27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

High-Fidelity Emulation Advances AI-Native Networks

Keysight Technologies presents agentic AI, digital twins and network emulation at Mobile World Congress 2026 to validate 5G-Advanced, 6G and non-terrestrial network performance.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

TDK News

350 V AC X2 Capacitors for EMI Suppression

TDK Corporation expands its X2 safety film capacitor portfolio with the B3292xU/V series, targeting compact EMI suppression in industrial drives and automotive power electronics.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Phytec News

PHYTEC Expands Modular SoM Portfolio for Secure Embedded Systems

New processor options and Ubuntu Pro support target scalable performance, cybersecurity compliance and faster development across industrial and vision applications.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Ventiva News

Zoned Airflow Cooling Targets Embedded AI Hotspots

Ventiva proposes distributed thermal architecture using ionic airflow to manage localized heat in compact edge computing systems.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Integrated GaN Half-Bridge Targets Compact Power Converters

STMicroelectronics introduces second-generation power IC supporting higher switching frequency and reduced external components in chargers, lighting supplies and solar inverters.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Molex News

Molex Expands RF Test Connectivity to 145 GHz

New multi-port coaxial assemblies address high-frequency characterization needs in AI hardware validation and future wireless research environments.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Kvaser AB

Secure Linux edge platform for automotive and industrial applications

Kvaser announces Kvaser Edge, an open, secure Linux‑based edge computing platform that transforms how automotive and industrial teams collect, process, and act on data.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Telit News

Telit Cinterion Adopts Formal Verification for IoT Software

Integration of TrustInSoft Analyzer into development flow strengthens software reliability for AI-enabled edge modules and 5G connectivity.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Pre-6G Interoperability Testing with Full-Stack Analysis

Keysight Technologies and Ericsson validate prototype 6G base station and device interoperability using independent multi-layer protocol analysis ahead of formal standardization.

Read more…

26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-26T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Launches 135°C-Rated Photorelays

Toshiba introduces four voltage-driven photorelays in a compact S-VSON4T package, designed for high-temperature automotive semiconductor test and burn-in applications.

Read more…

Technical Articles

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White Paper

Maximize Your Power System Efficiency

High-Fidelity Emulation Advances AI-Native Networks

Keysight Technologies presents agentic AI, digital twins and network emulation at Mobile World Congress 2026 to validate 5G-Advanced, 6G and non-terrestrial network performance.

350 V AC X2 Capacitors for EMI Suppression

TDK Corporation expands its X2 safety film capacitor portfolio with the B3292xU/V series, targeting compact EMI suppression in industrial drives and automotive power electronics.

PHYTEC Expands Modular SoM Portfolio for Secure Embedded Systems

New processor options and Ubuntu Pro support target scalable performance, cybersecurity compliance and faster development across industrial and vision applications.

Zoned Airflow Cooling Targets Embedded AI Hotspots

Ventiva proposes distributed thermal architecture using ionic airflow to manage localized heat in compact edge computing systems.

Integrated GaN Half-Bridge Targets Compact Power Converters

STMicroelectronics introduces second-generation power IC supporting higher switching frequency and reduced external components in chargers, lighting supplies and solar inverters.

Molex Expands RF Test Connectivity to 145 GHz

New multi-port coaxial assemblies address high-frequency characterization needs in AI hardware validation and future wireless research environments.

Secure Linux edge platform for automotive and industrial applications

Kvaser announces Kvaser Edge, an open, secure Linux‑based edge computing platform that transforms how automotive and industrial teams collect, process, and act on data.

Telit Cinterion Adopts Formal Verification for IoT Software

Integration of TrustInSoft Analyzer into development flow strengthens software reliability for AI-enabled edge modules and 5G connectivity.

Pre-6G Interoperability Testing with Full-Stack Analysis

Keysight Technologies and Ericsson validate prototype 6G base station and device interoperability using independent multi-layer protocol analysis ahead of formal standardization.

Toshiba Launches 135°C-Rated Photorelays

Toshiba introduces four voltage-driven photorelays in a compact S-VSON4T package, designed for high-temperature automotive semiconductor test and burn-in applications.

International