25 {{ "2025-04-25T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-25T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu and MVG collaborate to support IEEE 802.11be (Wi-Fi 7) OTA measurement solution

Anritsu Corporation introduces a new solution combining MVG’s multi-probe OTA test systems with its MT8862A Wireless Connectivity Test Set to enable IEEE 802.11be (Wi-Fi 7) OTA performance measurements.

Read more…

24 {{ "2025-04-24T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-24T00:00:00+00:00" | date "longDate" }}

ANSYS News

Ansys Tools Certified for TSMC 16A Process

TSMC and Ansys advance AI workflows for design and photonic optimization on COUPE, with RedHawk-SC and HFSS-IC Pro certified for advanced nodes.

Read more…

24 {{ "2025-04-24T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-24T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Simplifies Analog Design with New PIC16F17576 MCUs

Discover how Microchip's latest MCU family integrates smart analog peripherals, enabling easier capture of fluctuating signals and lowering overall system design costs.

Read more…

24 {{ "2025-04-24T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-24T00:00:00+00:00" | date "longDate" }}

Rutronik News

The OSLON Black SFH 471XB series from ams OSRAM – new at Rutronik

Rutronik is introducing the OSLON Black SFH 471XB infrared LEDs from ams OSRAM with the latest IR:6 thinfilm chip technology.

Read more…

24 {{ "2025-04-24T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-24T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Würth Elektronik expands its range of inductors to include Power Molded Flat-Wire Inductors

Würth Elektronik's WE-PMFI inductor offers ultra-compact size, low RDC (from 4.8 mΩ), up to 48 V, and -55°C to +150°C range—ideal for high-frequency DC/DC converters.

Read more…

24 {{ "2025-04-24T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-24T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK hynix Completes Customer Validation of CXL 2.0-based DDR5

New 1bnm 32Gb DDR5 modules reduce expenses and enhance speed, with customer validation underway, delivering unmatched value through "Optimal Innovation.

Read more…

24 {{ "2025-04-24T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-24T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu expands analysis bandwidth to 150 MHz

A new software option expands the analysis bandwidth to 150 MHz enabling the widest capture range in any handheld instrument.

Read more…

23 {{ "2025-04-23T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-23T00:00:00+00:00" | date "longDate" }}

Yamaha Motor News

Yamaha boosts YRi-V AOI productivity with 3D component update

Convenient new feature instantly applies new inspection settings without system restart, enabling continuous optimisation and non-stop productivity.

Read more…

23 {{ "2025-04-23T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-23T00:00:00+00:00" | date "longDate" }}

TDK News

TDK presents HVC50 for high-power systems with up to 750 A at 1500 V

TDK’s HVC50 high-voltage DC contactor connects/disconnects 1500 V lithium-ion batteries in ESS, MCS, and traction, supporting the shift to an all-electric, low-carbon society.

Read more…

23 {{ "2025-04-23T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-23T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

High-Voltage CMOS Backplane for Very Bright OLED Microdisplays

Fraunhofer IPMS presents a new high-voltage CMOS backplane for especially bright, long-lasting microdisplays with stacked OLEDs at SID Display Week 2025.

Read more…

Case studies

Optimizing Wafer and Die Inspections

White Paper

Delta Electronics: Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

Anritsu and MVG collaborate to support IEEE 802.11be (Wi-Fi 7) OTA measurement solution

Anritsu Corporation introduces a new solution combining MVG’s multi-probe OTA test systems with its MT8862A Wireless Connectivity Test Set to enable IEEE 802.11be (Wi-Fi 7) OTA performance measurements.

Ansys Tools Certified for TSMC 16A Process

TSMC and Ansys advance AI workflows for design and photonic optimization on COUPE, with RedHawk-SC and HFSS-IC Pro certified for advanced nodes.

Microchip Simplifies Analog Design with New PIC16F17576 MCUs

Discover how Microchip's latest MCU family integrates smart analog peripherals, enabling easier capture of fluctuating signals and lowering overall system design costs.

The OSLON Black SFH 471XB series from ams OSRAM – new at Rutronik

Rutronik is introducing the OSLON Black SFH 471XB infrared LEDs from ams OSRAM with the latest IR:6 thinfilm chip technology.

Würth Elektronik expands its range of inductors to include Power Molded Flat-Wire Inductors

Würth Elektronik's WE-PMFI inductor offers ultra-compact size, low RDC (from 4.8 mΩ), up to 48 V, and -55°C to +150°C range—ideal for high-frequency DC/DC converters.

SK hynix Completes Customer Validation of CXL 2.0-based DDR5

New 1bnm 32Gb DDR5 modules reduce expenses and enhance speed, with customer validation underway, delivering unmatched value through "Optimal Innovation.

Anritsu expands analysis bandwidth to 150 MHz

A new software option expands the analysis bandwidth to 150 MHz enabling the widest capture range in any handheld instrument.

Yamaha boosts YRi-V AOI productivity with 3D component update

Convenient new feature instantly applies new inspection settings without system restart, enabling continuous optimisation and non-stop productivity.

TDK presents HVC50 for high-power systems with up to 750 A at 1500 V

TDK’s HVC50 high-voltage DC contactor connects/disconnects 1500 V lithium-ion batteries in ESS, MCS, and traction, supporting the shift to an all-electric, low-carbon society.

High-Voltage CMOS Backplane for Very Bright OLED Microdisplays

Fraunhofer IPMS presents a new high-voltage CMOS backplane for especially bright, long-lasting microdisplays with stacked OLEDs at SID Display Week 2025.

International

Case studies

White Paper

Anritsu Corporation introduces a new solution combining MVG’s multi-probe OTA test systems with its MT8862A Wireless Connectivity Test Set to enable IEEE 802.11be (Wi-Fi 7) OTA performance measurements.

TSMC and Ansys advance AI workflows for design and photonic optimization on COUPE, with RedHawk-SC and HFSS-IC Pro certified for advanced nodes.

Discover how Microchip's latest MCU family integrates smart analog peripherals, enabling easier capture of fluctuating signals and lowering overall system design costs.

Rutronik is introducing the OSLON Black SFH 471XB infrared LEDs from ams OSRAM with the latest IR:6 thinfilm chip technology.

Würth Elektronik's WE-PMFI inductor offers ultra-compact size, low RDC (from 4.8 mΩ), up to 48 V, and -55°C to +150°C range—ideal for high-frequency DC/DC converters.

New 1bnm 32Gb DDR5 modules reduce expenses and enhance speed, with customer validation underway, delivering unmatched value through "Optimal Innovation.

A new software option expands the analysis bandwidth to 150 MHz enabling the widest capture range in any handheld instrument.

Convenient new feature instantly applies new inspection settings without system restart, enabling continuous optimisation and non-stop productivity.

TDK’s HVC50 high-voltage DC contactor connects/disconnects 1500 V lithium-ion batteries in ESS, MCS, and traction, supporting the shift to an all-electric, low-carbon society.

Fraunhofer IPMS presents a new high-voltage CMOS backplane for especially bright, long-lasting microdisplays with stacked OLEDs at SID Display Week 2025.

International

Würth Elektronik's WE-PMFI inductor offers ultra-compact size, low RDC (from 4.8 mΩ), up to 48 V, and -55°C to +150°C range—ideal for high-frequency DC/DC converters.