14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Dual-Range MEMS Pressure Sensor for Altitude and Depth Measurement

STMicroelectronics introduces a compact piezoresistive sensor designed to streamline circuitry in wearable electronics by combining atmospheric and deep-water pressure monitoring.

Read more…

14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

TDK News

Dual-Die Magnetic Motor Position Sensors for ASIL D By-Wire Applications

TDK introduces Micronas HAR 3025 with stray-field compensation to ensure fail-operational commutation in redundant automotive actuators.

Read more…

14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

Toshiba News

Compact Low-Voltage eFuse ICs

Toshiba Electronic Devices and Storage Corporation introduces the TCKE5 Series of low-voltage eFuse ICs, protecting compact industrial rails and portable electronics from overcurrent and short-circuit faults.

Read more…

13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Infimotion News

InfiMotion highlights advanced electric drives at Paris Motor Show

The supplier powers multiple automotive brands with integrated 800V and 900V high-efficiency traction systems.

Read more…

13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Infineon News

Digital Power-Path Protection for 800-Volt AI Server Architectures

Infineon Technologies introduces a control system designed to manage high-voltage direct current connections and ensure operational stability within scalable data center infrastructure.

Read more…

13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Link Layer Retry Validation in AI Ethernet Fabrics

Keysight demonstrates multi-vendor Link Layer Retry interoperability with Broadcom and Alibaba Cloud at the 2026 OCP Global Summit for AI scale-up networking.

Read more…

13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Qualcomm News

AI-Native Broadband Network Innovation Platform

Qualcomm Technologies introduces Dragonwing platforms to transform fiber, Wi-Fi 8, and fixed wireless access infrastructure into edge-computed intelligent service environments.

Read more…

12 {{ "2026-10-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-12T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

Fraunhofer IPMS introduces miniaturized Li-Fi TinySpot optical transceiver

The ultra-low-power 5 mW data link provides secure, contactless 20 Mbps communication for space-constrained industrial sensors.

Read more…

12 {{ "2026-10-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-12T00:00:00+00:00" | date "longDate" }}

Hilscher News

Hilscher introduces comX 90CN for compact industrial devices

The connector-free embedded communication module gives OEMs flexible network interface placement and multiprotocol support.

Read more…

09 {{ "2026-10-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-09T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

Power and Edge Computing Semiconductors for Industrial Infrastructure

ROHM Semiconductor will present its analog and power architectures designed to support automotive electrification, industrial automation, and artificial intelligence data centers.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Dual-Range MEMS Pressure Sensor for Altitude and Depth Measurement

STMicroelectronics introduces a compact piezoresistive sensor designed to streamline circuitry in wearable electronics by combining atmospheric and deep-water pressure monitoring.

Dual-Die Magnetic Motor Position Sensors for ASIL D By-Wire Applications

TDK introduces Micronas HAR 3025 with stray-field compensation to ensure fail-operational commutation in redundant automotive actuators.

Compact Low-Voltage eFuse ICs

Toshiba Electronic Devices and Storage Corporation introduces the TCKE5 Series of low-voltage eFuse ICs, protecting compact industrial rails and portable electronics from overcurrent and short-circuit faults.

InfiMotion highlights advanced electric drives at Paris Motor Show

The supplier powers multiple automotive brands with integrated 800V and 900V high-efficiency traction systems.

Digital Power-Path Protection for 800-Volt AI Server Architectures

Infineon Technologies introduces a control system designed to manage high-voltage direct current connections and ensure operational stability within scalable data center infrastructure.

Link Layer Retry Validation in AI Ethernet Fabrics

Keysight demonstrates multi-vendor Link Layer Retry interoperability with Broadcom and Alibaba Cloud at the 2026 OCP Global Summit for AI scale-up networking.

AI-Native Broadband Network Innovation Platform

Qualcomm Technologies introduces Dragonwing platforms to transform fiber, Wi-Fi 8, and fixed wireless access infrastructure into edge-computed intelligent service environments.

Fraunhofer IPMS introduces miniaturized Li-Fi TinySpot optical transceiver

The ultra-low-power 5 mW data link provides secure, contactless 20 Mbps communication for space-constrained industrial sensors.

Hilscher introduces comX 90CN for compact industrial devices

The connector-free embedded communication module gives OEMs flexible network interface placement and multiprotocol support.

Power and Edge Computing Semiconductors for Industrial Infrastructure

ROHM Semiconductor will present its analog and power architectures designed to support automotive electrification, industrial automation, and artificial intelligence data centers.

International