18 {{ "2025-09-18T00:00:00+00:00" | date "MMM" }} '25

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Grinn News

Grinn Partners with MediaTek to Launch World’s Smallest Genio-Based SOMs

New GenioSOM-700 and GenioSOM-510 deliver high-performance AI, vision, and IoT capabilities, backed by privileged access to MediaTek’s products, roadmaps, and technical support.

Read more…

17 {{ "2025-09-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-17T00:00:00+00:00" | date "longDate" }}

iBASE News

IBASE Launches RISC-Based SBC for Low-Power AIoT Edge Computing

IBASE's IBR500 SBC utilizes MediaTek Genio 700/510 processors to deliver 3.2 TOPS AI performance in a compact 3.5” form factor for edge AIoT deployments.

Read more…

17 {{ "2025-09-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-17T00:00:00+00:00" | date "longDate" }}

Telit News

Telit Cinterion Unveils Module for Reliable Location with Dead Reckoning

The SE869EK5-DR offers reliable, uninterrupted location data with Untethered Dead Reckoning, ideal for fleet management, automotive telematics, and asset tracking in mission-critical applications.

Read more…

17 {{ "2025-09-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-17T00:00:00+00:00" | date "longDate" }}

Mediatek News

MediaTek develops chip using TSMC's 2nm process

Compared to the N3E process, N2P offers an 18% performance increase at the same power, a 36% power reduction, and a 1.2x increase in logic density.

Read more…

17 {{ "2025-09-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-17T00:00:00+00:00" | date "longDate" }}

Siemens News

Siemens launches Tessent AnalogTest, automating IC analog test generation

Siemens’ Tessent AnalogTest reduces analog circuit test generation from months to days, achieving >95% defect coverage and 100x faster testing.

Read more…

17 {{ "2025-09-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-17T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu to Showcase Multi-Core Fiber OTDR Solution at ECOC 2025

Anritsu's multi-channel OTDR solution for weakly coupled multi-core fiber visualizes crosstalk and loss to optimize next-gen optical communications infrastructure.

Read more…

17 {{ "2025-09-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-17T00:00:00+00:00" | date "longDate" }}

TDK News

TDK launches 1200W CUS-M AC-DC power supplies for critical applications

TDK expands CUS-M series with 1200W models, offering 95.5% efficiency, compact 187×93×42.5 mm size, medical-grade safety certifications, and ultra-low noise.

Read more…

17 {{ "2025-09-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-17T00:00:00+00:00" | date "longDate" }}

Teledyne SP Devices

High-Speed Data Acquisition Made Simple: Introducing the ADQ3-USB Digitizer Series

Teledyne SP Devices has expanded its 12-bit ADQ3-series digitizer lineup with a powerful new addition: the ADQ3-USB.

Read more…

17 {{ "2025-09-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-17T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

Enhanced thermal performance, reduced inductance, and 2.3x higher power density with flexible half-bridge and common-source topologies for next-generation PV inverters, UPS, and multi-level power circuits.

Read more…

15 {{ "2025-09-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-15T00:00:00+00:00" | date "longDate" }}

Pickering Electronics News

Pickering Showcases High Voltage Reed Relays at electronica India 2025

Pickering Electronics will showcase its customizable Series 600 high voltage reed relays for instrumentation, ATE, and semiconductor testing at electronica India in Bengaluru from September 17 to 19, 2025.

Read more…

Technical Articles

Leuze Technology Report Supercaps: Energy meets efficiency

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

Grinn Partners with MediaTek to Launch World’s Smallest Genio-Based SOMs

New GenioSOM-700 and GenioSOM-510 deliver high-performance AI, vision, and IoT capabilities, backed by privileged access to MediaTek’s products, roadmaps, and technical support.

IBASE Launches RISC-Based SBC for Low-Power AIoT Edge Computing

IBASE's IBR500 SBC utilizes MediaTek Genio 700/510 processors to deliver 3.2 TOPS AI performance in a compact 3.5” form factor for edge AIoT deployments.

Telit Cinterion Unveils Module for Reliable Location with Dead Reckoning

The SE869EK5-DR offers reliable, uninterrupted location data with Untethered Dead Reckoning, ideal for fleet management, automotive telematics, and asset tracking in mission-critical applications.

MediaTek develops chip using TSMC's 2nm process

Compared to the N3E process, N2P offers an 18% performance increase at the same power, a 36% power reduction, and a 1.2x increase in logic density.

Siemens launches Tessent AnalogTest, automating IC analog test generation

Siemens’ Tessent AnalogTest reduces analog circuit test generation from months to days, achieving >95% defect coverage and 100x faster testing.

Anritsu to Showcase Multi-Core Fiber OTDR Solution at ECOC 2025

Anritsu's multi-channel OTDR solution for weakly coupled multi-core fiber visualizes crosstalk and loss to optimize next-gen optical communications infrastructure.

TDK launches 1200W CUS-M AC-DC power supplies for critical applications

TDK expands CUS-M series with 1200W models, offering 95.5% efficiency, compact 187×93×42.5 mm size, medical-grade safety certifications, and ultra-low noise.

High-Speed Data Acquisition Made Simple: Introducing the ADQ3-USB Digitizer Series

Teledyne SP Devices has expanded its 12-bit ADQ3-series digitizer lineup with a powerful new addition: the ADQ3-USB.

ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

Enhanced thermal performance, reduced inductance, and 2.3x higher power density with flexible half-bridge and common-source topologies for next-generation PV inverters, UPS, and multi-level power circuits.

Pickering Showcases High Voltage Reed Relays at electronica India 2025

Pickering Electronics will showcase its customizable Series 600 high voltage reed relays for instrumentation, ATE, and semiconductor testing at electronica India in Bengaluru from September 17 to 19, 2025.

International