When you think of asset management, what image first comes to mind? A pallet? A box? In reality, IoT asset management technologies are used for so much more than tracking goods through manufacturing and supply chain.
NXP Semiconductors N.V. (NASDAQ: NXPI), a world leader in automotive processing, and TSMC (TWSE: 2330, NYSE: TSM) today announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology.
Telit, a global enabler of the Internet of Things (IoT), today announced an expansion of its partnership with Hi-Mix Eletrônicos S/A, an Electronic Manufacturing Service (EMS) provider in Brazil, to include production of LTE modules.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Metalenz Inc., the pioneer in meta-surface design and commercialization, today announced a co-development and license agreement that will see ST develop manufacturing processes for Metalenz’s meta-optics technology for next-generation smartphones, consumer devices, healthcare, and automotive applications.
Siemens today announced that the newest version of its Nucleus ReadyStart software for Arm®-based devices has been updated to provide enhanced support for the Arm Cortex® family of processors.
Today at the TSMC 2021 Online Technology Symposium, Siemens Digital Industries Software announced that its Calibre® nmPlatform tools and Analog FastSPICE platform are now both qualified for TSMC’s advanced N3 and N4 processes.
ROHM Co., Ltd. (Head Office: Kyoto City) has announced the formulation of its Medium-Term Management Plan ‘MOVING FORWARD to 2025’ in order to accelerate social contribution through business activities based on its Company Mission and Management Vision.