18
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TDK News
18
'26
Written on
Renesas News
Renesas Introduces 3nm TCAM for Automotive SoCs
Configurable 3nm FinFET TCAM achieves 5.27 Mb/mm² density, 0.167 fJ/bit search energy and enhanced functional safety for automotive and high-speed networking applications.
17
'26
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Infineon News
Infineon supports zonal E/E architecture in Neue Klasse
Collaboration with BMW Group introduces centralized computing and software-defined vehicle functions for electrified platforms, integrating networking, control and power distribution layers.
17
'26
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Fraunhofer News
Fraunhofer IPMS Introduces 10G TSN Endpoint IP Core
New IP Core enables deterministic Ethernet communication at up to 10 Gbit/s for automotive, industrial and safety-critical networks.
17
'26
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Vision Components News
Vision Components Launches VC EvoCam with MediaTek Genio 510
Compact 65 × 40 mm board-level camera integrates Edge AI processing for embedded vision and will debut at embedded world 2026 in Nuremberg.
16
'26
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Samsung News
Mass-Produced HBM4 Boosts AI Datacenter Memory Bandwidth
Samsung Electronics begins industry-first commercial shipments of sixth-generation high-bandwidth memory for AI and HPC workloads.
16
'26
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Conrad News
High-Voltage Bench Power Supplies for R&D Testing
Conrad Sourcing Platform distributes Voltcraft laboratory units designed for controlled high-energy experiments in e-mobility, biomedical instrumentation and renewable-energy validation.
16
'26
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Avalue News
Thin Mini-ITX Board Targets Embedded AI Workloads
Avalue integrates Intel Core Ultra processors into compact industrial platform supporting high-bandwidth expansion and factory connectivity.
16
'26
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Keysight technologies News
Enterprise Data Management for AI-Enabled Chip Design
Keysight Technologies introduces SOS Enterprise to standardize development data and enable the scalable integration of AI into semiconductor design and verification processes.
13
'26
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Aaronn Electronic GmbH news
