14 {{ "2024-05-14T00:00:00+00:00" | date "MMM" }} '24

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ARROW News

Arrow Electronics Signs EMEA Distribution Agreement with The Things Industries to Deliver LoRaWAN Device Design Solutions

Breaking down the complexities of LoRaWAN development to reduce time-to-market for IoT projects and lower total cost of ownership.

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14 {{ "2024-05-14T00:00:00+00:00" | date "MMM" }} '24

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Mouser News

Mouser Electronics to Exhibit at Multiple EMEA Trade Shows in Spring 2024

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, will inspire innovation at several EMEA trade shows in May 2024. Attendees will have the opportunity to meet with the Mouser team and take part in a host of exciting engineering activities.

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13 {{ "2024-05-13T00:00:00+00:00" | date "MMM" }} '24

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PEPPERL+FUCHS FACTORY AUTOMATION

New UHF RFID Reader from Pepperl+Fuchs Enables Transparent Flow of Goods

Efficient Detection of Packages and Load Carriers in Logistics.

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13 {{ "2024-05-13T00:00:00+00:00" | date "MMM" }} '24

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Vishay News

Vishay Intertechnology Space-Grade Planar Transformers Offer Lower Cost, Smaller Size, and Higher Density Than Traditional Planar Devices

Featuring a Unique Winding Structure and Building Technique, Customizable Devices Are Qualified to MIL-STD-981 Class S Standard.

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10 {{ "2024-05-10T00:00:00+00:00" | date "MMM" }} '24

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Micron News

Micron Delivers Crucial LPCAMM2 with LPDDR5X Memory for the New AI-Ready Lenovo ThinkPad P1 Gen 7 Workstation

Groundbreaking upgradeable laptop memory form factor reduces power consumption while delivering 1.3 times faster performance over DDR5 SODIMM memory.

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09 {{ "2024-05-09T00:00:00+00:00" | date "MMM" }} '24

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Samsung News

Leading Memory Innovation with HBM3E

Samsung is leading the pack with its latest 5th generation high bandwidth memory device.

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09 {{ "2024-05-09T00:00:00+00:00" | date "MMM" }} '24

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Melexis News

MELEXIS INTRODUCES MLX90427 POSITION SENSING FOR STEER-BY-WIRE

This product has been specifically engineered to meet the current and future technical requirements of the automotive industry.

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08 {{ "2024-05-08T00:00:00+00:00" | date "MMM" }} '24

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Qualcomm News

Qualcomm Accelerates Development for Copilot+ PCs with Snapdragon Dev Kit for Windows

The Snapdragon Dev Kit for Windows, powered by Snapdragon X Elite, is a compact-form-factor PC designed for Windows developers to take advantage of the next-gen AI PC capabilities of Snapdragon.

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08 {{ "2024-05-08T00:00:00+00:00" | date "MMM" }} '24

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Bourns News

Bourns TLVR Inductors Deliver Extremely High Current Capabilities to Match Today’s Data-Driven Application Performance Demands

Engineered with a dual-winding structure and low inductance, the Bourns^® Model TLVR1005T and TLVR1105T Series provides fast transient response.

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08 {{ "2024-05-08T00:00:00+00:00" | date "MMM" }} '24

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Mediatek News

MediaTek Boosts Flagship Smartphone Performance with Dimensity 9300+ SoC

New chip speeds up generative AI processing at the edge to run LLMs faster.

Read more…

Breaking down the complexities of LoRaWAN development to reduce time-to-market for IoT projects and lower total cost of ownership.

Efficient Detection of Packages and Load Carriers in Logistics.

Featuring a Unique Winding Structure and Building Technique, Customizable Devices Are Qualified to MIL-STD-981 Class S Standard.

Groundbreaking upgradeable laptop memory form factor reduces power consumption while delivering 1.3 times faster performance over DDR5 SODIMM memory.

Samsung is leading the pack with its latest 5th generation high bandwidth memory device.

This product has been specifically engineered to meet the current and future technical requirements of the automotive industry.

The Snapdragon Dev Kit for Windows, powered by Snapdragon X Elite, is a compact-form-factor PC designed for Windows developers to take advantage of the next-gen AI PC capabilities of Snapdragon.

Engineered with a dual-winding structure and low inductance, the Bourns® Model TLVR1005T and TLVR1105T Series provides fast transient response.

New chip speeds up generative AI processing at the edge to run LLMs faster.

International

Engineered with a dual-winding structure and low inductance, the Bourns^® Model TLVR1005T and TLVR1105T Series provides fast transient response.