Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the automotive qualified EasyPACK 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A rms. With its featured specs, the module is optimized for inverter applications in hybrid and electric vehicles.
Ultra-compact, high-performance Edge intelligence systems. Impulse Embedded, a leading provider of industrial computing systems and solutions can now supply the EAC-2000 series from Vecow. These ultra-compact, high-performance Edge intelligence systems leverage the NVIDIA Jetson Xavier NX SOM chip.
Compact, rugged, secure wireless routers for demanding utility, infrastructure and transportation applications. Westermo has launched a new range of industrial cellular wireless products designed to provide resilient data communications for remote sites.
In order to meet Europe's (EU) ambitious climate targets, greenhouse gas emissions must be drastically reduced by 2030. To achieve this, around 28 million multi-family houses with over 80 million households must be equipped with photovoltaics. Despite the support of the EU, there are still enormous technical and regulatory obstacles, specifically with the power supply for small multi-family houses from renewable energy sources.
Test and measurement expert HBK has launched a new LDS shaker system that provides efficiency far beyond just saving time - the LDS V8750 shaker + XPAK shaker system.
The cooperation between the e-mobility specialists of Rutronik‘s Automotive Business Unit (ABU) and Vishay‘s Automotive Division realized a new reference design for a high-voltage (HV) circuit breaker with a maximum breaking capacity of 40 kW.
STMicroelectronics has increased the I2C-interface performance in the latest generation of its ST25DV-I2C dynamic NFC-tag ICs, which let the host system access the tag’s on-chip EEPROM more quickly and easily.