Keysight Technologies and Samsung Electronics demonstrate a standards-based satellite-to-satellite NR-NTN connection at CES 2026, validating 3GPP Release 19 band n252 for direct-to-cell services.
congatec broadens its module offering after integrating Kontron’s JUMPtec business, creating the industry’s most extensive COM-HPC, COM Express, SMARC, and Qseven portfolio.
Designed to reduce system complexity, the LDE Series supports faster installation and lower entry barriers for system integrators and AV professionals.
Spain’s Centro Español de Metrología becomes the first in Europe to deploy Mitutoyo’s LEGEX TAKUMI, setting a new benchmark for absolute coordinate measurement accuracy.
Keysight Technologies introduces a lifecycle-based software platform to analyze, validate, and monitor AI behavior in regulated environments such as automotive and industrial systems.
The new TPS4500 series from TDK addresses high-voltage industrial systems requiring configurable outputs, transformer-free three-phase operation, and digitally monitored power delivery.
Digid qualifies printed electronics technology for volume production of micrometre-scale sensors targeting robotics, medical devices, and advanced biosensing applications.
The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.
From January 6–9, in Las Vegas, SK hynix highlights expanded AI memory portfolio with new HBM4, server-oriented modules, and NAND flash solutions to support data center and AI system demands.