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VINA Tech News

VPC hybrid capacitors from VINATech replace batteries in new, eco-friendly Samsung TV remote

Samsung's new Eco Remote uses the VINATech VPC hybrid capacitor and energy-harvesting technology. This enables charging to take place even in the dark. VPC is a high power density, eco-friendly hybrid capacitor has been developed by VINATech's R&D team using innovative technology and expertise built up over 20 years. A VPC hybrid capacitor combines the advantages of supercapacitors and batteries by using different materials for both electrodes.

KLA News

KLA Moves PCB Design-for-Manufacturability Analysis to the Cloud

KLA Corporation (NASDAQ: KLAC) today announced the launch of Frontline Cloud Services, a software solution that accelerates design-for-manufacturability (DFM) analysis and time-to-market (TTM) for complex printed circuit boards (PCBs). Advanced technologies, such as 5G and miniLED, call for PCBs with increasingly complex designs that require time-consuming, compute-intensive validation for manufacturability.

Fraunhofer News

PHOTONIC QUANTUM COMPUTER MADE IN GERMANY

Everyone is talking about quantum computers. With the help of high interconnection of as many qubits (two-state quantum systems) as possible, massive amounts of data are to be processed more easily, quickly and securely in the future. In the PhoQuant project, a consortium led by the quantum start-up Q.ANT is now researching photonic quantum computer chips - made in Germany - which can also be operated at room temperature. One of the 14 consortium partners is the Dresden-based Fraunhofer Institute for Photonic Microsystems IPMS.

Omron Components News

OMRON BRINGS SENSOR SOLUTIONS FOR INTELLIGENT SIGNAGE TO ISE 2022

Omron Electronic Components Europe will showcase sensor solutions to enhance digital signage installations and systems at ISE in Barcelona (Stand 2R430) including its human vision privacy-sensitive facial recognition technology, as well as people detection and environmental sensors.

ST News

STMicroelectronics and SEONG JI INDUSTRIAL announce new LPWA module using STM32 wireless microcontroller

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and SEONG JI INDUSTRIAL (SeongJi), a global one-stop supplier of state-of-the-art wireless connectivity modules, today announced the LSM module series for sub-GHz LPWAN from SeongJi powered by ST’s STM32WL, the world’s first Sigfox and LoRa System-on-Chip (SoC).

Renesas News

Renesas Wireless Power Charging Technology Is Integrated in Wacom Active ES® Pen Solutions

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that its wireless power charging technology is integrated in the Active ES® pen solutions from Wacom, a leader in cutting-edge digital pen and ink solutions.

BRADY

Print pre-sized labels from your phone

Brady Corporation's new M211 Label Printer is a lightweight, sturdy and wearable device that prints both pre-sized and continuous labels to identify cables and components. It can create even complex labels that can all be designed, printed and previewed from your phone.

SL Power Electronics News

SL Power Electronics simple to integrate GB Series of Power Supplies offers expanded range

New additions to the GB Series include 10, 20-, 30-, 40-, 60 and 130-Watt families. SL Power Electronics, a global leader in designing and manufacturing AC/DC power conversion solutions, has expanded their next generation range of dual certified internal power supplies with the introduction of the GB Series10, 20-, 30-, 40-, 60 and 130-Watt families.

Toshiba News

TOSHIBA FURTHER EXPANDS SUPER JUNCTION MOSFET RANGE WITH FOUR ADDITIONAL 650V DEVICES

Toshiba Electronics Europe GmbH (“Toshiba”) has added a further four N-channel super junction 650 V power MOSFET devices to extend their DTMOSVI series. The new devices build upon the market success of the current devices and will primarily be used in applications like Industrial and lighting power supply and other applications where ultimate efficiency at small form factor is a requirement.

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