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IDS Imaging Development Systems GmbH
21
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ASMPT News
ASMPT introduces the SIPLACE V platform, redefining high-performance SMT placement
Up to 30% higher output with maximum flexibility, compact footprint, and long-term investment protection.
20
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TDK News
High-Temperature DC Link Capacitors for Power Electronics
New ModCap UHP series from TDK Corporation enables continuous high-current performance in demanding converter environments.
20
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Infineon News
Infineon targets secure USB 2.0 peripheral controllers
Designed for USB Hi-Speed peripherals, the new controller adds security hardware, DMA support, and large on-chip buffering for data-intensive devices.
20
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Microchip News
PolarFire FPGA Video Ecosystem Enhances High-Bandwidth Embedded Vision Designs
Expansion of PolarFire FPGA smart embedded video ecosystem by Microchip Technology supports low-power, high-resolution video connectivity for medical, industrial and robotic vision systems.
20
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Toshiba News
Toshiba and MIKROE introduce motor driving board
In collaboration MIKROE, Toshiba Corporation introduces a motor driving board to simplify early-stage automotive system design and support engineers working within the automotive data ecosystem.
19
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TDK News
Automotive ESD Protection Enables High-Density PCB Design
Tier-1 automotive suppliers adopt compact chip varistors to protect communication lines while reducing PCB space and cost.
19
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Keysight technologies News
Keysight adds AI modeling toolkit for faster PDK development
The new software module automates parameter extraction for compact device models, supporting DTCO workflows for advanced-node, RF and power semiconductors.
19
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Powell Electronics News
AcceleRate mP 0.635 mm Pitch Connectors Now Available from Powell
High-density Samtec interconnects support 64 Gbps PAM4 for AI, HPC, and advanced datacom.
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STMicroelectronics News
