Program structures national partnerships to accelerate OSM-based Systems-on-Module development for embedded applications across industrial and medical sectors.
Intel outlines how its 5G ecosystem supports network AI inference and infrastructure evolution at Mobile World Congress 2026 in Barcelona, positioning networks for digital supply chain and next-generation connectivity demands.
Partnership with Qualcomm expands chipset integration across smartphones and connected devices to enhance performance, AI processing and system-level optimization.
Würth Elektronik has restructured its SMT spacer portfolio to lead-free alloys, ensuring long-term compliance with RoHS environmental standards and expanding automated pick-and-place options for manufacturers.
At Embedded World 2026 , Anritsu Corporation demonstrated how IoT device manufacturers use RF and signal integrity testing to improve wireless reliability and reduce redesign risks.
Ceva-Waves Wi-Fi 6 and Bluetooth Low Energy intellectual property enables Renesas to launch its first integrated combo microcontrollers for smart home and industrial applications.
Advanced RF, power consumption and high-speed signal-integrity solutions enable reliable IoT device validation from wireless connectivity to PCIe Gen6 compliance.
Intel recently introduced the Xeon 600 processor family to enhance computational density and data throughput for professional workstations in the global digital supply chain.