19 {{ "2024-09-19T00:00:00+00:00" | date "MMM" }} '24

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Keysight technologies News

Keysight Introduces Quantum Circuit Simulation

Google Quantum AI, Keysight joined forces in the First Circuit Environment with Frequency-Domain Flux Quantization.

Read more…

19 {{ "2024-09-19T00:00:00+00:00" | date "MMM" }} '24

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Alphawave Semi News

Alphawave Semi to Showcase Latest Advances in AI Connectivity IP at ECOC 2024

Demonstrations highlighting leadership in PCIe over Optics, Ethernet, PCIe and UCIe SerDes on 3nm TSMC CoWoS packaging. Dr. Tony Chan Carusone to present workshop on I/O for AI clusters.

Read more…

19 {{ "2024-09-19T00:00:00+00:00" | date "MMM" }} '24

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Powell Electronics News

Powell Electronics showcases the latest high-reliability connector and sensor solutions from Honeywell, Cinch, Amphenol, Adam Tech, and Powell Agricultural Solutions

At the Engineering Design Show (EDS) in Coventry on the 9th and 10th October 2024, Powell Electronics will be showing the latest product solutions from some if its key franchises.

Read more…

19 {{ "2024-09-19T00:00:00+00:00" | date "MMM" }} '24

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Enocean News

New EnOcean radio transceivers for a quantum leap in performance and efficiency

TCM 600 and TCM 615 mark a milestone for sustainable, wireless connectivity.

Read more…

19 {{ "2024-09-19T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-19T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

IDS Showcases Groundbreaking 2D, 3D, and AI-Based Vision Systems at SPS 2024 in Nuremberg, Germany

Innovative Industrial Cameras for Robotics and Process Automation to Take Center Stage at Stand 6-360.

Read more…

18 {{ "2024-09-18T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-18T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics Launches First FIPS 140-3 Certified TPMs for Computing and Embedded Systems

State-of-the-art protection certified to latest standard for information security certification, globally recognized and mandatory for US federal procurement.

Read more…

18 {{ "2024-09-18T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-18T00:00:00+00:00" | date "longDate" }}

TDK News

TDK presents PoDL daughter cards for Analog Devices’ SPE evaluation boards

TDK Corporation announces a series of 10BASE-T1L plug-and-play test boards, called EVB-DLA-00x.

Read more…

18 {{ "2024-09-18T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-18T00:00:00+00:00" | date "longDate" }}

Congatec News

Compact module delivers 39 TOPS AI performance

congatec presents new COM Express Compact modules with AMD Ryzen Embedded 8000 Series for high-performance AI applications at the edge.

Read more…

17 {{ "2024-09-17T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-17T00:00:00+00:00" | date "longDate" }}

Intel News

Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing

Intel to Produce Custom AI Fabric Chip on Intel 18A and Custom Xeon 6 Chip on Intel 3 for AWS; Multi-Year, Multi-Billion-Dollar Collaboration Accelerates Development of Chip Manufacturing in Ohio.

Read more…

17 {{ "2024-09-17T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-17T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon introduces the XENSIV™ PAS CO2 5V sensor for higher energy efficiency and improved air quality in buildings

In order to further drive decarbonization, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

Keysight Introduces Quantum Circuit Simulation

Google Quantum AI, Keysight joined forces in the First Circuit Environment with Frequency-Domain Flux Quantization.

Alphawave Semi to Showcase Latest Advances in AI Connectivity IP at ECOC 2024

Demonstrations highlighting leadership in PCIe over Optics, Ethernet, PCIe and UCIe SerDes on 3nm TSMC CoWoS packaging. Dr. Tony Chan Carusone to present workshop on I/O for AI clusters.

Powell Electronics showcases the latest high-reliability connector and sensor solutions from Honeywell, Cinch, Amphenol, Adam Tech, and Powell Agricultural Solutions

At the Engineering Design Show (EDS) in Coventry on the 9th and 10th October 2024, Powell Electronics will be showing the latest product solutions from some if its key franchises.

New EnOcean radio transceivers for a quantum leap in performance and efficiency

TCM 600 and TCM 615 mark a milestone for sustainable, wireless connectivity.

IDS Showcases Groundbreaking 2D, 3D, and AI-Based Vision Systems at SPS 2024 in Nuremberg, Germany

Innovative Industrial Cameras for Robotics and Process Automation to Take Center Stage at Stand 6-360.

STMicroelectronics Launches First FIPS 140-3 Certified TPMs for Computing and Embedded Systems

State-of-the-art protection certified to latest standard for information security certification, globally recognized and mandatory for US federal procurement.

TDK presents PoDL daughter cards for Analog Devices’ SPE evaluation boards

TDK Corporation announces a series of 10BASE-T1L plug-and-play test boards, called EVB-DLA-00x.

Compact module delivers 39 TOPS AI performance

congatec presents new COM Express Compact modules with AMD Ryzen Embedded 8000 Series for high-performance AI applications at the edge.

Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing

Intel to Produce Custom AI Fabric Chip on Intel 18A and Custom Xeon 6 Chip on Intel 3 for AWS; Multi-Year, Multi-Billion-Dollar Collaboration Accelerates Development of Chip Manufacturing in Ohio.

Infineon introduces the XENSIV™ PAS CO2 5V sensor for higher energy efficiency and improved air quality in buildings

In order to further drive decarbonization, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions.

International