20 {{ "2024-05-20T00:00:00+00:00" | date "MMM" }} '24

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Softing Industrial Automation GmbH

Softing Industrial introduced edgeGate - a hardware gateway for industrial edge and cloud applications

Softing Industrial presented its new edgeGate a maintenance-free hardware solution for transferring production data from PLC and CNC controllers to edge and cloud-based environments.

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20 {{ "2024-05-20T00:00:00+00:00" | date "MMM" }} '24

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Cortec News

Three Easy Ways to Clean/Protect Sensitive Electronics

Cortec^® offers three easy ways to do so without harming sensitive components.

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20 {{ "2024-05-20T00:00:00+00:00" | date "MMM" }} '24

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Iwave Systems News

A Modular SoM Powered by the Advanced i.MX 95 Applications Processor from NXP

iWave is excited to announce the launch of the iW-RainboW-G61M System on Module, powered by NXP^® Semiconductors i.MX 95 applications processor. Built on the SMARC v2.1.1 standard, the SoM provides product designers with scalability and modularity.

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20 {{ "2024-05-20T00:00:00+00:00" | date "MMM" }} '24

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Toshiba News

TOSHIBA RELEASES PHOTOCOUPLERS FOR SPEED-CHALLENGED APPLICATIONS

New devices offer high performance for slow input signals and slow startup power supplies.

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17 {{ "2024-05-17T00:00:00+00:00" | date "MMM" }} '24

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Nvidia News

NVIDIA Accelerates Quantum Computing Centers Worldwide With CUDA-Q Platform

Supercomputers in Germany, Japan, and Poland Incorporate Grace-Hopper and Quantum-Classical Accelerated Supercomputing Platform to Advance Quantum Computing Research.

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17 {{ "2024-05-17T00:00:00+00:00" | date "MMM" }} '24

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SemiQ News

SemiQ to Unveil High-Performance 1200V Half-Bridge Modules in S3 Package at PCIM Europe 2024

SemiQ will showcase its latest SiC power solutions and recently launched Known-Good-Die (KGD) screening process at PCIM Europe 2024 in Nuremberg from June 11-13, 2024.

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16 {{ "2024-05-16T00:00:00+00:00" | date "MMM" }} '24

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Rohm Semiconductors News

ROHM at PCIM Europe 2024: Empowering Growth, Inspiring Innovation

ROHM showcases its new power semiconductor solutions at PCIM Europe, a leading power electronics trade fair in Nuremberg, Germany (June 11th – 13th), focusing on wide bandgap devices.

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16 {{ "2024-05-16T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-16T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness

Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

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16 {{ "2024-05-16T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-16T00:00:00+00:00" | date "longDate" }}

Siemens News

Siemens and Foxconn team up to optimize forward-thinking manufacturing

Siemens and Foxconn sign a memorandum of understanding highlighting joint commitment to sustainability.

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16 {{ "2024-05-16T00:00:00+00:00" | date "MMM" }} '24

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Toshiba News

TOSHIBA SUCCESSFULLY DEMONSTRATES NEARLINE HDDS WITH MASSIVE CAPACITY OF OVER 30 TERABYTES

The demonstration drives represent a major milestone in the advance towards commercial products based on each of these emerging recording formats.

Read more…

Softing Industrial presented its new edgeGate a maintenance-free hardware solution for transferring production data from PLC and CNC controllers to edge and cloud-based environments.

Cortec® offers three easy ways to do so without harming sensitive components.

iWave is excited to announce the launch of the iW-RainboW-G61M System on Module, powered by NXP® Semiconductors i.MX 95 applications processor. Built on the SMARC v2.1.1 standard, the SoM provides product designers with scalability and modularity.

New devices offer high performance for slow input signals and slow startup power supplies.

Supercomputers in Germany, Japan, and Poland Incorporate Grace-Hopper and Quantum-Classical Accelerated Supercomputing Platform to Advance Quantum Computing Research.

SemiQ will showcase its latest SiC power solutions and recently launched Known-Good-Die (KGD) screening process at PCIM Europe 2024 in Nuremberg from June 11-13, 2024.

ROHM showcases its new power semiconductor solutions at PCIM Europe, a leading power electronics trade fair in Nuremberg, Germany (June 11th – 13th), focusing on wide bandgap devices.

Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

Siemens and Foxconn sign a memorandum of understanding highlighting joint commitment to sustainability.

The demonstration drives represent a major milestone in the advance towards commercial products based on each of these emerging recording formats.

International

Cortec^® offers three easy ways to do so without harming sensitive components.

iWave is excited to announce the launch of the iW-RainboW-G61M System on Module, powered by NXP^® Semiconductors i.MX 95 applications processor. Built on the SMARC v2.1.1 standard, the SoM provides product designers with scalability and modularity.