The "COREnect" (European Core Technologies for future connectivity systems and components) consortium is glad to announce that its project has been selected by the European Commission in the frame of the Horizon 2020 Research & Innovation programme.
The primary and secondary packaging of confectionery and baked goods can be challenging: The new DRT 25C dynamic reference diffuse sensor from Leuze solves precisely this problem in an innovative and reliable way: with unique reference technology and three light spots.
Samsung Electro-Mechanics (SEMCO), a subsidiary of the Samsung Group with headquarter in South Korea, is one of the leading suppliers of passive components. The expansion of the partnership with the Rutronik Elektronische Bauelemente GmbH in North America represents a strategic milestone for both partners for the further development of the global market presence of SEMCO ceramic capacitors in the automotive sector.
NXP Semiconductors N.V. announced that its Wi-Fi® and Wi-Fi/Bluetooth® combos and i.MX RT Crossover MCUs are now supported within its MCUXpresso software, which dramatically simplifies product development.