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Nexcom News
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Renesas News
Renesas Extends Support for Microsoft Azure RTOS Across 32-bit MCU Families with Simple Licensing for Secure Embedded IoT Development
Azure RTOS Components Integrated into Renesas RA Flexible Software Package, Renesas Synergy Software Platform, and Easily Accessible via Renesas RX’s Smart Configurator.
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Fraunhofer News
Curtain up: Fraunhofer and IBM to unveil quantum computer
In the digital presence of Chancellor Dr. Angela Merkel, Federal Minister of Education and Research Anja Karliczek and Minister-President of Baden-Württemberg Winfried Kretschmann, on June 15 leading figures from Fraunhofer and IBM will officially unveil Germany’s first IBM Quantum System One to the public. With 27 qubits, this is currently the most powerful system anywhere in Europe.
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Beijer Electronics Products AB News
Supercharge your EV business with complete display and data communication solutions
Electric vehicles help us reach our climate goals.
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Thales News
THALES LAUNCHES NEW LINE OF SATELLITE COMMUNICATIONS SOLUTIONS TO ENSURE RELIABLE CONNECTIVITY WORLDWIDE ON IRIDIUM CERTUS®
Thales announces the launch of its new ThalesLINK product line of L-band solutions – MissionLINK 200 and VesseLINK 200.
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ST News
STMicroelectronics Introduces Cost-Efficient NFC Transceiver Enabling New Application Areas and Easing Customer Interaction
The ST25R3918 from STMicroelectronics is a multi-purpose NFC transceiver supporting passive peer-to-peer functionality and NFC card-emulation mode as well as NFC reader operation.
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ST News
STMicroelectronics Delivers First Stellar Advanced Automotive Microcontrollers for New Road-Car Projects
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has begun delivering the first Stellar SR6 automotive microcontrollers (MCUs) for automotive-industry leaders to realize the next generation of advanced vehicle electronics that deliver new levels of performance and safety.
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ANSYS News
Ansys Multiphysics Solutions Achieve Certification for TSMC’s N3 and N4 Process Technologies
Ansys extends collaboration with TSMC to deliver sophisticated power integrity and electromigration signoff solutions for advanced applications.
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Siemens digital Industry Software News
Siemens announces new JEDEC industry standard for electronics cooling simulation
New JEP181 standard, proposed and chaired by Siemens, simplifies exchange of simulation data for thermal digital twins of electronic devices.
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TDK News
