22
'25
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Infineon News
21
'25
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Fraunhofer News
Fraunhofer IPMS’ spatial light modulators enable high-precision applications across industries
Spatial light modulators enable high-precision light projection, material processing, and optical signal transmission, with potential applications in 3D holography, imaging, and biomedical fields.
17
'25
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Würth Elektronik News
Würth Elektronik introduces Orthosie-I & Stephano-I ESP32-C3 wireless modules
Orthosie-I, a configurable model, and Stephano-I, with pre-installed firmware, are ESP32-C3-based wireless modules supporting Wi-Fi, Bluetooth LE 5.0, with compact, flexible designs.
17
'25
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Rohm Semiconductors News
ROHM Offers the Industry’s Smallest Terahertz Wave Oscillation and Detection Devices
Price range is less than one-tenth that of conventional devices while achieving remarkable space-savings.
17
'25
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Siemens News
Siemens scales up private 5G infrastructure with expanded coverage
Siemens announced a significant update to its industrial-grade private 5G infrastructure solution, that will enable manufacturers to cover larger industrial areas with enhanced connectivity capabilities.
17
'25
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iBASE News
Industrial-grade Fanless IoT Edge Computer with USB Type-C PD 60W Support
IBASE Technology Inc. has revealed its latest fanless IoT edge computing solution, the ACS200-210.
17
'25
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U Blox News
u-blox's first Wi-Fi 7 module for superior Apple CarPlay and Android Auto user experience
Connect more concurrent users with the advanced Wi-Fi 7 capabilities of the Snapdragon Auto Connectivity Platform from Qualcomm Technologies, Inc.
16
'25
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ADLINK News
ADLINK Launches the 'DLAP Supreme' Series
Without increasing high hardware costs, the DLAP Supreme series achieves notable AI performance improvements, helping enterprises reduce the cost barriers of AI deployment.
16
'25
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Keysight technologies News
Keysight to Showcase Solutions Designed to Accelerate AI Innovation at DesignCon 2025
Demonstrations will include emulation and test solutions for electrical and optical transmissions and data center interconnect applications up to speeds of 800G and 1.6T as well as design and simulation of chiplet interconnects.
16
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Broadcom News
