26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Integrated GaN Half-Bridge Targets Compact Power Converters

STMicroelectronics introduces second-generation power IC supporting higher switching frequency and reduced external components in chargers, lighting supplies and solar inverters.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Molex News

Molex Expands RF Test Connectivity to 145 GHz

New multi-port coaxial assemblies address high-frequency characterization needs in AI hardware validation and future wireless research environments.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Kvaser AB

Secure Linux edge platform for automotive and industrial applications

Kvaser announces Kvaser Edge, an open, secure Linux‑based edge computing platform that transforms how automotive and industrial teams collect, process, and act on data.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Telit News

Telit Cinterion Adopts Formal Verification for IoT Software

Integration of TrustInSoft Analyzer into development flow strengthens software reliability for AI-enabled edge modules and 5G connectivity.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Pre-6G Interoperability Testing with Full-Stack Analysis

Keysight Technologies and Ericsson validate prototype 6G base station and device interoperability using independent multi-layer protocol analysis ahead of formal standardization.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Launches 135°C-Rated Photorelays

Toshiba introduces four voltage-driven photorelays in a compact S-VSON4T package, designed for high-temperature automotive semiconductor test and burn-in applications.

Read more…

25 {{ "2026-02-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-25T00:00:00+00:00" | date "longDate" }}

Renesas News

ADAS SoC Integrates Sensor Fusion in SUV Platform

Renesas Electronics Corporation supplies R-Car V4H to Denso for Toyota’s RAV4 TSS(LSS) control unit, enabling integrated camera, radar and driver monitoring functions.

Read more…

25 {{ "2026-02-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-25T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon presents embedded processing and sensing solutions

Next-generation microcontrollers and sensors target real-time control, connectivity and perception across automotive, industrial automation and edge AI applications.

Read more…

25 {{ "2026-02-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-25T00:00:00+00:00" | date "longDate" }}

Kontron News

Compact System-on-Module targets energy-efficient embedded platforms

Kontron Electronics expands its embedded computing portfolio with an OSM-compliant module designed for scalable edge devices, industrial automation, and connected infrastructure applications.

Read more…

25 {{ "2026-02-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-25T00:00:00+00:00" | date "longDate" }}

Synaptics News

Synaptics presents edge AI platforms at Embedded World 2026

Integrated processing and connectivity demonstrations explore local inference and wireless performance across IoT, robotics and automotive embedded systems.

Read more…

Case studies

IDS AI imaging enables automated textile recycling sorting

White Paper

Maximize Your Power System Efficiency

Integrated GaN Half-Bridge Targets Compact Power Converters

STMicroelectronics introduces second-generation power IC supporting higher switching frequency and reduced external components in chargers, lighting supplies and solar inverters.

Molex Expands RF Test Connectivity to 145 GHz

New multi-port coaxial assemblies address high-frequency characterization needs in AI hardware validation and future wireless research environments.

Secure Linux edge platform for automotive and industrial applications

Kvaser announces Kvaser Edge, an open, secure Linux‑based edge computing platform that transforms how automotive and industrial teams collect, process, and act on data.

Telit Cinterion Adopts Formal Verification for IoT Software

Integration of TrustInSoft Analyzer into development flow strengthens software reliability for AI-enabled edge modules and 5G connectivity.

Pre-6G Interoperability Testing with Full-Stack Analysis

Keysight Technologies and Ericsson validate prototype 6G base station and device interoperability using independent multi-layer protocol analysis ahead of formal standardization.

Toshiba Launches 135°C-Rated Photorelays

Toshiba introduces four voltage-driven photorelays in a compact S-VSON4T package, designed for high-temperature automotive semiconductor test and burn-in applications.

ADAS SoC Integrates Sensor Fusion in SUV Platform

Renesas Electronics Corporation supplies R-Car V4H to Denso for Toyota’s RAV4 TSS(LSS) control unit, enabling integrated camera, radar and driver monitoring functions.

Infineon presents embedded processing and sensing solutions

Next-generation microcontrollers and sensors target real-time control, connectivity and perception across automotive, industrial automation and edge AI applications.

Compact System-on-Module targets energy-efficient embedded platforms

Kontron Electronics expands its embedded computing portfolio with an OSM-compliant module designed for scalable edge devices, industrial automation, and connected infrastructure applications.

Synaptics presents edge AI platforms at Embedded World 2026

Integrated processing and connectivity demonstrations explore local inference and wireless performance across IoT, robotics and automotive embedded systems.

International