Melexis has announced that Leapers Semiconductor is integrating the Melexis MLX91299 silicon-based RC snubber into its next-generation power modules, strengthening performance and reliability for automotive and energy applications.
RANsemi Limited and Radisys Corporation have announced an expanded collaboration to deliver secure, resilient, and rapidly deployable 5G systems for tactical and mission-critical communications.
Leuze expands its portfolio with the DCR 100i series, a compact code reader designed for reliable 1D, 2D and DPM code detection across variable working distances and high process speeds.
IDS strengthens its market position with double-digit growth targets, an expanded product roadmap in AI, 3D and monitoring cameras, and a new three-year manufacturer’s warranty.
NVIDIA’s BioNeMo platform is being adopted by pharmaceutical companies and research organizations to integrate AI models, laboratory data and automation for scalable, data-driven drug discovery.
A new IoT solution combining NXP's i.MX processors and connectivity to streamline design and accelerate smarter, industrial-grade edge device development.
A manufacturing and packaging collaboration in India targets automotive-grade power devices and aims to strengthen a region-based semiconductor supply chain.
A new single-chip connectivity platform targets low-power IoT deployments by combining 20 MHz Wi-Fi 7, multi-protocol support, and robust operation in congested wireless environments.