutions for advanced maritime operations, including bridge equipment integration, maintenance, and optimization.

Mersen Introduces MDC15FH65 Series 1500VDC Fuse Holders for 20X65mm Fuses

The MDC15FH65 fuse holders are IP20- rated for finger-safe operation & feature a rotating fuse carrier thus ensuring safe and easy fuse replacement.

Panasonic Industry releases new Low CxR PhotoMOS HS series- AQY231R1WY (1Y)

The new PhotoMOS relay in a miniature WSSOP package is designed for measuring, testing and medical equipment. The first relay of this series operates at 40V, 350mA and available in 1FormA contact arrangement .

Intel Foundry Unveils Technology Advancements

Intel Foundry’s Technology Research team demonstrated industry-first advancements in transistor and packaging technologies that help meet future demands for AI.

Vishay Intertechnology Unveils 40 V MOSFET With Industry-Leading RDS(ON) for Higher Efficiency

Vishay’s SiJK140E MOSFET with 0.34 mΩ RDS(ON) in PowerPAK 10x12 packaging enhances power density, efficiency, and thermal performance for industrial applications.

ViewSonic Unleashes Premium Console Gaming with New X1-4K Pro and X2-4K Pro Projectors

The new X1-4K Pro and X2-4K Pro projectors by ViewSonic deliver an enhanced gaming experience with 120Hz QHD visuals, ultra-low input lag, and built-in Google TV, transforming home entertainment and gaming setups.

Toshiba releases automotive photorelay with high breakdown voltage of 900V

Automotive-compliant TLX9150M is suitable for 400V battery-related control systems.

Teledyne LeCroy Release New Oscilloscopes

Affordable, highly accurate and now available from Conrad: two new T3DSO1000HD series oscilloscopes featuring bandwidths of 100 MHz and 200 MHz, respectively.

Broadcom Delivers Industry’s First 3.5D F2F Technology for AI XPUs

Combination of 3D silicon stacking and 2.5D packaging technology enables custom compute platforms with breakthrough performance, power and cost.

International