Siemens integrates generative and agentic AI across its EDA portfolio, enhancing productivity and accelerating chip/PCB design and verification through NVIDIA microservices.
The D-Bot MAR, developed and assembled in Germany, handles payloads of up to 500 kg with a lift height of 55 mm, ideal for European pallets and materials handling applications.
ADLINK expands its 3.5” SBC portfolio with AI-ready SBC35-MTL and rugged SBC35-ASL, offering flexible I/O via SBC-FM modules for diverse edge applications.
Toshiba introduces new AEC-Q100 compliant 2-channel automotive standard digital isolators, enhancing safety and reliability for HEV/EV on-board chargers.