11 {{ "2021-12-11T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-11T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM’S NEW 13.56MHZ WIRELESS POWER SUPPLY CHIPSET UP TO 1W

ROHM Group company LAPIS Technology developed a chipset capable of providing up to 1W of wireless power for compact and streamlined wearable devices, and for industrial smart, miniaturized and sealed solution. The ML7661 (transmitter) and ML7660 (receiver) eliminate the need for an external MCU by incorporating a control circuit required for transmission/reception, resulting in the industry’s smallest system size in the 1W class. This makes it ideal for wearables with a large battery capacity designed to be worn for long time frames. Typical products are wristband blood pressure monitors, fitness trackers, smart watches, and hearing aids, for example. Moreover, the adoption of the high 13.56MHz frequency band enables the support for Near Field Communication (NFC).

Read more…

10 {{ "2021-12-10T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-10T00:00:00+00:00" | date "longDate" }}

ONSEMI News

Cloud computing has become a household term with growing significance and traction in the technology market

Simply stated, cloud refers to any service offered over the internet. The concept behind cloud computing is to create a ubiquitous infrastructure to enable quick, scalable access to data and information.

Read more…

10 {{ "2021-12-10T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-10T00:00:00+00:00" | date "longDate" }}

Secure IC News

Secure-IC announces its participation to CES 2022 and will present its solutions dedicated to the automotive market

Secure-IC, the rising leader and only global provider of end-to-end cybersecurity solutions for embedded systems and connected objects today announced its participation in Consumer Electronics Show 2022 in Las Vegas, within the French Automotive Pavilion of Business France, in the part of the show dedicated to automotive technologies.

Read more…

10 {{ "2021-12-10T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-10T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Introduces RA6T2 MCUs for Next-Generation Motor Control in Inverter Appliances, Building Automation and Industrial Drives

New MCUs Achieve Higher-Performance, Cost-Efficient Motor Control with a High Frequency Arm Cortex^®-M33 Core, a Hardware Accelerator and a Targeted Feature Set; New, Easy-to-Use Motor Control Tools and Kits Speed Design Process.

Read more…

10 {{ "2021-12-10T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-10T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip to Provide Silicon Carbide MOSFETs and Digital Gate Drivers for Mersen’s SiC Power Stack Reference Design

Electric vehicle, commercial transportation, renewable energy and storage system designers can benefit from silicon carbide stack solution that drives performance and cost efficiencies and accelerates time to market by up to six months.

Read more…

10 {{ "2021-12-10T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-10T00:00:00+00:00" | date "longDate" }}

Inelta News

The smallest LVDT with probe function in the world – from Inelta

Inelta is expanding its range of miniaturized displacement sensors for medical, laboratory and testing technology with the world’s smallest LVDT with a probe function: the LVDT of the IFAT series has an outer diameter of only 6 mm and is designed for the highly accurate detection of measurement ranges between 2.5 mm and 10 mm.

Read more…

10 {{ "2021-12-10T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-10T00:00:00+00:00" | date "longDate" }}

CK Switches News

Versatile IP67 Sealed Interlock Solution for Supports Rugged AC or DC Applications

Whether used indoors or outdoors, the reliable SL Series snap switch endures harsh environment conditions…

Read more…

10 {{ "2021-12-10T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-10T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon's 5th Generation CAPSENSE technology extends market leadership with improved robustness, reliability and lower power consumption

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today launched the company’s fifth-generation CAPSENSE capacitive and inductive touch sensing human-machine interface (HMI) technology.

Read more…

10 {{ "2021-12-10T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-10T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

Sivers Semiconductors delivers proof point of its world leading 5G mmWave technology in collaboration with Rohde & Schwarz

Sivers Semiconductors AB today announced that its subsidiary Sivers Wireless has partnered with Rohde & Schwarz, a market-leading supplier of test and measurement solutions for Radio Frequency (RF) components and the wireless industry, to test the performance of Sivers Semiconductors state-of-art Radio Frequency Integrated Circuit (RFIC) TRXBF01.

Read more…

10 {{ "2021-12-10T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-10T00:00:00+00:00" | date "longDate" }}

TDK News

THERMISTORS: TDK OFFERS HIGH-PRECISION NTC CHIPS FOR EMBEDDING INTO IGBT MODULES

TDK Corporation (TSE:6762) presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering and AI-heavy wire bonding. Its characteristics correspond to the common MELF-R/T curve with R100 of 493 Ω. The lead-free chip with ordering code B57860L0522J500 is designed for a wide temperature range of -55 °C to +175 °C, has dimensions of 1.6 x 1.6 x 0.5 mm.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

ROHM’S NEW 13.56MHZ WIRELESS POWER SUPPLY CHIPSET UP TO 1W

Cloud computing has become a household term with growing significance and traction in the technology market

Simply stated, cloud refers to any service offered over the internet. The concept behind cloud computing is to create a ubiquitous infrastructure to enable quick, scalable access to data and information.

Secure-IC announces its participation to CES 2022 and will present its solutions dedicated to the automotive market

Renesas Introduces RA6T2 MCUs for Next-Generation Motor Control in Inverter Appliances, Building Automation and Industrial Drives

New MCUs Achieve Higher-Performance, Cost-Efficient Motor Control with a High Frequency Arm Cortex^®-M33 Core, a Hardware Accelerator and a Targeted Feature Set; New, Easy-to-Use Motor Control Tools and Kits Speed Design Process.

Microchip to Provide Silicon Carbide MOSFETs and Digital Gate Drivers for Mersen’s SiC Power Stack Reference Design

Electric vehicle, commercial transportation, renewable energy and storage system designers can benefit from silicon carbide stack solution that drives performance and cost efficiencies and accelerates time to market by up to six months.

The smallest LVDT with probe function in the world – from Inelta

Versatile IP67 Sealed Interlock Solution for Supports Rugged AC or DC Applications

Whether used indoors or outdoors, the reliable SL Series snap switch endures harsh environment conditions…

Infineon's 5th Generation CAPSENSE technology extends market leadership with improved robustness, reliability and lower power consumption

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today launched the company’s fifth-generation CAPSENSE capacitive and inductive touch sensing human-machine interface (HMI) technology.

Sivers Semiconductors delivers proof point of its world leading 5G mmWave technology in collaboration with Rohde & Schwarz

THERMISTORS: TDK OFFERS HIGH-PRECISION NTC CHIPS FOR EMBEDDING INTO IGBT MODULES

International

Technical Articles

Case studies

Simply stated, cloud refers to any service offered over the internet. The concept behind cloud computing is to create a ubiquitous infrastructure to enable quick, scalable access to data and information.

New MCUs Achieve Higher-Performance, Cost-Efficient Motor Control with a High Frequency Arm Cortex®-M33 Core, a Hardware Accelerator and a Targeted Feature Set; New, Easy-to-Use Motor Control Tools and Kits Speed Design Process.

Electric vehicle, commercial transportation, renewable energy and storage system designers can benefit from silicon carbide stack solution that drives performance and cost efficiencies and accelerates time to market by up to six months.

Whether used indoors or outdoors, the reliable SL Series snap switch endures harsh environment conditions…

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today launched the company’s fifth-generation CAPSENSE capacitive and inductive touch sensing human-machine interface (HMI) technology.

International

New MCUs Achieve Higher-Performance, Cost-Efficient Motor Control with a High Frequency Arm Cortex^®-M33 Core, a Hardware Accelerator and a Targeted Feature Set; New, Easy-to-Use Motor Control Tools and Kits Speed Design Process.